公开(公告)号：US09355936B2

公开(公告)日：2016-05-31

申请号：US14242203

申请日：2014-04-01

Applicant: GLOBALFOUNDRIES INC.

Inventor： Edward C. Cooney, III ,  James S. Dunn ,  Dale W. Martin ,  Charles S. Musante ,  BethAnn Rainey Lawrence ,  Leathen Shi ,  Edmund J. Sprogis ,  Cornelia K. Tsang

IPC: H01L23/00 ,  H01L23/482 ,  H01L23/522 ,  H01L23/528 ,  H01L21/768 ,  H01L29/10 ,  H01L21/66 ,  H01L21/683

CPC classification number: H01L23/4825 ,  H01L21/6835 ,  H01L21/76819 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5223 ,  H01L23/5283 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/80 ,  H01L24/81 ,  H01L29/1054 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/0361 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05687 ,  H01L2224/06181 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/73251 ,  H01L2224/80011 ,  H01L2224/80013 ,  H01L2224/80075 ,  H01L2224/80203 ,  H01L2224/804 ,  H01L2224/80487 ,  H01L2224/80896 ,  H01L2224/80907 ,  H01L2224/80948 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/15788 ,  H01L2924/014 ,  H01L2224/08 ,  H01L2224/16 ,  H01L2924/05432 ,  H01L2924/053 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/04941 ,  H01L2924/00 ,  H01L2224/05552

Abstract: Methods for bonding substrate surfaces, bonded substrate assemblies, and design structures for a bonded substrate assembly. Device structures of a product chip are formed using a first surface of a device substrate. A wiring layer of an interconnect structure for the device structures is formed on the product chip. The wiring layer is planarized. A temporary handle wafer is removably bonded to the planarized wiring layer. In response to removably bonding the temporary handle wafer to the planarized first wiring layer, a second surface of the device substrate, which is opposite to the first surface, is bonded to a final handle substrate. The temporary handle wafer is then removed from the assembly.

Abstract translation: 用于粘结衬底表面，键合衬底组件和用于键合衬底组件的设计结构的方法。 使用器件基板的第一表面形成产品芯片的器件结构。 在产品芯片上形成用于器件结构的互连结构的布线层。 布线层被平坦化。 临时处理晶片可移除地结合到平坦化的布线层。 响应于将临时手柄晶片可移除地结合到平坦化的第一布线层，与第一表面相对的器件基板的第二表面被结合到最终的手柄基板。 然后将临时手柄晶片从组件中取出。