公开(公告)号：US11808316B2

公开(公告)日：2023-11-07

申请号：US17852782

申请日：2022-06-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chung-Hua Ku ,  Chi Hao Chang

IPC: F16F1/36 ,  C08K3/04 ,  C08K3/36 ,  C08K5/09 ,  C08K13/02 ,  G11B33/08 ,  H01H13/14 ,  B82Y30/00 ,  B82Y40/00

CPC classification number: F16F1/3605 ,  C08K3/041 ,  C08K3/042 ,  C08K3/36 ,  C08K5/09 ,  C08K13/02 ,  G11B33/08 ,  H01H13/14 ,  B82Y30/00 ,  B82Y40/00 ,  C08K2201/006 ,  C08K2201/011 ,  C08K2201/014 ,  F16F2224/02 ,  F16F2224/025 ,  F16F2226/04 ,  H01H2221/062

Abstract: An electronic device can include a first electronic component, a second electronic component, and an energy dampener positioned between and in contact with the first electronic component and the second electronic component. The energy dampener in this example includes a carbon nanotube-aerogel matrix including carbon nanotubes embedded in an aerogel with a rubber composited therewith.

公开(公告)号：US20220089913A1

公开(公告)日：2022-03-24

申请号：US17424002

申请日：2019-05-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Super Liao ,  Chung-Hua Ku

IPC: C09J7/35 ,  C09J7/38

Abstract: The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive. The hot-melt adhesive can have a reduced bond strength at an elevated temperature. The re-workable adhesive can also include a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.

公开(公告)号：US10649498B2

公开(公告)日：2020-05-12

申请号：US15746123

申请日：2015-09-10

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chung-Hua Ku ,  Wei-Chung Chen ,  Wen-Hua Ni ,  Kuan-Ting Wu

IPC: G06F1/16 ,  H05K5/02

Abstract: In one example, a kickstand for a mobile computing device is described. The kickstand having a first end and a second end opposite the first end to rotatably couple to a first side and a second side of a housing of the mobile computing device, respectively, proximate the middle of the first side and the second side of the housing such that the U shaped kickstand provides the space for disposing the components in the housing without significantly affecting form factors and/or aesthetic aspects of the mobile computing device in typing, inking and retracted modes.

公开(公告)号：US11086367B2

公开(公告)日：2021-08-10

申请号：US16648787

申请日：2017-10-10

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chung-Hua Ku ,  Chi-Hao Chang ,  Kuan-Ting Wu

IPC: G06F1/16 ,  G11B33/08

Abstract: Computers are disclosed. An example computer includes a casing including a first casing portion and a second casing portion; a fastener; and a biasing element surrounding the fastener, the fastener to couple the first casing portion and the second casing portion and the biasing element to deter vibrations transmitted from the first casing portion to the fastener from affecting internal components of the computer.

公开(公告)号：US11046058B2

公开(公告)日：2021-06-29

申请号：US15746868

申请日：2015-08-18

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Cheng-Feng Liao ,  Wei-Chung Chen ,  Chung-Hua Ku

IPC: B32B27/08 ,  B32B27/36 ,  B32B5/26 ,  B32B27/12 ,  B32B27/30 ,  B32B27/34

Abstract: Examples of the present disclosure present a composite material. In an example, the composite material may comprise: a carbon fiber composite and a surface treatment layer. The carbon fiber composite may comprise a core layer having a first side and a second side opposite to the first side, and a first set of two carbon fiber layers disposed over at least a portion of the core layer respectively on the first side and the second side. Each of the first set of the two carbon fiber layers may comprise carbon fibers aligned in a first direction in a plane. The surface treatment layer may be disposed on the carbon fiber composite.

公开(公告)号：US20240040726A1

公开(公告)日：2024-02-01

申请号：US17877480

申请日：2022-07-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Rong-De Wang ,  Chien-Pai Lai ,  Chen-Ta Hung ,  Chung-Hua Ku

IPC: H05K5/02

CPC classification number: H05K5/0256

Abstract: In some examples, a locking card tray can include a first elongated side, a second elongated side located opposite the first elongated side, a first end side connected to the first elongated side and the second elongated side, a rack tray, and an elastic deformable member, where in response to an integrated circuit card being received by the rack tray, the elastic deformable member is to rotate from a first position to a second position such that the elastic deformable member protrudes from the locking card tray.

公开(公告)号：US20220397940A1

公开(公告)日：2022-12-15

申请号：US17635712

申请日：2019-11-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chung-Hua Ku ,  Kuo-Chih Huang ,  Hung-Sung Pan

IPC: G06F1/16 ,  E05C1/12

Abstract: An apparatus can comprise a cover coupleable to a computing device and a latch mechanism. An example latch mechanism is actuatable via insertion of a portion of a shaft through an aperture of the latch mechanism to cause the cover to be disengaged from the computing device.

公开(公告)号：US20200285284A1

公开(公告)日：2020-09-10

申请号：US16648787

申请日：2017-10-10

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chung-Hua Ku ,  Chi-Hao Chang ,  Kuan-Ting Wu

IPC: G06F1/16 ,  G11B33/08

Abstract: Computers are disclosed. An example computer includes a casing including a first casing portion and a second casing portion; a fastener; and a biasing element surrounding the fastener, the fastener to couple the first casing portion and the second casing portion and the biasing element to deter vibrations transmitted from the first casing portion to the fastener from affecting internal components of the computer.

公开(公告)号：US12054654B2

公开(公告)日：2024-08-06

申请号：US17424002

申请日：2019-05-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Super Liao ,  Chung-Hua Ku

IPC: C09J7/35 ,  C09J7/38

CPC classification number: C09J7/35 ,  C09J7/385 ,  C09J2203/318 ,  C09J2301/162 ,  C09J2301/302 ,  C09J2301/304 ,  C09J2400/163 ,  C09J2433/00 ,  C09J2475/00 ,  C09J2477/00

Abstract: The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive. The hot-melt adhesive can have a reduced bond strength at an elevated temperature. The re-workable adhesive can also include a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.

公开(公告)号：US20220320711A1

公开(公告)日：2022-10-06

申请号：US17633624

申请日：2019-10-04

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Pai-Cheng Huang ,  Kun-Jung Wu ,  Chung-Hua Ku ,  Chin-Hung Ma

IPC: H01Q1/22 ,  H01Q13/10 ,  H01Q3/01 ,  H01Q9/14

Abstract: Example electronic devices with adjustable antennas as disclosed. In an example, the electronic device includes a housing, and an antenna disposed within the housing. The antenna includes a slot extending between a first conductive surface and a second conductive surface, and a contact clip coupled to the first conductive surface and the second conductive surface so that the first conductive surface is coupled to the second conductive surface through the contact clip. The contact clip is to move along the slot to adjust an operating frequency of the antenna.