公开(公告)号：US20120146022A1

公开(公告)日：2012-06-14

申请号：US13392379

申请日：2010-04-06

申请人： Yasuhiro Hida ,  Gen Nagaoka

发明人： Yasuhiro Hida ,  Gen Nagaoka

IPC分类号： H01L29/786 ,  H01L21/50

CPC分类号： G02F1/1345 ,  G02F2201/42

摘要： The invention provides a display panel and display device enabling easy connection to an external connection component depending on the type of a mounted component, and provides a display device manufacturing method allowing a simple manufacturing process. The display panel of the present invention is a display panel in which a thin film transistor array substrate and an opposed substrate are disposed opposing each other. The thin film transistor array substrate has a first routing wiring that is routed at the outer edge of the substrate, a common transfer section that is formed at a position overlapping with the first routing wiring when the substrate surface is viewed from a normal direction, and a first terminal region, having a plurality of terminals formed thereon including a terminal that is joined to the first routing wiring, at an end portion of the substrate. The opposed substrate has a second routing wiring, and a second terminal region, having a plurality of terminals formed thereon including a terminal that is joined to the second routing wiring, at an end portion of the substrate. The first routing wiring and the second routing wiring conduct with each other via the common transfer section.

摘要翻译： 本发明提供一种显示面板和显示装置，其能够根据安装部件的类型容易地连接到外部连接部件，并且提供允许简单制造过程的显示装置制造方法。 本发明的显示面板是将薄膜晶体管阵列基板和相对基板相对配置的显示面板。 所述薄膜晶体管阵列基板具有在所述基板的外缘被布线的第一布线布线，当从正常方向观察所述基板表面时，形成在与所述第一布线布线重叠的位置处的公共传送部，以及 第一端子区域，在基板的端部具有形成在其上的多个端子，包括接合到第一布线布线的端子。 相对的基板具有第二布线布线和第二端子区域，在基板的端部具有形成在其上的多个端子，其包括接合到第二布线布线的端子。 第一路由布线和第二路由布线经由公共传输部分相互导电。

公开(公告)号：US20120188733A1

公开(公告)日：2012-07-26

申请号：US13499109

申请日：2010-05-14

申请人： Hiroki Miyazaki ,  Gen Nagaoka ,  Yasuhiro Hida

发明人： Hiroki Miyazaki ,  Gen Nagaoka ,  Yasuhiro Hida

IPC分类号： H05K7/06 ,  B32B37/12 ,  H05K1/16

CPC分类号： H05K3/323 ,  H05K2201/10204 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T156/10

摘要： To provide a substrate mounting structure with which reliability can be improved. This substrate mounting structure includes an ACF (2) disposed on a surface (1a) of a glass substrate (1) and SMDs (3) mounted on the surface (1a) of the glass substrate (1) via the ACF (2) and disposed in an SMD mounting region (10a) on the surface (1a) of the glass substrate (1). Then, dummy components (4) are respectively disposed in a region adjacent to one side of the SMD mounting region (10a) and in a region adjacent to the other side thereof.

摘要翻译： 提供可提高可靠性的基板安装结构。 该基板安装结构包括经由ACF（2）设置在玻璃基板（1）的表面（1a）上的ACF（2）和安装在玻璃基板（1）的表面（1a）上的SMD（3），以及 设置在玻璃基板（1）的表面（1a）上的SMD安装区域（10a）中。 然后，虚拟部件（4）分别设置在与SMD安装区域（10a）的一侧相邻的区域中，并且在与其另一侧相邻的区域中。

公开(公告)号：US20120182697A1

公开(公告)日：2012-07-19

申请号：US13498761

申请日：2010-05-12

申请人： Gen Nagaoka ,  Yasuhiro Hida ,  Hiroki Miyazaki

发明人： Gen Nagaoka ,  Yasuhiro Hida ,  Hiroki Miyazaki

IPC分类号： H05K7/06 ,  H05K3/30

CPC分类号： G02F1/13452 ,  G02F1/13454 ,  G02F2202/28 ,  H01L24/16 ,  H01L24/32 ,  H01L2924/01004 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19105 ,  Y10T29/4913 ,  H01L2924/00

摘要： Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.

摘要翻译： 包括在液晶模块（100）中的玻璃基板（110）的突起（111）上的是第一ACF（150a），其表面粘着强度低，连接可靠性高，第二ACF（150b） 其具有高的表面粘着强度的组分附着能力。 通过这些，在玻璃基板（110）上安装有LSI芯片（130），电子部件（150）等，从而可以在确保连接可靠性的同时实现高速电子部件安装。

公开(公告)号：US08450753B2

公开(公告)日：2013-05-28

申请号：US13063983

申请日：2009-06-02

申请人： Motoji Shiota ,  Gen Nagaoka ,  Ichiro Umekawa ,  Yasuhiro Hida ,  Yukio Shimizu

发明人： Motoji Shiota ,  Gen Nagaoka ,  Ichiro Umekawa ,  Yasuhiro Hida ,  Yukio Shimizu

IPC分类号： H01L29/18

CPC分类号： H05K3/323 ,  G02F1/13452 ,  H01L2224/73204 ,  H01L2924/07811 ,  H05K1/0231 ,  H05K3/284 ,  H05K3/361 ,  H05K2201/0379 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

摘要： A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.

摘要翻译： 液晶显示装置（100）具有安装有LSI芯片（130）的玻璃基板（110）和FPC基板（140）。 使用由单片制成的部件ACF（150a），以进一步将诸如稳定电容器（150）的分立电子部件安装在玻璃基板（110）上。 部件ACF（150a）的尺寸不仅覆盖要安装分立电子部件的区域，而且覆盖首先安装的LSI芯片（130）和FPC基板（140）的顶表面。 通过这样使用大分量ACF（150a），消除了将部件ACF（150a）粘附到玻璃基板（110）上的位置约束，减小了安装分立电子部件的区域的面积。 由此，提供了通过减小​​安装有分立电子部件的区域的面积而小型化的板模块。

公开(公告)号：US20120320290A1

公开(公告)日：2012-12-20

申请号：US13577637

申请日：2010-10-27

申请人： Yasuhiro Hida ,  Gen Nagaoka ,  Hiroki Miyazaki

发明人： Yasuhiro Hida ,  Gen Nagaoka ,  Hiroki Miyazaki

IPC分类号： G02F1/136 ,  G02F1/1335

CPC分类号： G02F1/13452 ,  G02F1/13338

摘要： A display device that can easily attach a connection member to a display panel is provided. This liquid crystal display device (1) includes: a liquid crystal display panel (2) that includes a TFT substrate (10) and a CF substrate (20); a FPC (30) that is electrically connected to the TFT substrate; and a FPC (40) that is electrically connected to the CF substrate. An alignment mark (13) is provided in the TFT substrate. An alignment mark (41) corresponding to the alignment mark (13) is provided in the FPC (40).

摘要翻译： 提供了一种可以容易地将连接构件附接到显示面板的显示装置。 该液晶显示装置（1）具备包括TFT基板（10）和CF基板（20）的液晶显示面板（2）。 与TFT基板电连接的FPC（30） 以及电连接到CF基板的FPC（40）。 在TFT基板中设置有对准标记（13）。 在FPC（40）中设置与对准标记（13）对应的对准标记（41）。

公开(公告)号：US20110169022A1

公开(公告)日：2011-07-14

申请号：US13063983

申请日：2009-06-02

申请人： Motoji Shiota ,  Gen Nagaoka ,  Ichiro Umekawa ,  Yasuhiro Hida ,  Yukio Shimizu

发明人： Motoji Shiota ,  Gen Nagaoka ,  Ichiro Umekawa ,  Yasuhiro Hida ,  Yukio Shimizu

IPC分类号： H01L23/488 ,  H01L33/62 ,  H01L21/60

CPC分类号： H05K3/323 ,  G02F1/13452 ,  H01L2224/73204 ,  H01L2924/07811 ,  H05K1/0231 ,  H05K3/284 ,  H05K3/361 ,  H05K2201/0379 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

摘要： A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.

摘要翻译： 液晶显示装置（100）具有安装有LSI芯片（130）的玻璃基板（110）和FPC基板（140）。 使用由单片制成的部件ACF（150a），以进一步将诸如稳定电容器（150）的分立电子部件安装在玻璃基板（110）上。 部件ACF（150a）的尺寸不仅覆盖要安装分立电子部件的区域，而且覆盖首先安装的LSI芯片（130）和FPC基板（140）的顶表面。 通过这样使用大分量ACF（150a），消除了将部件ACF（150a）粘附到玻璃基板（110）上的位置约束，减小了安装分立电子部件的区域的面积。 由此，提供了通过减小​​安装有分立电子部件的区域的面积而小型化的板模块。

公开(公告)号：US09060429B2

公开(公告)日：2015-06-16

申请号：US13581542

申请日：2010-11-02

申请人： Gen Nagaoka ,  Yasuhiro Hida ,  Hiroki Miyazaki

发明人： Gen Nagaoka ,  Yasuhiro Hida ,  Hiroki Miyazaki

IPC分类号： G06F3/041 ,  H05K1/02 ,  H05K3/32 ,  H05K3/36

CPC分类号： H05K1/0269 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/09918 ,  H05K2203/166

摘要： Provided is a circuit board in which visibility of an alignment mark is improved.In a case of manufacturing a substrate module in which a touch panel (20) and an FPC (50) are electrically connected, an alignment mark in the FPC (50) is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark (25) in the touch panel (20) is also formed by an opaque metal film, the visibility of the alignment mark (25) also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel (20) and the FPC (50) can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.

摘要翻译： 提供了一种改善对准标记的可视性的电路板。 在制造触摸面板（20）和FPC（50）电连接的基板模块的情况下，FPC（50）中的对准标记由不透明的金属膜形成，使得可视性高。 因此，当触摸面板（20）中的对准标记（25）也由不透明金属膜形成时，对准标记（25）的可视性也变高。 通过使用具有高可见度的对准标记进行对准，可以以高精度容易地进行触摸面板（20）和FPC（50）之间的对准。 结果，不需要基板模块的成品率的增加和用于对准的对准装置的修改，从而可以降低基板模块的制造成本。

公开(公告)号：US09007777B2

公开(公告)日：2015-04-14

申请号：US13498761

申请日：2010-05-12

申请人： Gen Nagaoka ,  Yasuhiro Hida ,  Hiroki Miyazaki

发明人： Gen Nagaoka ,  Yasuhiro Hida ,  Hiroki Miyazaki

IPC分类号： H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01L29/18 ,  H01L33/00 ,  G09G3/36 ,  G02F1/1345 ,  H01L23/00

CPC分类号： G02F1/13452 ,  G02F1/13454 ,  G02F2202/28 ,  H01L24/16 ,  H01L24/32 ,  H01L2924/01004 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19105 ,  Y10T29/4913 ,  H01L2924/00

摘要： Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.

摘要翻译： 包括在液晶模块（100）中的玻璃基板（110）的突起（111）上的是第一ACF（150a），其表面粘着强度低，连接可靠性高，第二ACF（150b） 其具有高的表面粘着强度的组分附着能力。 通过这些，在玻璃基板（110）上安装有LSI芯片（130），电子部件（150）等，从而可以在确保连接可靠性的同时实现高速电子部件安装。

公开(公告)号：US20120319980A1

公开(公告)日：2012-12-20

申请号：US13581542

申请日：2010-11-02

申请人： Gen Nagaoka ,  Yasuhiro Hida ,  Hiroki Miyazaki

发明人： Gen Nagaoka ,  Yasuhiro Hida ,  Hiroki Miyazaki

IPC分类号： H05K1/00 ,  G06F3/041

CPC分类号： H05K1/0269 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/09918 ,  H05K2203/166

摘要： Provided is a circuit board in which visibility of an alignment mark is improved.In a case of manufacturing a substrate module in which a touch panel (20) and an FPC (50) are electrically connected, an alignment mark in the FPC (50) is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark (25) in the touch panel (20) is also formed by an opaque metal film, the visibility of the alignment mark (25) also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel (20) and the FPC (50) can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.

摘要翻译： 提供了一种改善对准标记的可视性的电路板。 在制造触摸面板（20）和FPC（50）电连接的基板模块的情况下，FPC（50）中的对准标记由不透明的金属膜形成，使得可视性高。 因此，当触摸面板（20）中的对准标记（25）也由不透明金属膜形成时，对准标记（25）的可视性也变高。 通过使用具有高可见度的对准标记进行对准，可以以高精度容易地进行触摸面板（20）和FPC（50）之间的对准。 结果，不需要基板模块的成品率的增加和用于对准的对准装置的修改，从而可以降低基板模块的制造成本。

公开(公告)号：US20110169792A1

公开(公告)日：2011-07-14

申请号：US13119967

申请日：2009-06-15

申请人： Yukio Shimizu ,  Gen Nagaoka ,  Ichiro Umekawa ,  Motoji Shiota ,  Yasuhiro Hida

发明人： Yukio Shimizu ,  Gen Nagaoka ,  Ichiro Umekawa ,  Motoji Shiota ,  Yasuhiro Hida

IPC分类号： G06F3/038 ,  G09G3/36

CPC分类号： G02F1/1345 ,  G02F1/1309 ,  G09G3/006 ,  G09G3/3611 ,  G09G2300/0426 ,  G09G2330/06 ,  H05K1/0215 ,  H05K1/0268 ,  H05K1/147 ,  H05K2201/10363 ,  H05K2201/10636 ,  Y02P70/611

摘要： The present invention provides a display panel in which, without providing connection terminals, the number of which corresponds to the number of test terminals of a liquid crystal panel, on a circuit board such as an FPC board, miniaturization is obtained while reducing costs such as the mounting cost and material cost of the circuit board, and stable operation is performed. A liquid crystal panel (10) has a configuration in which jumper resistors (60a) to (60f) are provided in an overhanging portion (20a) of a glass substrate (20) to ground test terminals, which eliminates the need to ground the test terminals on an FPC board (50). Thus, wiring lines and connection terminals which are connected to the test terminals, respectively, and the numbers of which are equal to the number of the test terminals do not need to be provided on the FPC board (50), reducing the width of the FPC board (50). Thus, the material cost of the FPC board (50) is reduced, and a process performed when mounting the FPC board (50) on the glass substrate (20) is simplified, reducing mounting cost.

摘要翻译： 本发明提供一种显示面板，其中，在不设置与液晶面板的测试端子的数量相对应的连接端子的情况下，在诸如FPC基板的电路板上获得小型化，同时降低诸如 执行电路板的安装成本和材料成本，并且执行稳定的操作。 液晶面板（10）具有将玻璃基板（20）的突出部（20a）中的跳线电阻（60a〜60f）设置为接地试验端子的结构，无需将测试 FPC基板（50）上的端子。 因此，不需要在FPC基板（50）上设置与测试端子分别连接的数量等于测试端子的数量的布线和连接端子，从而减小 FPC板（50）。 因此，FPC板（50）的材料成本降低，并且将FPC基板（50）安装在玻璃基板（20）上时的处理简化，降低了安装成本。