公开(公告)号：US20060057823A1

公开(公告)日：2006-03-16

申请号：US11218309

申请日：2005-08-31

Applicant: Roberto Tiziani ,  Giovanni Frezza

Inventor： Roberto Tiziani ,  Giovanni Frezza

IPC: H01L21/78 ,  H01L21/301 ,  H01L21/46

CPC classification number: G06K19/077 ,  G06K19/041

Abstract: A method is provided for manufacturing a fully moulded Multi Media Card package obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling. The method includes providing a rounded groove on a substrate back side of the package, all around the package profile, and cutting the edges of said package by a laser cutting line passing through said groove. This new technique allows the use of all the 24.0 mm width of the MMC package for the substrate 2, thus increasing the surface available for electronic components.

Abstract translation: 提供了一种用于制造通过激光切割获得的完全成型的多媒体卡封装的方法，其中至少一些边缘和封装周围的拐角具有圆形轮廓和足够的平滑度以进行安全处理。 该方法包括在封装的衬底背面上提供圆形沟槽，全部围绕封装轮廓，以及通过穿过所述沟槽的激光切割线切割所述封装的边缘。 这种新技术允许使用MMC封装的所有24.0mm宽度的基板2，从而增加可用于电子部件的表面。

公开(公告)号：US20050073057A1

公开(公告)日：2005-04-07

申请号：US10947914

申请日：2004-09-23

Applicant: Roberto Tiziani ,  Carlo Passagrilli

Inventor： Roberto Tiziani ,  Carlo Passagrilli

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L24/05 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05083 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A semiconductor electronic device includes a die of semiconductor material and a support. The die of semiconductor material includes an integrated electronic circuit and a plurality of contact pads associated with the electronic circuit and connected electrically to the support by wire leads. Each contact pad may include a lower layer of aluminum, copper, or alloys thereof, and an upper layer including at least one film of a metal and/or metallic alloy including nickel, palladium, or alloys thereof, and being deposited by an electroless chemical process.

Abstract translation: 半导体电子器件包括半导体材料的裸片和支持体。 半导体材料的管芯包括集成电子电路和与电子电路相关联的多个接触焊盘，并且通过引线电连接到支撑件。 每个接触垫可以包括铝，铜或其合金的下层，以及包括至少一种包含镍，钯或其合金的金属和/或金属合金膜的上层，并通过无电化学材料 处理。

公开(公告)号：US06195256B1

公开(公告)日：2001-02-27

申请号：US09211426

申请日：1998-12-15

Applicant: Roberto Tiziani ,  Roberto Rossi ,  Claudio Maria Villa

Inventor： Roberto Tiziani ,  Roberto Rossi ,  Claudio Maria Villa

IPC: H05K720

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/341 ,  H05K2201/066 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00

Abstract: An external heat sink is soldered to an internal heat sink incorporated into the bottom of a molded body of encapsulating resin for a package of an integrated power device. The power device is for surface mounting on a printed circuit board. The internal heat sink has at least a portion protruding from an outer surface of at least one face of the molded body. An external heat sink is mounted on the printed circuit board. The external heat sink has at least a surface abutting with a surface of the body, thus defining a separation gap between at least a surface of the protruding portion of the internal heat sink and an opposing surface of the external heat sink. This separation gap is filled with molten solder alloy during a normal soldering treatment of the printed circuit board.

Abstract translation: 将外部散热器焊接到结合到用于集成电力设备的封装的封装树脂的成型体的底部中的内部散热器。 电源设备用于表面安装在印刷电路板上。 内部散热器具有从成型体的至少一个面的外表面突出的至少一部分。 外部散热器安装在印刷电路板上。 外部散热器具有与主体的表面邻接的至少一个表面，从而在内部散热器的突出部分的至少一个表面与外部散热器的相对表面之间形成分隔间隙。 在印刷电路板的正常焊接处理期间，该分离间隙被熔融焊料合金填充。

公开(公告)号：US06909166B2

公开(公告)日：2005-06-21

申请号：US10246781

申请日：2002-09-18

Applicant: Giovanni Frezza ,  Roberto Tiziani

Inventor： Giovanni Frezza ,  Roberto Tiziani

IPC: H01L23/31 ,  H01L23/495 ,  H05K3/34

CPC classification number: H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to leads of a No-Lead type package which includes a chip having an active surface and a rear surface opposite the active surface. The active surface has a plurality of connection points with a plurality of leads arranged around the perimeter of the chip and a first and a second surface orthogonal to said first surface. A plurality of connection wires connect electrically the bonding pads of the chip to the first surface of the leads respectively. The package also includes a welding compound suitable for encapsulating the chip, the first surface of the leads and the bonding pads. The leads possess at least one hole in the second surface of the leads.

Abstract translation: 本发明涉及一种无铅型封装的引线，其包括具有有源表面和与该有源表面相对的后表面的芯片。 活性表面具有多个连接点，多个引线布置在芯片的周边周围，第一和第二表面垂直于所述第一表面。 多个连接线分别将芯片的接合焊盘电连接到引线的第一表面。 封装还包括适合于封装芯片的焊接化合物，引线的第一表面和焊盘。 引线在引线的第二表面中具有至少一个孔。

公开(公告)号：US06815789B2

公开(公告)日：2004-11-09

申请号：US10319441

申请日：2002-12-13

Applicant: Roberto Tiziani ,  Carlo Passagrilli

Inventor： Roberto Tiziani ,  Carlo Passagrilli

IPC: H01L2972

CPC classification number: H01L24/05 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05083 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A semiconductor electronic device includes a die of semiconductor material and a support. The die of semiconductor material includes an integrated electronic circuit and a plurality of contact pads associated with the electronic circuit and connected electrically to the support by wire leads. Each contact pad may include a lower layer of aluminum, copper, or alloys thereof, and an upper layer including at least one film of a metal and/or metallic alloy including nickel, palladium, or alloys thereof, and being deposited by an electroless chemical process.

公开(公告)号：US06291893B1

公开(公告)日：2001-09-18

申请号：US09237407

申请日：1999-01-26

Applicant: Roberto Tiziani ,  Paolo Crema ,  Marco Mantovani

Inventor： Roberto Tiziani ,  Paolo Crema ,  Marco Mantovani

IPC: H01L2348

CPC classification number: H01L23/3121 ,  H01L23/36 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2924/19041

Abstract: An electronic device is formed on a chip of semiconductor material covered by a layer of insulating material. Metal interconnection elements form, on the insulating layer, connection pads to which a soldering material is applied. To permit good heat dissipation, the device has a metal plate partially incorporated in the insulating layer and having a surface which is coplanar with the pads and to which soldering material is applied. The electronic device is secured to a mounting substrate having a corresponding metal plate.

Abstract translation: 电子器件形成在由绝缘材料层覆盖的半导体材料的芯片上。 金属互连元件在绝缘层上形成施加焊接材料的连接焊盘。 为了允许良好的散热，该器件具有部分地并入绝缘层中的金属板，并且具有与焊盘共面的表面，并且施加了焊料。 电子装置被固定到具有对应的金属板的安装基板上。

公开(公告)号：US07803663B2

公开(公告)日：2010-09-28

申请号：US11218309

申请日：2005-08-31

Applicant: Roberto Tiziani ,  Giovanni Frezza

Inventor： Roberto Tiziani ,  Giovanni Frezza

IPC: H01L21/48

CPC classification number: G06K19/077 ,  G06K19/041

Abstract: A method is provided for manufacturing a fully moulded Multi Media Card package obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling. The method includes providing a rounded groove on a substrate back side of the package, all around the package profile, and cutting the edges of said package by a laser cutting line passing through said groove. This new technique allows the use of all the 24.0 mm width of the MMC package for the substrate 2, thus increasing the surface available for electronic components.

Abstract translation: 提供了一种用于制造通过激光切割获得的完全成型的多媒体卡封装的方法，其中至少一些边缘和封装周围的拐角具有圆形轮廓和足够的平滑度以进行安全处理。 该方法包括在封装的衬底背面上提供圆形沟槽，全部围绕封装轮廓，以及通过穿过所述沟槽的激光切割线切割所述封装的边缘。 这种新技术允许使用MMC封装的所有24.0mm宽度的基板2，从而增加可用于电子部件的表面。

公开(公告)号：US07459387B2

公开(公告)日：2008-12-02

申请号：US10947914

申请日：2004-09-23

Applicant: Roberto Tiziani ,  Carlo Passagrilli

Inventor： Roberto Tiziani ,  Carlo Passagrilli

IPC: H01L29/72

CPC classification number: H01L24/05 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05083 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A semiconductor electronic device includes a die of semiconductor material and a support. The die of semiconductor material includes an integrated electronic circuit and a plurality of contact pads associated with the electronic circuit and connected electrically to the support by wire leads. Each contact pad may include a lower layer of aluminum, copper, or alloys thereof, and an upper layer including at least one film of a metal and/or metallic alloy including nickel, palladium, or alloys thereof, and being deposited by an electroless chemical process.

Abstract translation: 半导体电子器件包括半导体材料的裸片和支持体。 半导体材料的管芯包括集成电子电路和与电子电路相关联的多个接触焊盘，并且通过引线电连接到支撑件。 每个接触垫可以包括铝，铜或其合金的下层，以及包括至少一种包含镍，钯或其合金的金属和/或金属合金膜的上层，并通过无电化学材料 处理。

公开(公告)号：US06838755B2

公开(公告)日：2005-01-04

申请号：US09862214

申请日：2001-05-21

Applicant: Roberto Tiziani ,  Carlo Cognetti ,  Andrea Cigada

Inventor： Roberto Tiziani ,  Carlo Cognetti ,  Andrea Cigada

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L23/49541 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A leadframe for semiconductor devices, including a region which is adapted to support a semiconductor device and a plurality of leads which are arranged so as to be directed toward the region, for mutual connection, by connecting wires connecting the leads and the semiconductor device. The leads include leads having at least two different lengths for the connection of connecting wires having different diameters.

Abstract translation: 一种用于半导体器件的引线框架，包括通过连接引线和半导体器件的连接线，包括适于支撑半导体器件的区域和被布置成指向该区域的多个引线以进行相互连接。 引线包括具有至少两个不同长度的引线，用于连接具有不同直径的连接线。

公开(公告)号：US06593665B2

公开(公告)日：2003-07-15

申请号：US09844506

申请日：2001-04-27

Applicant: Roberto Tiziani ,  Marzio Terzoli

Inventor： Roberto Tiziani ,  Marzio Terzoli

IPC: H01L2328

CPC classification number: H01L21/565 ,  H01L23/31 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A protective envelope, made of a plastics material for enclosing a semiconductor integrated circuit, includes a flattened parallelepiped body having a sidewall formed of first and second portions set to converge toward each other. The envelope also includes a lead frame embedded in the body and bearing the integrated circuit, the lead frame having a section bent to form a baffle plate orientated toward the first sidewall portion. Advantageously, the bent section of the lead frame has a plane end edge extending parallel to the first sidewall portion at a spacing therefrom.