PROCESS FOR OPTICALLY TRANSPARENT VIA FILLING
    5.
    发明申请
    PROCESS FOR OPTICALLY TRANSPARENT VIA FILLING 有权
    通过填充的光学透明过程

    公开(公告)号:US20070291496A1

    公开(公告)日:2007-12-20

    申请号:US11742862

    申请日:2007-05-01

    IPC分类号: G02B6/10 F21V17/00

    CPC分类号: B29D11/00663

    摘要: A method of forming a filled via with an optically transmissive material and a resulting product. The method comprises drilling a via in a panel and filling the via with an optically transmissive material. The method can also be used to create a light transmissive section of a housing. A light source directed to one side of the via is seen through the optically transmissive material so as to be visible to a viewer viewing a surface at the second side of the via.

    摘要翻译: 一种用光学透射材料和所得产品形成填充的通孔的方法。 该方法包括在面板中钻孔,并用透光材料填充通孔。 该方法还可以用于创建壳体的透光部分。 通过透光材料可以看到指向通孔一侧的光源,以便在观察通孔第二面处的表面的观察者可见。

    Process for forming panel with an optically transmissive portion and products related thereto
    6.
    发明授权
    Process for forming panel with an optically transmissive portion and products related thereto 有权
    用于形成具有透光部分的面板和与其相关的产品的方法

    公开(公告)号:US08394301B2

    公开(公告)日:2013-03-12

    申请号:US11742862

    申请日:2007-05-01

    IPC分类号: B29D11/00 B23K26/00

    CPC分类号: B29D11/00663

    摘要: A method of forming a panel with an optically transmissive portion and resulting products. The method comprises drilling a via through a panel and filling the via with an optically transmissive material. A top surface and/or a bottom surface of the panel at the optically transmissive portion is smooth and continuous to the naked eye. The method can also be used to create a light transmissive section of a housing. A light source directed to one side of the via is seen through the optically transmissive material so as to be visible to a viewer viewing a surface at the second side of the via.

    摘要翻译: 一种形成具有光学透射部分和产生的产品的面板的方法。 该方法包括通过面板钻孔,并用透光材料填充通孔。 在透光部分的面板的顶表面和/或底表面是光滑的并且与肉眼连续。 该方法还可以用于创建壳体的透光部分。 通过透光材料可以看到指向通孔一侧的光源,以便在观察通孔第二面处的表面的观察者可见。

    Laser machining of fired ceramic and other hard and/or thick materials
    7.
    发明授权
    Laser machining of fired ceramic and other hard and/or thick materials 有权
    烧结陶瓷和其他硬质和/或厚材料的激光加工

    公开(公告)号:US08093532B2

    公开(公告)日:2012-01-10

    申请号:US12060023

    申请日:2008-03-31

    IPC分类号: B23K26/16

    摘要: Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interface of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf.

    摘要翻译: 激光加工烧制陶瓷和其他硬质和/或厚的材料包括在工件的切口区域内沿着一系列平行激光路径用激光束刻划工件。 划线在切割区域中产生切割,随着激光束沿着该序列的前进而变宽。 顺序可以从切口区域的内部开始并且以其外边缘结束,使得碎屑被引导离开激光路径以增加生产量并且在工件中产生高质量的开口。 也可以从工件切出高质量的结构。 该方法包括将高速气流引导到激光束和工件的界面,以重定向碎屑流并冷却界面。 该方法还可以在其加深切口时调节激光束的聚焦深度。