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108 条记录 (耗时 0.027 秒)

    Device for producing a bundled light flux
    1.
    发明申请
    Device for producing a bundled light flux 有权
    用于产生捆束光通量的装置

    公开(公告)号：US20060007553A1

    公开(公告)日：2006-01-12

    申请号：US10529706

    申请日：2003-09-01

    申请人： Georg Bogner ,  Herbert Breinich ,  Bernd Ludewig ,  Ralf Mayer ,  Heinrich Noll ,  Jorg-Erich Sorg

    发明人： Georg Bogner ,  Herbert Breinich ,  Bernd Ludewig ,  Ralf Mayer ,  Heinrich Noll ,  Jorg-Erich Sorg

    IPC分类号： G02B27/14

    CPC分类号： G02F1/133603 ,  G02F1/133605 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00

    摘要： The invention relates to a device for producing a bundled light flux. According to the invention, a light source consisting of a light emitting diode matrix (1, 2, 3) is provided, an optical device for bundling and scattering the light produced by the light-emitting diodes is arranged between the light source and a light outlet (9, 18), the device for bundling and scattering comprises a latticed reflector (5) which respectively forms a light channel for each matrix point, the walls (6) of said light channel being reflective, and the end of each light channel, facing the light source (1, 2, 3), contains a convergent lens (4).

    摘要翻译： 本发明涉及一种用于产生束状光通量的装置。 根据本发明，提供了一种由发光二极管阵列（1,2,3）组成的光源，用于将由发光二极管产生的光聚束和散射的光学装置设置在光源和光 出口（9,18），用于捆绑和散射的装置包括网格反射器（5），其分别形成每个矩阵点的光通道，所述光通道的壁（6）是反射性的，并且每个光通道的端部 面对光源（1,2,3），包含会聚透镜（4）。

    Optoelectronic component and a module based thereon
    4.
    发明授权
    Optoelectronic component and a module based thereon 有权
    光电组件和基于此的模块

    公开(公告)号：US07586190B2

    公开(公告)日：2009-09-08

    申请号：US10529626

    申请日：2003-09-29

    申请人： Georg Bogner ,  Patrick Kromotis ,  Ralf Mayer ,  Heinrich Noll ,  Matthias Winter

    发明人： Georg Bogner ,  Patrick Kromotis ,  Ralf Mayer ,  Heinrich Noll ,  Matthias Winter

    IPC分类号： H01L23/34

    CPC分类号： H01L33/64 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An optoelectronic component (1) having a semiconductor arrangement (4) which emits and/or receives electromagnetic radiation and which is arranged on a carrier (22) which is thermally conductively connected to a heat sink (12). External electrical connections (9) are connected to the semiconductor arrangement (4), where the external electrical connections (9) are arranged in electrically insulated fashion on the heat sink (12) at a distance from the carrier (22). This results in an optimized component in terms of the dissipation of heat loss and the radiation of light and also in terms of making electrical contact and the packing density in modules.

    摘要翻译： 一种具有发射和/或接收电磁辐射的半导体装置（4）的光电子部件（1），其布置在导热连接到散热器（12）的载体（22）上。 外部电连接（9）连接到半导体装置（4），其中外部电连接（9）以绝缘方式布置在散热器（12）上距载体（22）一定距离处。 这导致了热耗散和光辐射的优化组件，以及在模块中的电接触和包装密度方面。

    Optoelectronic component and a module based thereon
    6.
    发明申请
    Optoelectronic component and a module based thereon 有权
    光电组件和基于此的模块

    公开(公告)号：US20060138621A1

    公开(公告)日：2006-06-29

    申请号：US10529626

    申请日：2003-09-29

    申请人： Georg Bogner ,  Patrick Kromotis ,  Ralf Mayer ,  Heinrich Noll ,  Matthias Winter

    发明人： Georg Bogner ,  Patrick Kromotis ,  Ralf Mayer ,  Heinrich Noll ,  Matthias Winter

    IPC分类号： H01L23/02

    CPC分类号： H01L33/64 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An optoelectronic component (1) having a semiconductor arrangement (4) which emits and/or receives electromagnetic radiation and which is arranged on a carrier (22) which is thermally conductively connected to a heat sink (12). External electrical connections (9) are connected to the semiconductor arrangement (4), where the external electrical connections (9) are arranged in electrically insulated fashion on the heat sink (12) at a distance from the carrier (22). This results in an optimized component in terms of the dissipation of heat loss and the radiation of light and also in terms of making electrical contact and the packing density in modules.

    摘要翻译： 一种具有发射和/或接收电磁辐射的半导体装置（4）的光电子部件（1），其布置在导热连接到散热片（12）的载体（22）上。 外部电连接（9）连接到半导体装置（4），其中外部电连接（9）以绝缘方式布置在散热器（12）上距载体（22）一定距离处。 这导致了热耗散和光辐射的优化组件，以及在模块中的电接触和包装密度方面。

    LED array
    7.
    发明授权
    LED array 有权
    LED阵列

    公开(公告)号：US07726835B2

    公开(公告)日：2010-06-01

    申请号：US11816951

    申请日：2006-02-06

    申请人： Georg Bogner ,  Moritz Engl ,  Stefan Grötsch ,  Patrick Kromotis ,  Jorg Erich Sorg

    发明人： Georg Bogner ,  Moritz Engl ,  Stefan Grötsch ,  Patrick Kromotis ,  Jorg Erich Sorg

    IPC分类号： H01L27/15

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/42 ,  H01L33/505 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface, and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.

    摘要翻译： 在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体， 透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面 ，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。 至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。

    LED ARRAY
    8.
    发明申请
    LED ARRAY 有权
    LED阵列

    公开(公告)号：US20090103297A1

    公开(公告)日：2009-04-23

    申请号：US11816951

    申请日：2006-02-06

    申请人： Georg Bogner ,  Moritz Engl ,  Stefan Grotsch ,  Patrick Kromotis ,  Jorg Erich Sorg

    发明人： Georg Bogner ,  Moritz Engl ,  Stefan Grotsch ,  Patrick Kromotis ,  Jorg Erich Sorg

    IPC分类号： F21V33/00

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/42 ,  H01L33/505 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface , and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.

    摘要翻译： 在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体， 透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面 ，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。 至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。