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    Exhaust gas processing device, and method of using the same
    1.
    发明申请
    Exhaust gas processing device, and method of using the same 失效
    废气处理装置及其使用方法

    公开(公告)号：US20060088452A1

    公开(公告)日：2006-04-27

    申请号：US10541153

    申请日：2004-01-29

    申请人： Hajime Okura ,  Toshio Katsube ,  Takayuki Saito

    发明人： Hajime Okura ,  Toshio Katsube ,  Takayuki Saito

    IPC分类号： B01D50/00 ,  B01D53/50

    CPC分类号： F23J15/06 ,  F23J15/02 ,  F23J15/08 ,  Y02E20/363

    摘要： In an exhaust gas processing device wherein in order to efficiently outwardly discharge heat at high temperatures of about 90-150° C. released from a GGH reheater during the shutdown of a desulfurizer, to prevent damage to equipment and corrosion preventive lining material, and to ensure long-term stabilized use of the exhaust gas processing device, at least a GGH heat recovery unit, an absorption tower, a mist eliminator (M/E), and the GGH reheater are placed in a duct for exhaust gases discharged from a fire furnace, in the order named as seen from the upstream side of a flow of exhaust gases, an exhaust gas duct between the M/E and the reheater is provided with a heat radiation device or the like having a heat suppression function for suppressing dissipated heat from the reheater.

    摘要翻译： 在废气处理装置中，为了在脱硫器关闭期间从GGH再热器释放的约90-150℃的高温有效地向外排出热量，以防止对设备和防腐蚀衬里材料的损坏，以及 确保废气处理装置的长期稳定使用，至少将GGH热回收单元，吸收塔，除雾器（M / E）和GGH再热器放置在用于从火中排出的废气的管道中 炉子以从废气流的上游侧看的顺序，M / E和再热器之间的排气管道设置有具有用于抑制散热的热抑制功能的散热装置等 从再热器。

    Exhaust gas processing device, and method of using the same
    2.
    发明授权
    Exhaust gas processing device, and method of using the same 失效
    废气处理装置及其使用方法

    公开(公告)号：US07651329B2

    公开(公告)日：2010-01-26

    申请号：US10541153

    申请日：2004-01-29

    申请人： Hajime Okura ,  Toshio Katsube ,  Takayuki Saito

    发明人： Hajime Okura ,  Toshio Katsube ,  Takayuki Saito

    IPC分类号： F23D14/00

    CPC分类号： F23J15/06 ,  F23J15/02 ,  F23J15/08 ,  Y02E20/363

    摘要： In an exhaust gas processing device wherein in order to efficiently outwardly discharge heat at high temperatures of about 90-150° C. released from a GGH reheater during the shutdown of a desulfurizer, to prevent damage to equipment and corrosion preventive lining material, and to ensure long-term stabilized use of the exhaust gas processing device, at least a GGH heat recovery unit, an absorption tower, a mist eliminator (M/E), and the GGH reheater are placed in a duct for exhaust gases discharged from a fire furnace, in the order named as seen from the upstream side of a flow of exhaust gases, an exhaust gas duct between the M/E and the reheater is provided with a heat radiation device or the like having a heat suppression function for suppressing dissipated heat from the reheater.

    摘要翻译： 在废气处理装置中，为了在脱硫器关闭期间从GGH再热器释放的约90-150℃的高温有效地向外排出热量，以防止对设备和防腐蚀衬里材料的损坏，以及 确保废气处理装置的长期稳定使用，至少将GGH热回收单元，吸收塔，除雾器（M / E）和GGH再热器放置在用于从火中排出的废气的管道中 炉子以从废气流的上游侧看的顺序，M / E和再热器之间的排气管道设置有具有用于抑制散热的热抑制功能的散热装置等 从再热器。

    Mass air flow measurement device
    3.
    发明授权
    Mass air flow measurement device 有权
    大气流量测量装置

    公开(公告)号：US08573041B2

    公开(公告)日：2013-11-05

    申请号：US13314591

    申请日：2011-12-08

    申请人： Takayuki Saito ,  Takayuki Yogo ,  Shinya Igarashi ,  Hiromu Kikawa

    发明人： Takayuki Saito ,  Takayuki Yogo ,  Shinya Igarashi ,  Hiromu Kikawa

    IPC分类号： G01M15/04

    CPC分类号： G01F1/6842 ,  G01F5/00 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An arrangement of a mass intake air flow measurement device suitable for integrating a humidity sensing device as well as a temperature sensing device and a pressure sensing device is provided. A second bypass passage 501 bypassing a bypass passage 205 is formed and a humidity sensing device 500 is mounted in the second bypass passage 501. A second bypass passage inlet 502 and a second bypass passage outlet 503 formed in a wall surface of the bypass passage 205 are opened parallel to the direction of flow of air flowing in the bypass passage 205.

    摘要翻译： 提供了一种适合于集成湿度感测装置以及温度感测装置和压力感测装置的大量进气流量测量装置的布置。 形成旁通旁路通路205的第二旁路通路501，在第二旁路通路501中安装湿度检测装置500.形成在旁通路205的壁面的第二旁路通路入口502和第二旁路通路出口503 平行于在旁路通路205中流动的空气的流动方向开口。

    Sensor structure
    4.
    发明授权
    Sensor structure 有权
    传感器结构

    公开(公告)号：US08549901B2

    公开(公告)日：2013-10-08

    申请号：US13367939

    申请日：2012-02-07

    申请人： Takayuki Saito ,  Keiji Hanzawa ,  Takayuki Yogo

    发明人： Takayuki Saito ,  Keiji Hanzawa ,  Takayuki Yogo

    IPC分类号： G01M15/04

    CPC分类号： G01F1/6842 ,  F02D41/187 ,  G01F5/00

    摘要： In relation to a humidity sensor sensitive to water and contamination, a sensor implementation structure that achieves both protection performance against water and contaminants and measurement performance such as humidity responsiveness is provided. A sensor structure has a mass airflow measurement element that measures a mass airflow flowing in an intake pipe, a humidity sensing element that senses humidity of air flowing in the intake pipe, a housing structural component having a connector that carries out input/output to/from outside and a terminal component of the connector, and a bypass passage that is composed by using part of the housing structural component and takes in part of the air that flows in the intake pipe, the mass airflow measurement element being mounted in the bypass passage; wherein space is provided in the housing structural component in the vicinity of the bypass passage, the humidity sensing element is mounted in the space.

    摘要翻译： 关于对水和污染物敏感的湿度传感器，提供了实现对水和污染物的保护性能以及诸如湿度响应性的测量性能的传感器实施结构。 传感器结构具有测量进气管中流动的质量气流的质量气流测量元件，感测进气管中流动的空气湿度的湿度感测元件，具有连接器的壳体结构部件，该连接器将输入/ 从连接器的外部和端子部件和旁通通路构成，所述旁通通路由使用所述壳体结构部件的一部分而占据所述进气管中流动的一部分空气，所述质量空气流量测量元件安装在所述旁路通路 ; 其中在所述外壳结构部件中在所述旁通通路附近设置空间，所述湿度感测元件安装在所述空间中。

    Table
    7.
    外观设计
    Table 有权

    公开(公告)号：USD644855S1

    公开(公告)日：2011-09-13

    申请号：US29357684

    申请日：2010-03-16

    申请人： Takayuki Saito

    设计人： Takayuki Saito

    THREE-DIMENSIONAL SHAPE MEASURING METHOD AND DEVICE
    8.
    发明申请
    THREE-DIMENSIONAL SHAPE MEASURING METHOD AND DEVICE 审中-公开
    三维形状测量方法和装置

    公开(公告)号：US20100231923A1

    公开(公告)日：2010-09-16

    申请号：US12721084

    申请日：2010-03-10

    申请人： Zongtao GE ,  Masaaki Tomimizu ,  Hideo Kanda ,  Takayuki Saito ,  Noboru Koizumi ,  Seiji Mochitate ,  Shigeyuki Takano ,  Hiroyuki Iwazaki

    发明人： Zongtao GE ,  Masaaki Tomimizu ,  Hideo Kanda ,  Takayuki Saito ,  Noboru Koizumi ,  Seiji Mochitate ,  Shigeyuki Takano ,  Hiroyuki Iwazaki

    IPC分类号： G01B11/25

    CPC分类号： G01B11/2441 ,  G01M11/0221 ,  G01M11/025 ,  G01M11/0271

    摘要： A process of measuring a shape while changing the relative posture of an microscopic interferometer to a sample lens which is rotated about a rotation axis is divided into a process of measuring a top surface in a state where the sample lens is supported from a back surface and a process of measuring a back surface in a state where the sample lens is supported from the top surface. By combining first shape information of a flange side surface acquired by the process of measuring the top surface and second shape information of the flange side surface acquired by the process of measuring the back surface, the relative positional relation between the sample top surface and the sample back surface is calculated.

    摘要翻译： 在将微型干涉仪相对于相对于旋转轴线旋转的样本透镜的相对姿势变化的同时测量形状的处理被划分为从背面支撑样本透镜的状态下测量顶面的处理， 在从上表面支撑样本透镜的状态下测量背面的处理。 通过组合通过测量上表面获得的凸缘侧表面的第一形状信息和通过测量背面的处理获得的凸缘侧表面的第二形状信息，样本顶表面和样本之间的相对位置关系 计算背面。

    Substrate processing apparatus and substrate processing method
    9.
    发明申请
    Substrate processing apparatus and substrate processing method 审中-公开
    基板加工装置及基板处理方法

    公开(公告)号：US20090090397A1

    公开(公告)日：2009-04-09

    申请号：US12314197

    申请日：2008-12-05

    申请人： Takayuki Saito ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Kenya Ito ,  Masayuki Kamezawa ,  Kenji Yamaguchi

    发明人： Takayuki Saito ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Kenya Ito ,  Masayuki Kamezawa ,  Kenji Yamaguchi

    IPC分类号： B08B3/04

    CPC分类号： H01L21/6708 ,  B08B3/02 ,  Y10S134/902

    摘要： The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder 11 for holding a substrate W substantially horizontally and rotating the substrate W, and a processing liquid supply unit 15 for supplying a processing liquid onto a peripheral portion of the substrate W which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate W. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder 54 for holding a substrate W substantially horizontally and rotating the substrate W, and a cleaning liquid supply unit 53 having a cleaning liquid outlet 53a which is oriented from a center of the substrate W toward a peripheral portion of the substrate W with an elevation angle of not more than 45° from a surface of the substrate W. The cleaning liquid supply unit 53 supplies a cleaning liquid to the surface of the substrate W at a flow velocity of not less than 0.1 m/s.

    摘要翻译： 本发明提供一种适用于腐蚀形成在基板的周边部分上的薄膜的蚀刻装置中的基板处理装置和基板处理方法。 本发明还提供一种适用于在已被蚀刻的基板上进行清洗处理的清洗装置的基板处理装置和基板处理方法。 用于蚀刻的基板处理装置包括基板保持器11，用于基本上水平地保持基板W并旋转基板W;以及处理液体供应单元15，用于将处理液体供应到正在旋转的基板W的周边部分 处理液体相对于基板W是静止的。用于清洗基板的基板处理装置包括：基板保持件54，用于基本上水平地保持基板W并旋转基板W;以及清洗液供给部 单元53具有从基板W的中心朝向基板W的周边部分取向的清洗液出口53a，其与基板W的表面的仰角不大于45°。清洗液供给单元53 以不小于0.1m / s的流速将清洗液供给到基板W的表面。

    Substrate processing apparatus and substrate processing method
    10.
    发明授权
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号：US07476290B2

    公开(公告)日：2009-01-13

    申请号：US10695826

    申请日：2003-10-30

    申请人： Takayuki Saito ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Kenya Ito ,  Masayuki Kamezawa ,  Kenji Yamaguchi

    发明人： Takayuki Saito ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Kenya Ito ,  Masayuki Kamezawa ,  Kenji Yamaguchi

    IPC分类号： B08B7/04

    CPC分类号： H01L21/6708 ,  B08B3/02 ,  Y10S134/902

    摘要： The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder for holding a substrate substantially horizontally and rotating the substrate, and a processing liquid supply unit for supplying a processing liquid onto a peripheral portion of the substrate which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder for holding a substrate substantially horizontally and rotating the substrate, and a cleaning liquid supply unit having a cleaning liquid outlet which is oriented from a center of the substrate toward a peripheral portion of the substrate with an elevation angle of not more than 45° from a surface of the substrate. The cleaning liquid supply unit supplies a cleaning liquid to the surface of the substrate at a flow velocity of not less than 0.1 m/s.

    摘要翻译： 本发明提供一种适用于腐蚀形成在基板的周边部分上的薄膜的蚀刻装置中的基板处理装置和基板处理方法。 本发明还提供一种适用于在已被蚀刻的基板上进行清洗处理的清洗装置的基板处理装置和基板处理方法。 用于蚀刻的基板处理装置包括：基板保持器，用于基本上水平地保持基板并旋转基板;以及处理液体供应单元，用于将处理液体供应到正在旋转的基板的周边部分， 处理液相对于基板静止。 用于清洗基板的基板处理装置包括基板保持器，用于基本水平地保持基板并旋转基板;以及清洗液供给单元，其具有从基板的中心朝向基板的周边部分 该衬底的仰角与衬底的表面不超过45°。 清洗液供给部以不小于0.1m / s的流速向基板的表面供给清洗液。