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公开(公告)号：US20220201869A1
公开(公告)日：2022-06-23
申请号：US17131726
申请日：2020-12-22
Applicant: Hamilton Sundstrand Corporation
Inventor： Haralambos Cordatos , Xin Wu , Peter J. Walsh , Parag M. Kshirsagar
Abstract: A electronic component including a first protective layer covering the substrate and the conductive tract, a second protective layer covering at least a portion of the first protective layer, wherein the second protective layer includes Parylene, and a third protective layer covering at least a portion of the second protective layer.
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公开(公告)号：US20220200268A1
公开(公告)日：2022-06-23
申请号：US17133499
申请日：2020-12-23
Applicant: Hamilton Sundstrand Corporation
Inventor： Yongduk Lee , Xin Wu , Bo Liu , Parag M. Kshirsagar
Abstract: A solid state circuit breaker comprising, includes a first switch unit including, a first switch configured to be connected to a first terminal, a second switch connected to the first switch configured to be connected to a second terminal, a third switch connected to the second switch and configured to be connected to the second terminal, a fourth switch connected to the first switch and configured to be connected to the first terminal, and a fifth switch joining a connection of the first switch and the second switch to the connection of the third switch and the fourth switch.
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公开(公告)号：US11670967B1
公开(公告)日：2023-06-06
申请号：US17739809
申请日：2022-05-09
Applicant: Hamilton Sundstrand Corporation
Inventor： Yongduk Lee , Ankit Gupta , Parag M. Kshirsagar
CPC classification number: H02J50/10 , H02J50/12 , H02J50/80 , H03K17/145 , H03K17/687 , H05K7/20254 , H05K7/20372
Abstract: A device can include a first circuit configured to be exposed to a first environment, the first circuit comprising one or more first transfer inductors, and a second circuit isolated from the first circuit and configured to be exposed to a second environment, the second circuit comprising one or more second transfer inductors. The second environment can be a harsh environment. The first circuit and the second circuit can be wirelessly coupled via the one or more first transfer inductors and the one or more second transfer inductors to allow transfer of power and/or signals between the first circuit and the second circuit.
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公开(公告)号：US20220393585A1
公开(公告)日：2022-12-08
申请号：US17342229
申请日：2021-06-08
Applicant: Hamilton Sundstrand Corporation
Inventor： Yongduk Lee , Xin Wu , Parag M. Kshirsagar , Bo Liu
Abstract: Systems and methods of operating for a smart power router for boosting and protection are provided. Aspects include a power router comprising a plurality of terminals, a first DC power supply coupled to the first terminal, a second DC power supply coupled to the second terminal, a first power converter, an interface bi-directional switch coupled between the first terminal and the second terminal, a first bi-directional switch coupled between the first terminal and the third terminal, the first bi-directional switch comprising a first transistor and a second transistor, a first RL circuit, a controller configured to operate the power router in a plurality of modes comprising a first voltage boosting mode, wherein operating the power router in the first voltage boosting mode comprises operating the interface bi-directional switch in an on state, operating the first transistor in an off state, and operating the second transistor in a switching state.
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公开(公告)号：US20170197704A1
公开(公告)日：2017-07-13
申请号：US14993730
申请日：2016-01-12
Applicant: HAMILTON SUNDSTRAND CORPORATION
Inventor： Derick S. Balsiger , Parag M. Kshirsagar , Xin Wu
CPC classification number: B64C13/28 , G01D5/145 , G01D5/147 , G01D5/2013
Abstract: An electromechanical actuator includes a ground arm, an output arm rotatable about an axis of rotation relative to the ground arm and a position sensing arrangement to determine an angular position of the output arm relative to the ground arm. The position sensing arrangement includes a position sensor fixed at the ground arm. The position sensor is configured to sense magnetic reluctance. A sensed portion is located at the output arm proximate to the position sensor. The sensed portion includes a geometric variation in an output arm surface configured to vary a magnetic reluctance sensed at the position sensor as a function of angular position of the output arm relative to the ground arm.
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Patent Agency Ranking
公开(公告)号：US12193201B2
公开(公告)日：2025-01-07
申请号：US17847769
申请日：2022-06-23
Applicant: Hamilton Sundstrand Corporation
Inventor： Jin Lee , Yongduk Lee , Parag M. Kshirsagar
IPC: H05K7/20
Abstract: The present disclosure provides for cooling systems, assemblies and methods (e.g., for semiconductor devices; for refrigerant cooling; for cryogenic cooling). More particularly, the present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods for semiconductor devices (e.g., wide-bandgap (WBG) power semiconductor devices), with the cooling assemblies, systems and methods utilizing three-dimensional adaptive flow-paths using bi-metal fins. The present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods that may improve cooling performance and/or enable local cooling control. The present disclosure provides for bi-metal strips that operate as both the surface-temperature sensors and actuators without input energy. The bi-metal strips guide the coolant flow to a low-drag channel when the surface temperature is low, and guide the coolant flow to the near-surface channel when the surface temperature is high.
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公开(公告)号：US12088108B2
公开(公告)日：2024-09-10
申请号：US17342229
申请日：2021-06-08
Applicant: Hamilton Sundstrand Corporation
Inventor： Yongduk Lee , Xin Wu , Parag M. Kshirsagar , Bo Liu
CPC classification number: H02J4/00 , B64D41/00 , B64D2221/00 , H02M3/155
Abstract: Systems and methods of operating for a smart power router for boosting and protection are provided. Aspects include a power router comprising a plurality of terminals, a first DC power supply coupled to the first terminal, a second DC power supply coupled to the second terminal, a first power converter, an interface bi-directional switch coupled between the first terminal and the second terminal, a first bi-directional switch coupled between the first terminal and the third terminal, the first bi-directional switch comprising a first transistor and a second transistor, a first RL circuit, a controller configured to operate the power router in a plurality of modes comprising a first voltage boosting mode, wherein operating the power router in the first voltage boosting mode comprises operating the interface bi-directional switch in an on state, operating the first transistor in an off state, and operating the second transistor in a switching state.
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公开(公告)号：US20240063088A1
公开(公告)日：2024-02-22
申请号：US17889511
申请日：2022-08-17
Applicant: Hamilton Sundstrand Corporation
Inventor： Yongduk Lee , Ankit Gupta , Parag M. Kshirsagar
IPC: H01L23/44 , H01L23/473 , H05K7/20 , H05K1/02
CPC classification number: H01L23/445 , H01L23/473 , H05K7/20272 , H05K1/0203 , H05K7/20236
Abstract: Embodiments have two approaches as follows: (1) Embedded PCB-based fabrication and (2) PCB assembly-based fabrication. An embedded printed circuit board (PCB) type approach involves the creation of a space of coolant direct interconnection, using immersion cooling to link on any type of power semiconductor device hot spots to convectively and evaporatively cool directly. This means fabricating PCB embedded channels, to utilize the microgap between die and PCB as the cooling channel. A printed circuit board (PCB) assembly embodiment includes a PCB having at least one heat generating component. A lid is mounted to the PCB, wherein the lid defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path.
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公开(公告)号：US20240015881A1
公开(公告)日：2024-01-11
申请号：US17861584
申请日：2022-07-11
Inventor： Yongduk Lee , Parag M. Kshirsagar , Ankit Gupta
CPC classification number: H05K1/0209 , H05K1/144 , H05K2201/042 , H05K2201/064
Abstract: A printed circuit board (PCB) assembly includes a first PCB including at least one heat generating component. A second PCB is mounted to the first PCB. The second PCB defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path. A plurality of power pillars extend from the first PCB and across the cooling path.
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10.发明授权公开(公告)号：US11589464B2
公开(公告)日：2023-02-21
申请号：US17131726
申请日：2020-12-22
Applicant: Hamilton Sundstrand Corporation
Inventor： Haralambos Cordatos , Xin Wu , Peter J. Walsh , Parag M. Kshirsagar
IPC: H05K1/02 , H05K1/16 , H05K3/00 , H05K3/02 , H05K3/30 , H01L21/76 , B01L3/00 , G01N27/327 , H05K3/28
Abstract: A electronic component including a first protective layer covering the substrate and the conductive tract, a second protective layer covering at least a portion of the first protective layer, wherein the second protective layer includes Parylene, and a third protective layer covering at least a portion of the second protective layer.
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