Process for Creating Sub-Surface Marking on Plastic Parts
    3.
    发明申请
    Process for Creating Sub-Surface Marking on Plastic Parts 审中-公开
    在塑料零件上创建子表面标记的过程

    公开(公告)号:US20140009873A1

    公开(公告)日:2014-01-09

    申请号:US13619208

    申请日:2012-09-14

    IPC分类号: H05K5/00 B05D3/00 H05K13/00

    摘要: Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on sub-surfaces of the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on a sub-surface of the outer housing surface yet still be visible from the outside of the housing. Since the markings are beneath the surface of the housing, the markings are durable.

    摘要翻译: 公开了在产品上提供标记的技术或工艺。 在一个实施例中,产品具有壳体,并且标记将设置在壳体的子表面上。 例如,用于特定产品的壳体可以包括外部壳体表面,并且标记可以设置在外部壳体表面的子表面上,但仍然可以从壳体的外部看到。 由于标记在外壳的表面下方,标记是耐用的。

    Laser machining of fired ceramic and other hard and/or thick materials
    4.
    发明授权
    Laser machining of fired ceramic and other hard and/or thick materials 有权
    烧结陶瓷和其他硬质和/或厚材料的激光加工

    公开(公告)号:US08093532B2

    公开(公告)日:2012-01-10

    申请号:US12060023

    申请日:2008-03-31

    IPC分类号: B23K26/16

    摘要: Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interface of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf.

    摘要翻译: 激光加工烧制陶瓷和其他硬质和/或厚的材料包括在工件的切口区域内沿着一系列平行激光路径用激光束刻划工件。 划线在切割区域中产生切割,随着激光束沿着该序列的前进而变宽。 顺序可以从切口区域的内部开始并且以其外边缘结束,使得碎屑被引导离开激光路径以增加生产量并且在工件中产生高质量的开口。 也可以从工件切出高质量的结构。 该方法包括将高速气流引导到激光束和工件的界面,以重定向碎屑流并冷却界面。 该方法还可以在其加深切口时调节激光束的聚焦深度。

    PROCESS FOR OPTICALLY TRANSPARENT VIA FILLING
    10.
    发明申请
    PROCESS FOR OPTICALLY TRANSPARENT VIA FILLING 有权
    通过填充的光学透明过程

    公开(公告)号:US20070291496A1

    公开(公告)日:2007-12-20

    申请号:US11742862

    申请日:2007-05-01

    IPC分类号: G02B6/10 F21V17/00

    CPC分类号: B29D11/00663

    摘要: A method of forming a filled via with an optically transmissive material and a resulting product. The method comprises drilling a via in a panel and filling the via with an optically transmissive material. The method can also be used to create a light transmissive section of a housing. A light source directed to one side of the via is seen through the optically transmissive material so as to be visible to a viewer viewing a surface at the second side of the via.

    摘要翻译: 一种用光学透射材料和所得产品形成填充的通孔的方法。 该方法包括在面板中钻孔,并用透光材料填充通孔。 该方法还可以用于创建壳体的透光部分。 通过透光材料可以看到指向通孔一侧的光源,以便在观察通孔第二面处的表面的观察者可见。