Optoelectronic semiconductor device
    2.
    发明授权
    Optoelectronic semiconductor device 有权
    光电半导体器件

    公开(公告)号:US08878170B2

    公开(公告)日:2014-11-04

    申请号:US13885659

    申请日:2011-11-08

    申请人: Klaus Hoehn

    发明人: Klaus Hoehn

    摘要: An optoelectronic semiconductor device has a carrier foil that includes a first surface and a second surface opposite the first surface. At least one electrically conductive contact layer is arranged on the first surface and covers the first surface in places and contains at least one metal. At least one radiation-emitting optoelectronic semiconductor component is arranged on an outer face, remote from the carrier foil, of the electrically conductive contact layer. The radiation-emitting, optoelectronic semiconductor component is electrically conductively connected to the at least one electrically conductive contact layer. The carrier foil is formed with at least one polymer or contains at least one polymer. At least one monomer of the polymer is formed with at least one C—F bond, with C denoting carbon and F fluorine.

    摘要翻译: 光电半导体器件具有载体箔,其包括第一表面和与第一表面相对的第二表面。 至少一个导电接触层设置在第一表面上并且在位置上覆盖第一表面并且包含至少一种金属。 至少一个辐射发射光电子半导体部件布置在导电接触层的远离载体箔的外表面上。 辐射发射的光电子半导体部件与至少一个导电接触层导电连接。 载体箔由至少一种聚合物形成或含有至少一种聚合物。 聚合物的至少一种单体与至少一个C-F键形成,C表示碳和F氟。

    Optoelectronic Semiconductor Device
    6.
    发明申请
    Optoelectronic Semiconductor Device 有权
    光电子半导体器件

    公开(公告)号:US20130307015A1

    公开(公告)日:2013-11-21

    申请号:US13885659

    申请日:2011-11-08

    申请人: Klaus Hoehn

    发明人: Klaus Hoehn

    IPC分类号: H01L33/62

    摘要: An optoelectronic semiconductor device has a carrier foil that includes a first surface and a second surface opposite the first surface. At least one electrically conductive contact layer is arranged on the first surface and covers the first surface in places and contains at least one metal. At least one radiation-emitting optoelectronic semiconductor component is arranged on an outer face, remote from the carrier foil, of the electrically conductive contact layer. The radiation-emitting, optoelectronic semiconductor component is electrically conductively connected to the at least one electrically conductive contact layer. The carrier foil is formed with at least one polymer or contains at least one polymer. At least one monomer of the polymer is formed with at least one C-F bond, with C denoting carbon and F fluorine.

    摘要翻译: 光电半导体器件具有载体箔,其包括第一表面和与第一表面相对的第二表面。 至少一个导电接触层设置在第一表面上并且在位置上覆盖第一表面并且包含至少一种金属。 至少一个辐射发射光电子半导体部件布置在导电接触层的远离载体箔的外表面上。 辐射发射的光电子半导体部件与至少一个导电接触层导电连接。 载体箔由至少一种聚合物形成或含有至少一种聚合物。 聚合物的至少一种单体与至少一个C-F键形成,C表示碳和F氟。

    Mechanically firm glued connections between surfaces and the method for producing the same
    7.
    发明授权
    Mechanically firm glued connections between surfaces and the method for producing the same 失效
    表面之间机械牢固的胶合连接及其制造方法

    公开(公告)号:US06245187B1

    公开(公告)日:2001-06-12

    申请号:US08869669

    申请日:1997-06-05

    IPC分类号: C09J500

    摘要: To produce a mechanically firm glued connection between two surface regions of surfaces to be connected, a method is provided which provides each of the surfaces with surface regions having a peak-to-valley thickness of less than 0.3 &mgr;m and the surface regions are brought together in such a way that an intermediate space, which is filled with the glue, is produced therebetween and the space has a small average thickness of less than 0.31 &mgr;m and extends over a surface area of at least 20×20 &mgr;m2. The glue is preferably brought into the intermediate space by capillary action and contacts of high quality can be achieved with this method.

    摘要翻译: 为了在要连接的表面的两个表面区域之间产生机械牢固的胶合连接,提供了一种方法,其为每个表面提供具有小于0.3μm的峰 - 谷厚度的表面区域,并且表面区域被聚集在一起 以这样的方式,在其间产生填充有胶的中间空间,并且该空间的平均厚度小于0.31μm,并且在至少20×20mum2的表面积上延伸。 胶水优选通过毛细作用进入中间空间,并且可以通过该方法实现高质量的接触。