摘要:
To provide a substrate mounting structure with which reliability can be improved. This substrate mounting structure includes an ACF (2) disposed on a surface (1a) of a glass substrate (1) and SMDs (3) mounted on the surface (1a) of the glass substrate (1) via the ACF (2) and disposed in an SMD mounting region (10a) on the surface (1a) of the glass substrate (1). Then, dummy components (4) are respectively disposed in a region adjacent to one side of the SMD mounting region (10a) and in a region adjacent to the other side thereof.
摘要:
Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.
摘要:
Provided is a circuit board in which visibility of an alignment mark is improved.In a case of manufacturing a substrate module in which a touch panel (20) and an FPC (50) are electrically connected, an alignment mark in the FPC (50) is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark (25) in the touch panel (20) is also formed by an opaque metal film, the visibility of the alignment mark (25) also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel (20) and the FPC (50) can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.
摘要:
Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.
摘要:
Provided is a circuit board in which visibility of an alignment mark is improved.In a case of manufacturing a substrate module in which a touch panel (20) and an FPC (50) are electrically connected, an alignment mark in the FPC (50) is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark (25) in the touch panel (20) is also formed by an opaque metal film, the visibility of the alignment mark (25) also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel (20) and the FPC (50) can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.
摘要:
A display device that can easily attach a connection member to a display panel is provided. This liquid crystal display device (1) includes: a liquid crystal display panel (2) that includes a TFT substrate (10) and a CF substrate (20); a FPC (30) that is electrically connected to the TFT substrate; and a FPC (40) that is electrically connected to the CF substrate. An alignment mark (13) is provided in the TFT substrate. An alignment mark (41) corresponding to the alignment mark (13) is provided in the FPC (40).
摘要:
The invention provides a display panel and display device enabling easy connection to an external connection component depending on the type of a mounted component, and provides a display device manufacturing method allowing a simple manufacturing process. The display panel of the present invention is a display panel in which a thin film transistor array substrate and an opposed substrate are disposed opposing each other. The thin film transistor array substrate has a first routing wiring that is routed at the outer edge of the substrate, a common transfer section that is formed at a position overlapping with the first routing wiring when the substrate surface is viewed from a normal direction, and a first terminal region, having a plurality of terminals formed thereon including a terminal that is joined to the first routing wiring, at an end portion of the substrate. The opposed substrate has a second routing wiring, and a second terminal region, having a plurality of terminals formed thereon including a terminal that is joined to the second routing wiring, at an end portion of the substrate. The first routing wiring and the second routing wiring conduct with each other via the common transfer section.
摘要:
The present invention provides a display panel in which, without providing connection terminals, the number of which corresponds to the number of test terminals of a liquid crystal panel, on a circuit board such as an FPC board, miniaturization is obtained while reducing costs such as the mounting cost and material cost of the circuit board, and stable operation is performed. A liquid crystal panel (10) has a configuration in which jumper resistors (60a) to (60f) are provided in an overhanging portion (20a) of a glass substrate (20) to ground test terminals, which eliminates the need to ground the test terminals on an FPC board (50). Thus, wiring lines and connection terminals which are connected to the test terminals, respectively, and the numbers of which are equal to the number of the test terminals do not need to be provided on the FPC board (50), reducing the width of the FPC board (50). Thus, the material cost of the FPC board (50) is reduced, and a process performed when mounting the FPC board (50) on the glass substrate (20) is simplified, reducing mounting cost.
摘要:
The invention provides a display panel and display device enabling easy connection to an external connection component depending on the type of a mounted component, and provides a display device manufacturing method allowing a simple manufacturing process. The display panel of the present invention is a display panel in which a thin film transistor array substrate and an opposed substrate are disposed opposing each other. The thin film transistor array substrate has a first routing wiring that is routed at the outer edge of the substrate, a common transfer section that is formed at a position overlapping with the first routing wiring when the substrate surface is viewed from a normal direction, and a first terminal region, having a plurality of terminals formed thereon including a terminal that is joined to the first routing wiring, at an end portion of the substrate. The opposed substrate has a second routing wiring, and a second terminal region, having a plurality of terminals formed thereon including a terminal that is joined to the second routing wiring, at an end portion of the substrate. The first routing wiring and the second routing wiring conduct with each other via the common transfer section.
摘要:
In a liquid crystal display device (10), stabilizing capacitors (61), bypass capacitors (62) and boosting capacitors (63), which would conventionally be mounted on an FPC board (50), are disposed along long and short input sides of an LSI chip (40) mounted on a projection (20a) of a glass substrate (20) and the capacitors are connected to their respective input terminals of the LSI chip (40) via capacitor traces (71). This makes it possible to narrow the FPC board (50) connected to the liquid crystal display device (10), thereby achieving size reduction of the liquid crystal display device (10) while achieving reduction in manufacturing cost, including processing and material cost of the FPC board (50).