公开(公告)号：US5866948A

公开(公告)日：1999-02-02

申请号：US683156

申请日：1996-07-18

申请人： Gen Murakami ,  Mamoru Mita ,  Toyohiko Kumakura ,  Norio Okabe ,  Katsuji Komatsu ,  Shoji Shinzawa

发明人： Gen Murakami ,  Mamoru Mita ,  Toyohiko Kumakura ,  Norio Okabe ,  Katsuji Komatsu ,  Shoji Shinzawa

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L21/68 ,  H01L23/12 ,  H01L23/498 ,  H05K3/06 ,  H05K3/40 ,  H01L23/48

CPC分类号： H01L21/6835 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H05K3/4038 ,  H01L2221/68377 ,  H01L2224/04042 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/48799 ,  H01L2224/48844 ,  H01L2224/85444 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K2201/10378 ,  H05K2203/0369 ,  H05K2203/0733 ,  H05K2203/1476 ,  H05K3/06

摘要： A substrate 1 of a insulating resin material is provided with a semiconductor chip 2 in the center of the substrate 1 and a lot of fine studs are filled in the substrate 1 around the chip 2. A bonding pad 13 and a land 14 are formed on both end planes of each stud 12 by silver plating. The length of the stud 12 is determined so that the plane of the land 14 and the back side plane of the substrate are approximately co-planar, but it may be longer. The substrate 1 including the studs 12 having the bonding pad 12 and the land 14 is defined as an interposer 15.

摘要翻译： 绝缘树脂材料的基板1在基板1的中央设置有半导体芯片2，并且在芯片2周围的基板1中填充有许多细小的螺柱。焊盘13和焊盘14形成在 每个螺柱12的两个端面通过镀银。 螺柱12的长度被确定为使得焊盘14的平面和衬底的背面平面近似共面，但是可以更长。 包括具有接合焊盘12和焊盘14的螺柱12的基板1被定义为插入件15。

公开(公告)号：US6031292A

公开(公告)日：2000-02-29

申请号：US896836

申请日：1997-07-18

申请人： Gen Murakami ,  Mamoru Mita ,  Toyohiko Kumakura ,  Norio Okabe ,  Katsuji Komatsu ,  Shoji Shinzawa

发明人： Gen Murakami ,  Mamoru Mita ,  Toyohiko Kumakura ,  Norio Okabe ,  Katsuji Komatsu ,  Shoji Shinzawa

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L21/68 ,  H01L23/12 ,  H01L23/498 ,  H05K3/06 ,  H05K3/40 ,  H01L23/48

CPC分类号： H01L21/6835 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H05K3/4038 ,  H01L2221/68377 ,  H01L2224/04042 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/48799 ,  H01L2224/48844 ,  H01L2224/85444 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K2201/10378 ,  H05K2203/0369 ,  H05K2203/0733 ,  H05K2203/1476 ,  H05K3/06

摘要： A substrate 1 of a insulating resin material is provided with a semiconductor chip 2 in the center of the substrate 1 and a lot of fine studs are filled in the substrate 1 around the chip 2. A bonding pad 13 and a land 14 are formed on both end planes of each stud 12 by silver plating. The length of the stud 12 is determined so that the plane of the land 14 and the back side plane of the substrate are approximately co-planar, but it may be longer. The substrate 1 including the studs 12 having the bonding pad 12 and the land 14 is defined as an interposer 15.

摘要翻译： 绝缘树脂材料的基板1在基板1的中央设置有半导体芯片2，并且在芯片2周围的基板1中填充有许多细小的螺柱。焊盘13和焊盘14形成在 每个螺柱12的两个端面通过镀银。 螺柱12的长度被确定为使得焊盘14的平面和衬底的背面平面近似共面，但是可以更长。 包括具有接合焊盘12和焊盘14的螺柱12的基板1被定义为插入件15。