METHODS, APPARATUS AND SYSTEM FOR SCREENING PROCESS SPLITS FOR TECHNOLOGY DEVELOPMENT
    2.
    发明申请
    METHODS, APPARATUS AND SYSTEM FOR SCREENING PROCESS SPLITS FOR TECHNOLOGY DEVELOPMENT 有权
    用于筛选技术开发过程分析的方法,装置和系统

    公开(公告)号:US20150346271A1

    公开(公告)日:2015-12-03

    申请号:US14288278

    申请日:2014-05-27

    Abstract: At least one method and system disclosed herein involves performing a time-dependent dielectric breakdown (TDDB) test and a bias temperature instability (BTI) test on a device. A device having at least one transistor and at least one dielectric layer is provided. A test signal is provided for performing a TDDB test and a BTI test on the device. The TDDB test and the BTI test are performed substantially simultaneously on the device based upon the test signal. The data relating to a breakdown of the dielectric layer and at least one characteristic of the transistor based upon the TDDB test and the BTI test is acquired, stored, and/or transmitted.

    Abstract translation: 本文公开的至少一种方法和系统涉及在器件上执行时间依赖介电击穿(TDDB)测试和偏置温度不稳定性(BTI)测试。 提供具有至少一个晶体管和至少一个电介质层的器件。 提供测试信号用于在设备上执行TDDB测试和BTI测试。 基于测试信号,在设备上基本上同时执行TDDB测试和BTI测试。 获取,存储和/或发送与介电层的击穿和基于TDDB测试和BTI测试的晶体管的至少一个特性相关的数据。

    Assessment of HCI in logic circuits based on AC stress in discrete FETs

    公开(公告)号:US10126354B1

    公开(公告)日:2018-11-13

    申请号:US15635711

    申请日:2017-06-28

    Abstract: CMOS switching devices are connected to testing equipment that applies AC to stress the CMOS switching devices. The testing equipment varies rise and fall times of drain and gate voltages, and varies offsets of the drain and gate voltages of the CMOS switching devices. The amount of hot carrier injection (HCI) within the CMOS switching devices is measured when the rise and fall times of the drain and gate voltages cross over, to establish AC HCI contribution to device degradation of the CMOS switching devices. Further, these methods can correlate the AC HCI contribution of the CMOS switching devices to CMOS logic devices based on ring oscillator (RO) degradation of ROs similarly tested or simulated, to produce AC HCI contribution for the CMOS logic devices.

    INTEGRATED CIRCUIT DECOUPLING CAPACITOR ARRANGEMENT
    10.
    发明申请
    INTEGRATED CIRCUIT DECOUPLING CAPACITOR ARRANGEMENT 审中-公开
    集成电路解耦电容器布置

    公开(公告)号:US20140110772A1

    公开(公告)日:2014-04-24

    申请号:US14075517

    申请日:2013-11-08

    CPC classification number: H01L27/06 H01L27/0629 H01L27/0805

    Abstract: A decoupling capacitor arrangement is provided for an integrated circuit. The apparatus includes a plurality of decoupling capacitor arrays electrically connected in parallel with one another. Each of the arrays includes a plurality of decoupling capacitors and a current limiting element. The decoupling capacitors of each array are electrically connected in parallel with one another. The current limiting element is connected in series with the plurality of decoupling capacitors.

    Abstract translation: 为集成电路提供去耦电容器布置。 该装置包括彼此并联电连接的多个去耦电容器阵列。 每个阵列包括多个去耦电容器和限流元件。 每个阵列的去耦电容彼此并联电连接。 限流元件与多个去耦电容器串联连接。

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