LIGHT DETECTION DEVICE
    2.
    发明公开

    公开(公告)号:US20230327039A1

    公开(公告)日:2023-10-12

    申请号:US18017866

    申请日:2021-07-07

    CPC classification number: H01L31/107 H01L31/02164

    Abstract: A photodetection device includes a photodetection element and a package. The photodetection element includes a semiconductor substrate and a light absorption film. The light absorption film is provided on a region of at least a part of a region around a photodetection region on a principal surface of the semiconductor substrate. The light absorption film has a multi-layer structure including a light absorption layer, a resonance layer, and a reflection layer. At a wavelength of detection target light, a light transmittance inside the resonance layer is larger than a light transmittance inside the light absorption layer, and a light reflectance on a surface of the reflection layer is larger than a light reflectance on a surface of the resonance layer.

    SEMICONDUCTOR LIGHT DETECTION ELEMENT
    3.
    发明公开

    公开(公告)号:US20230187462A1

    公开(公告)日:2023-06-15

    申请号:US17925409

    申请日:2021-05-17

    CPC classification number: H01L27/14629 H01L27/14649

    Abstract: A photodetection element includes a semiconductor substrate having a principal surface on which detection target light is incident and a rear surface, and including one or a plurality of photodetection regions on the principal surface side, and a light absorption film provided on the rear surface. The light absorption film includes a reflection layer being a metal layer, a resonance layer provided between the reflection layer and the substrate, and a light absorption layer provided between the resonance layer and the substrate. In at least one of a wavelength of the detection target light and a wavelength of spontaneous light, a light transmittance inside the resonance layer is larger than a light transmittance inside the light absorption layer, and a light reflectance on a surface of the reflection layer is larger than a light reflectance on a surface of the resonance layer.

    OPTICAL INTERFEROMETER
    5.
    发明申请

    公开(公告)号:US20180217001A1

    公开(公告)日:2018-08-02

    申请号:US15748286

    申请日:2015-09-03

    Abstract: An optical interferometer includes a branching-combining unit, a first optical system, a second optical system, and a drive unit. The branching-combining unit includes a branching surface, an incident surface, a first output surface, a combining surface, and a second output surface on an interface of a transparent member, the branching surface partially reflects incident light and outputs as first branched light, and transmits the rest of the incident light into the interior as second branched light, the combining surface partially combines the first branched light and the second branched light to be output to the outside as first combined light, and combines the rest of the first branched light and the second branched light to be propagated into the interior as second combined light, and the second output surface partially outputs the second combined light to the outside.

    METHOD FOR MANUFACTURING OPTICAL INTERFEROMETER
    6.
    发明申请
    METHOD FOR MANUFACTURING OPTICAL INTERFEROMETER 有权
    制造光学干涉仪的方法

    公开(公告)号:US20160202037A1

    公开(公告)日:2016-07-14

    申请号:US14911583

    申请日:2014-07-31

    CPC classification number: G01B9/02051 G01J3/0256 G01J3/4532 G01J3/4535

    Abstract: A method of manufacturing an optical interferometer includes a first step of forming a first semiconductor portion for a beam splitter and a second semiconductor portion for a movable mirror on a main surface of a support substrate and a first insulating layer formed on the main surface, a second step of disposing a first wall portion between a first side surface of the first semiconductor portion and a second side surface in the second semiconductor portion, and a third step of forming a mirror surface in the second semiconductor portion by forming a first metal film on the second side surface using a shadow mask. In the third step, the first side surface is masked by the mask portion and the first wall portion and the first metal film is formed in a state in which the second side portion is exposed from an opening portion.

    Abstract translation: 一种制造光干涉仪的方法包括:形成用于分束器的第一半导体部分和在支撑基板的主表面上形成的可移动反射镜的第二半导体部分和形成在主表面上的第一绝缘层的第一步骤, 在第一半导体部分的第一侧表面和第二半导体部分中的第二侧表面之间布置第一壁部分的第二步骤,以及通过在第二半导体部分中形成第一金属膜来形成第二半导体部分中的镜面的第三步骤 第二侧面使用荫罩。 在第三步骤中,第一侧表面被掩模部分掩蔽,并且第一壁部分和第一金属膜形成在第二侧部分从开口部分露出的状态。

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