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公开(公告)号：US20130320529A1
公开(公告)日：2013-12-05
申请号：US13482414
申请日：2012-05-29
IPC分类号： H01L23/498 , H01L21/30
CPC分类号： H01L24/17 , H01L23/49811 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L25/0657 , H01L2224/0401 , H01L2224/05572 , H01L2224/05582 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/131 , H01L2224/13124 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/13166 , H01L2224/13169 , H01L2224/13179 , H01L2224/16113 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/16501 , H01L2224/1713 , H01L2224/17163 , H01L2224/7525 , H01L2224/75264 , H01L2224/81192 , H01L2224/81222 , H01L2224/81455 , H01L2224/81457 , H01L2224/8146 , H01L2224/81466 , H01L2224/818 , H01L2224/81815 , H01L2924/00014 , H01L2924/01014 , H01L2924/0541 , H01L2924/2064 , H01L2924/20641 , H01L2224/81121 , H01L2924/00012 , H01L2224/757 , H01L2924/014 , H01L2224/05552
摘要： An array of bonding pads including a set of reactive materials is provided on a first substrate. The set of reactive materials is selected to be capable of ignition by magnetic heating induced by time-dependent magnetic field. The magnetic heating can be eddy current heating, hysteresis heating, and/or heating by magnetic relaxation processes. An array of solder balls on a second substrate is brought to contact with the array of bonding pads. A reaction is initiated in the set of magnetic materials by an applied magnetic field. Rapid release of heat during a resulting reaction of the set of reactive materials to form a reacted material melts the solder balls and provides boding between the first substrate and the second substrate. Since the magnetic heating can be localized, the heating and warpage of the substrate can be minimized during the bonding process.
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公开(公告)号：US08987130B2
公开(公告)日：2015-03-24
申请号：US13482414
申请日：2012-05-29
IPC分类号： H01L21/76 , H01L23/498 , H01L23/00
CPC分类号： H01L24/17 , H01L23/49811 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L25/0657 , H01L2224/0401 , H01L2224/05572 , H01L2224/05582 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/131 , H01L2224/13124 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/13166 , H01L2224/13169 , H01L2224/13179 , H01L2224/16113 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/16501 , H01L2224/1713 , H01L2224/17163 , H01L2224/7525 , H01L2224/75264 , H01L2224/81192 , H01L2224/81222 , H01L2224/81455 , H01L2224/81457 , H01L2224/8146 , H01L2224/81466 , H01L2224/818 , H01L2224/81815 , H01L2924/00014 , H01L2924/01014 , H01L2924/0541 , H01L2924/2064 , H01L2924/20641 , H01L2224/81121 , H01L2924/00012 , H01L2224/757 , H01L2924/014 , H01L2224/05552
摘要： An array of bonding pads including a set of reactive materials is provided on a first substrate. The set of reactive materials is selected to be capable of ignition by magnetic heating induced by time-dependent magnetic field. The magnetic heating can be eddy current heating, hysteresis heating, and/or heating by magnetic relaxation processes. An array of solder balls on a second substrate is brought to contact with the array of bonding pads. A reaction is initiated in the set of magnetic materials by an applied magnetic field. Rapid release of heat during a resulting reaction of the set of reactive materials to form a reacted material melts the solder balls and provides boding between the first substrate and the second substrate. Since the magnetic heating can be localized, the heating and warpage of the substrate can be minimized during the bonding process.
摘要翻译： 包括一组反应性材料的焊盘阵列设置在第一衬底上。 通过由时间依赖磁场引起的磁加热，可以选择一组反应性材料。 磁加热可以是涡流加热，滞后加热和/或通过磁弛豫过程加热。 使第二基板上的焊球的阵列与焊盘的阵列接触。 通过施加的磁场在一组磁性材料中引发反应。 在一组反应性材料的反应期间，在形成反应的材料的反应中快速释放热量，熔化焊球并在第一基板和第二基板之间提供粘结。 由于磁加热可以被定位，所以在接合过程中可以最小化衬底的加热和翘曲。
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