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公开(公告)号：US08043454B1
公开(公告)日：2011-10-25
申请号：US12987851
申请日：2011-01-10
IPC分类号： C03B29/00
CPC分类号： H05K3/4061 , A61N1/3754 , H01L23/15 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H05K1/092 , Y10T428/24917 , Y10T428/24926 , H01L2924/00
摘要： The invention is a method of making a hermetic via in a ceramic substrate that is comprised of noble metal powder in a glass-free paste that contains an admixture of a particulate phase of niobium pentoxide. The electrically conductive platinum provides excellent electrical conductivity while the niobium pentoxide phase prevents shrinkage of the paste during thermal processing and binds to both the ceramic and the noble metal particulates in the via, thus maintaining a hermetic seal around the via.
摘要翻译： 本发明是一种在含有五氧化二铌颗粒相的混合物的无玻璃浆中的贵金属粉末的陶瓷基体中制造密封通孔的方法。 导电铂提供优异的导电性，同时五氧化二铌相防止在热加工期间膏的收缩，并且与通孔中的陶瓷和贵金属微粒结合，从而保持围绕通孔的气密性密封。
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公开(公告)号：US07901761B1
公开(公告)日：2011-03-08
申请号：US11694774
申请日：2007-03-30
IPC分类号： B32B9/00
CPC分类号： H05K3/4061 , A61N1/3754 , H01L23/15 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H05K1/092 , Y10T428/24917 , Y10T428/24926 , H01L2924/00
摘要： The invention is a hermetic via in a ceramic substrate that is comprised of noble metal powder in a glass-free paste that contains an admixture of a particulate phase of niobium pentoxide. The electrically conductive platinum provides excellent electrical conductivity while the niobium pentoxide phase prevents shrinkage of the paste during thermal processing and binds to both the ceramic and the noble metal particulates in the via, thus maintaining a hermetic seal around the via.
摘要翻译： 本发明是陶瓷基材中的密封通孔，其由含有五氧化二铌颗粒相的混合物的无玻璃浆中的贵金属粉末组成。 导电铂提供优异的导电性，同时五氧化二铌相防止在热加工期间膏的收缩，并且与通孔中的陶瓷和贵金属微粒结合，从而保持围绕通孔的气密性密封。
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公开(公告)号：US07157150B2
公开(公告)日：2007-01-02
申请号：US10823963
申请日：2004-04-14
CPC分类号： B32B15/015 , A61N1/372 , A61N1/37205 , A61N1/3752 , Y10T428/12014 , Y10T428/12632 , Y10T428/12806 , Y10T428/12812 , Y10T428/12937 , Y10T428/12979
摘要： A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a compact titanium-nickel filler material placed between the two parts and heated at a temperature that is less than the melting point of either the stainless steel part or the titanium part. The compact filler material is made of particles, preferably spheres, of discrete layers of nickel and titanium metal that react with each other and with the stainless and titanium parts to form a strong assembly when thermally processed. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the stainless steel part and the titanium part.
摘要翻译： 通过加热由钛部件，不锈钢部件和紧凑的钛 - 镍填充材料组成的部件组件，将不锈钢部件接合到钛部件的方法，所述部件组件位于两部分之间并在小于等于 不锈钢部件或钛部件的熔点。 紧凑的填充材料由颗粒，优选球体，由离散的镍和钛金属层制成，它们在热处理时彼此反应并与不锈钢和钛部分形成强大的组件。 组件组件在非反应性气氛中的温度下保持紧密接触足够的时间以在不锈钢部件和钛部件之间形成气密和牢固的结合。
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公开(公告)号：US06989200B2
公开(公告)日：2006-01-24
申请号：US10697149
申请日：2003-10-30
IPC分类号： B32B15/04 , B32B15/16 , B23K1/00 , B23K103/08 , B23K103/16
CPC分类号： B23K35/007 , B23K35/3033 , B23K35/325 , B23K35/38 , C04B37/023 , C04B37/026 , C04B2237/122 , C04B2237/708 , Y10T428/12535 , Y10T428/12611 , Y10T428/12632 , Y10T428/12812 , Y10T428/12875 , Y10T428/12944
摘要： The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a compatible interlayer material such as titanium-nickel alloy placed between the two parts and heated at a temperature that is greater than the eutectic temperature of the interlayer material, where alloys, intermetallics or solid solution formed between the metal part and the metal interlayer material, but that is less than the melting point of either the ceramic part or the metal part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the ceramic part and the metal part. The bonded component assembly is optionally treated with acid to remove unwanted materials, to assure a biocompatible component assembly for implantation in living tissue.
摘要翻译： 本发明是一种通过加热由金属部件，陶瓷部件和相容的中间层材料（例如放置在两部分之间的钛 - 镍合金）的组件组件将陶瓷部件接合到金属部件并在温度下加热的方法 大于中间层材料的共熔温度，其中在金属部件和金属夹层材料之间形成合金，金属间化合物或固溶体，但小于陶瓷部件或金属部件的熔点。 组件组件在非反应性气氛中的温度下保持紧密接触足够的时间以在陶瓷部件和金属部件之间形成气密和牢固的结合。 任选地用酸处理粘合组分组合物以除去不想要的材料，以确保用于植入生物体组织的生物相容性组分组件。
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公开(公告)号：US08140162B1
公开(公告)日：2012-03-20
申请号：US12390782
申请日：2009-02-23
IPC分类号： A61N1/375
CPC分类号： C04B35/6455 , A61N1/37205 , C04B35/486 , C04B2235/3225 , C04B2235/658 , C04B2235/77 , C04B2235/785 , C04B2235/94
摘要： The invention is directed to an apparatus substantially eliminating destructive low-temperature, humidity-enhanced phase transformation of yttria-stabilized zirconia in general, as well as eliminating low-temperature degradation of yttria-stabilized tetragonal zirconia polycrystalline ceramic (Y-TZP). The martensitic-type phase transformation from tetragonal to monoclinic is accompanied by severe strength degradation in a moist environment at low-temperature, specifically at room temperature as well as at body temperature. This class of materials has been chosen as the packaging material for small implantable neural-muscular sensors and stimulators because of the high fracture toughness and high mechanical strength. This destructive phase transformation has been substantially eliminated, thus ensuring the safety of long-term implants, by subjecting the sintered components to post-machining hot isostatic pressing, such that the average grain size is less than about 0.5 microns.
摘要翻译： 本发明涉及一种基本上消除氧化钇稳定化氧化锆的破坏性低温，增湿相变的装置，以及消除氧化钇稳定的四方晶氧化锆多晶陶瓷（Y-TZP）的低温退化。 在低温下，特别是在室温以及在体温下，在潮湿的环境中伴随着从四方晶向单斜晶的马氏体相转变。 由于高断裂韧性和高机械强度，这类材料已经被选为小型可植入神经 - 肌肉传感器和刺激器的包装材料。 已经基本上消除了这种破坏性相变，从而通过对烧结组件进行后加热等静压来确保长期植入物的安全性，使得平均晶粒尺寸小于约0.5微米。
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6.发明授权Material and method of forming yttria-stabilized zirconia to minimize low-temperature degradation 有权形成氧化钇稳定氧化锆的材料和方法，以尽量减少低温退化公开(公告)号：US07519419B2
公开(公告)日：2009-04-14
申请号：US10629291
申请日：2003-07-28
IPC分类号： A61N1/375
CPC分类号： C04B35/6455 , A61N1/37205 , C04B35/486 , C04B2235/3225 , C04B2235/658 , C04B2235/77 , C04B2235/785 , C04B2235/94
摘要： The invention is directed to a material and a method of substantially eliminating destructive low-temperature, humidity-enhanced phase transformation of yttria-stabilized zirconia in general, as well as eliminating low-temperature degradation of yttria-stabilized tetragonal zirconia polycrystalline ceramic (Y-TZP). The martensitic-type phase transformation from tetragonal to monoclinic is accompanied by severe strength degradation in a moist environment at low-temperature, specifically at room temperature as well as at body temperature. This class of materials has been chosen as the packaging material for small implantable neural-muscular sensors and stimulators because of the high fracture toughness and high mechanical strength. This destructive phase transformation has been substantially eliminated, thus ensuring the safety of long-term implants, by subjecting the sintered components to post-machining hot isostatic pressing, such that the average grain size is less than about 0.5 microns.
摘要翻译： 本发明涉及一般基本上消除氧化钇稳定氧化锆的破坏性低温，增湿相变的材料和方法，以及消除氧化钇稳定的四方晶氧化锆多晶陶瓷（Y- TZP）。 在低温下，特别是在室温以及在体温下，在潮湿的环境中伴随着从四方晶向单斜晶的马氏体相转变。 由于高断裂韧性和高机械强度，这类材料已经被选为小型可植入神经 - 肌肉传感器和刺激器的包装材料。 已经基本上消除了这种破坏性相变，从而通过对烧结组件进行后加热等静压来确保长期植入物的安全性，使得平均晶粒尺寸小于约0.5微米。
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公开(公告)号：US07331499B2
公开(公告)日：2008-02-19
申请号：US11212549
申请日：2005-08-27
IPC分类号： B23K31/02
CPC分类号： C04B37/023 , B23K20/233 , C04B35/645 , C04B2235/6581 , C04B2237/123 , C04B2237/343 , C04B2237/346 , C04B2237/348 , C04B2237/403 , C04B2237/52 , C04B2237/708
摘要： A method of bonding a ceramic part to a metal part by heating a component assembly including the metal part, the ceramic part, and a thin essentially pure interlayer material placed between the two parts heated at a temperature that is greater than the temperature of the eutectic formed between the metal part and the interlayer material, but that is less than the melting point of the interlayer material, the ceramic part or the metal part is disclosed. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the ceramic part and the metal part. The bonded assembly is optionally treated with acid to remove any residual free nickel and nickel salts to assure a biocompatible assembly for implantation in living tissue.
摘要翻译： 通过加热包括金属部件，陶瓷部件和薄的基本上纯的中间层材料的部件组合件将陶瓷部件粘合到金属部件上的方法，该中间层材料放置在两个部件之间，该部件在比共晶体的温度高 形成在金属部分和中间层材料之间，但是小于中间层材料的熔点，公开了陶瓷部件或金属部件。 组件组件在非反应性气氛中的温度下保持紧密接触足够的时间以在陶瓷部件和金属部件之间形成气密和牢固的结合。 粘合组件任选地用酸处理以除去任何残留的游离镍和镍盐，以确保用于植入生物组织的生物相容性组件。
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公开(公告)号：US06997071B2
公开(公告)日：2006-02-14
申请号：US10651462
申请日：2003-08-29
IPC分类号： G01N33/00
CPC分类号： C04B35/486 , C04B35/64 , C04B2235/3225 , C04B2235/662 , C04B2235/72 , C04B2235/765 , C04B2235/77 , C04B2235/785 , C04B2235/96 , C04B2235/963 , C04B2235/9684
摘要： The invention is a method of qualifying an implantable ceramic component made of high-purity dense yttria tetragonal zirconium oxide polycrystal (Y-TZP) by application of non-destructive tests. Specifically, a qualified Y-TZP ceramic component or witness sample is examined by X-ray diffraction to determine the initial monoclinic phase content. The component or witness sample is exposed to steam at 127° C. for a predetermined period of time, preferably six hours. The monoclinic phase content is determined for the post-exposure sample. The absolute difference between the initial monoclinic phase content and the post-exposure monoclinic phase content is calculated by difference. If the difference is less than 2.1% the sample is accepted. In an alternate embodiment, the components that pass the screening test are examined by ultrasonic testing to evaluate soundness of the ceramic component. Any component that presents a flaw of greater than three microns is rejected.
摘要翻译： 本发明是通过非破坏性试验对由高纯度致密氧化钇四方晶氧化锆多晶（Y-TZP）制成的可植入陶瓷组分进行鉴定的方法。 具体来说，通过X射线衍射检查合格的Y-TZP陶瓷组件或见证样品，以确定初始单斜相含量。 将组分或证人样品在127℃下暴露于预定时间段，优选6小时的蒸汽。 确定后曝光样品的单斜相含量。 通过差异计算初始单斜相相含量和曝光后单相相含量之间的绝对差异。 如果差异小于2.1％，样品被接受。 在替代实施例中，通过超声波测试来检查通过筛选测试的部件，以评估陶瓷部件的良好性。 任何呈现大于3微米的缺陷的组件都被拒绝。
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公开(公告)号：US06986453B2
公开(公告)日：2006-01-17
申请号：US10714193
申请日：2003-11-13
IPC分类号： B23K31/02
CPC分类号： C04B37/023 , B23K20/233 , C04B35/645 , C04B2235/6581 , C04B2237/123 , C04B2237/343 , C04B2237/346 , C04B2237/348 , C04B2237/403 , C04B2237/52 , C04B2237/708
摘要： The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a very thin essentially pure interlayer material of a compatible interlayer material placed between the two parts and heated at a temperature that is greater than the temperature of the eutectic formed between the metal part and the metal interlayer material, but that is less than the melting point of either the interlayer material, the ceramic part or the metal part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the ceramic part and the metal part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly for implantation in living tissue.
摘要翻译： 本发明是一种通过加热由金属部件，陶瓷部件组成的组件组件和位于两个部件之间的相容的夹层材料的非常薄的基本上纯的中间层材料来将陶瓷部件粘合到金属部件上并在 大于在金属部件和金属中间层材料之间形成的共晶体的温度，而不是中间层材料，陶瓷部件或金属部件的熔点的温度。 组件组件在非反应性气氛中的温度下保持紧密接触足够的时间以在陶瓷部件和金属部件之间形成气密和牢固的结合。 任选地用酸处理粘合组分组合物以除去任何残留的游离镍和镍盐，以确保用于植入生物组织的生物相容性组分组件。
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公开(公告)号：US08336191B1
公开(公告)日：2012-12-25
申请号：US11833887
申请日：2007-08-03
IPC分类号： H04R31/00
CPC分类号： H03H9/54 , H01L2224/48227 , H01L2224/48465 , H03H9/1021 , H05K13/04 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , H01L2924/00
摘要： An electronics filter circuit includes an electromechanical resonator that is mounted directly to the surface of a silicon integrated circuit, rather than being a surface mounted or leaded filter can on a circuit board. This filter circuit allows the integrated circuit electronic package to be significantly smaller than a conventional electromechanical resonator package. The electromechanical resonator may be protected during processing and during use with a protective cover that is made of a material such as titanium. The protective cover is attached to the integrated circuit chip.
摘要翻译： 电子滤波器电路包括直接安装到硅集成电路的表面的机电谐振器，而不是在电路板上的表面安装或引线的过滤器罐。 该滤波器电路允许集成电路电子封装显着小于常规机电谐振器封装。 机械共振器可以在加工期间和使用期间由诸如钛的材料制成的保护盖保护。 保护盖连接到集成电路芯片。
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