公开(公告)号：US20060057823A1

公开(公告)日：2006-03-16

申请号：US11218309

申请日：2005-08-31

Applicant: Roberto Tiziani ,  Giovanni Frezza

Inventor： Roberto Tiziani ,  Giovanni Frezza

IPC: H01L21/78 ,  H01L21/301 ,  H01L21/46

CPC classification number: G06K19/077 ,  G06K19/041

Abstract: A method is provided for manufacturing a fully moulded Multi Media Card package obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling. The method includes providing a rounded groove on a substrate back side of the package, all around the package profile, and cutting the edges of said package by a laser cutting line passing through said groove. This new technique allows the use of all the 24.0 mm width of the MMC package for the substrate 2, thus increasing the surface available for electronic components.

Abstract translation: 提供了一种用于制造通过激光切割获得的完全成型的多媒体卡封装的方法，其中至少一些边缘和封装周围的拐角具有圆形轮廓和足够的平滑度以进行安全处理。 该方法包括在封装的衬底背面上提供圆形沟槽，全部围绕封装轮廓，以及通过穿过所述沟槽的激光切割线切割所述封装的边缘。 这种新技术允许使用MMC封装的所有24.0mm宽度的基板2，从而增加可用于电子部件的表面。

公开(公告)号：US06909166B2

公开(公告)日：2005-06-21

申请号：US10246781

申请日：2002-09-18

Applicant: Giovanni Frezza ,  Roberto Tiziani

Inventor： Giovanni Frezza ,  Roberto Tiziani

IPC: H01L23/31 ,  H01L23/495 ,  H05K3/34

CPC classification number: H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to leads of a No-Lead type package which includes a chip having an active surface and a rear surface opposite the active surface. The active surface has a plurality of connection points with a plurality of leads arranged around the perimeter of the chip and a first and a second surface orthogonal to said first surface. A plurality of connection wires connect electrically the bonding pads of the chip to the first surface of the leads respectively. The package also includes a welding compound suitable for encapsulating the chip, the first surface of the leads and the bonding pads. The leads possess at least one hole in the second surface of the leads.

Abstract translation: 本发明涉及一种无铅型封装的引线，其包括具有有源表面和与该有源表面相对的后表面的芯片。 活性表面具有多个连接点，多个引线布置在芯片的周边周围，第一和第二表面垂直于所述第一表面。 多个连接线分别将芯片的接合焊盘电连接到引线的第一表面。 封装还包括适合于封装芯片的焊接化合物，引线的第一表面和焊盘。 引线在引线的第二表面中具有至少一个孔。

公开(公告)号：US07803663B2

公开(公告)日：2010-09-28

申请号：US11218309

申请日：2005-08-31

Applicant: Roberto Tiziani ,  Giovanni Frezza

Inventor： Roberto Tiziani ,  Giovanni Frezza

IPC: H01L21/48

CPC classification number: G06K19/077 ,  G06K19/041

Abstract: A method is provided for manufacturing a fully moulded Multi Media Card package obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling. The method includes providing a rounded groove on a substrate back side of the package, all around the package profile, and cutting the edges of said package by a laser cutting line passing through said groove. This new technique allows the use of all the 24.0 mm width of the MMC package for the substrate 2, thus increasing the surface available for electronic components.

Abstract translation: 提供了一种用于制造通过激光切割获得的完全成型的多媒体卡封装的方法，其中至少一些边缘和封装周围的拐角具有圆形轮廓和足够的平滑度以进行安全处理。 该方法包括在封装的衬底背面上提供圆形沟槽，全部围绕封装轮廓，以及通过穿过所述沟槽的激光切割线切割所述封装的边缘。 这种新技术允许使用MMC封装的所有24.0mm宽度的基板2，从而增加可用于电子部件的表面。

公开(公告)号：US07269897B2

公开(公告)日：2007-09-18

申请号：US10745296

申请日：2003-12-23

Applicant: Giovanni Frezza

Inventor： Giovanni Frezza

IPC: H05K3/30

CPC classification number: H01L25/50 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15311 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49135 ,  Y10T29/49137 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A manufacturing process of a stacked semiconductor device, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor wafer; distributing an adhesive layer on active areas, splitting the semiconductor wafer into a plurality of first dies, each one comprising at least one of the active areas; mounting the plurality of first dies, which are already equipped with the adhesive layer, on a support; and mounting a plurality of second dies on the adhesive layer.

Abstract translation: 一种叠层半导体器件的制造工艺，包括以下步骤：在半导体晶片中实现的多个有源区域中集成多个电子器件; 在有源区域上分布粘合剂层，将半导体晶片分成多个第一裸片，每个第一裸片包括至少一个有源区; 将已经装有粘合剂层的多个第一模具安装在支撑件上; 以及将多个第二模具安装在所述粘合剂层上。

公开(公告)号：US06924166B2

公开(公告)日：2005-08-02

申请号：US10293980

申请日：2002-11-12

Applicant: Simone Sassolini ,  Marco Del Sarto ,  Giovanni Frezza ,  Lorenzo Baldo

Inventor： Simone Sassolini ,  Marco Del Sarto ,  Giovanni Frezza ,  Lorenzo Baldo

IPC: B81B7/00 ,  B81C1/00 ,  H01L21/00

CPC classification number: B81C1/00333

Abstract: A process for the fabrication of devices that integrate protected microstructures, comprising the following steps: forming, in a body of semiconductor material, at least one microstructure having at least one first portion and one second portion which are relatively mobile with respect to one another and are separated from one another by at least one gap region, which is accessible through a face of the body; and sealing the gap. The sealing step includes depositing on the face of the body a layer of protective material, in such a way as to close the gap region, the protective layer being such as to enable relative motion between the first portion and the second portion of the microstructure.

Abstract translation: 一种用于制造整合受保护微结构的器件的方法，包括以下步骤：在半导体材料体中形成至少一个具有至少一个第一部分和一个第二部分的微结构，所述第一部分和第二部分相对于彼此相对移动， 通过至少一个间隙区域彼此分离，所述间隙区域可通过身体的面部接近; 并密封间隙。 所述密封步骤包括在所述主体的表面上沉积一层保护材料，以使得所述间隙区域闭合，所述保护层能够使所述微结构的第一部分和第二部分之间相对运动。