公开(公告)号：US5255333A

公开(公告)日：1993-10-19

申请号：US896918

申请日：1992-06-11

申请人： Hans-Ludwig Althaus ,  Ralf Dietrich ,  Erich Hufgard ,  Werner Spaeth

发明人： Hans-Ludwig Althaus ,  Ralf Dietrich ,  Erich Hufgard ,  Werner Spaeth

IPC分类号： G02B6/42 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/58 ,  G02B6/28

CPC分类号： H01L33/483 ,  G02B6/4204 ,  G02B6/4238 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58 ,  G02B6/4225 ,  G02B6/4226

摘要： An opto-electronic transducer having a lens-type optical coupling wherein a lens within a lens carrier is arranged in the beam path immediately in front of the transducer. The lens carrier, together with the lens, are fixed to a fastening part by a fastening layer that is adjusted relative to the beam axis of the transducer. The fastening part is part of a common carrier for the transducer. The opto-electronic transducer and the lens carrier together with the lens are secured on the common carrier in such a spacial relationship relative to one another that the beam axis of the transducer is perpendicular to the surface formed by the fastening layer. The opto-electronic transducer of the invention is particularly suited for use as a light waveguide transmission or reception component or, alternatively, as an individual light source.

摘要翻译： 一种具有透镜型光耦合器的光电传感器，其中透镜载体内的透镜被立即布置在传感器前面的光束路径中。 透镜载体与透镜一起通过相对于换能器的光束轴线调整的紧固层固定到紧固部分。 紧固部分是传感器的公共载体的一部分。 光电传感器和透镜载体与透镜一起以相对于彼此的这种空间关系固定在共同的载体上，使得换能器的束轴垂直于由紧固层形成的表面。 本发明的光电换能器特别适合用作光波导传输或接收部件，或者作为单个光源。

公开(公告)号：US5875205A

公开(公告)日：1999-02-23

申请号：US799494

申请日：1997-02-12

申请人： Werner Spaeth ,  Wolfgang Gramann ,  Hans-Ludwig Althaus ,  Ralf Dietrich

发明人： Werner Spaeth ,  Wolfgang Gramann ,  Hans-Ludwig Althaus ,  Ralf Dietrich

IPC分类号： H01L33/00 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/18 ,  H01S3/19

CPC分类号： H01S5/02284 ,  H01S5/02292 ,  H01S5/0201 ,  H01S5/02248 ,  H01S5/0683

摘要： In an optoelectronic component having a laser chip as a light transmitter and a lens coupling optics for defined emission of radiation generated in the laser chip, the lens coupling optics is arranged immediately in front of the laser chip and is adjusted and fixed in stable fashion in a simple way. The component is rationally manufactured in a wafer union. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers, and that are inclined at an angle of 45.degree. relative to the resonator faces. Thus the radiation generated in the laser chip is directed nearly perpendicularly upward to the surface of the common carrier and the lens coupling optics is arranged on at least the one carrier part such that the radiation generated in the laser chip impinges this lens optics nearly perpendicularly.

摘要翻译： 在具有作为光发射器的激光芯片和用于在激光芯片中产生的辐射的定义发射的透镜耦合光学器件的光电子部件中，透镜耦合光学器件被立即布置在激光器芯片的前面，并且以稳定的方式被调整和固定 一个简单的方法。 该组件在晶片联合中合理制造。 激光芯片布置在两个载体部件之间的公共载体上，其相对于激光芯片的谐振器面的侧表面设置有镜层，并且相对于谐振器面倾斜45度。 因此，在激光芯片中产生的辐射几乎垂直地向上引导到公共载体的表面，并且透镜耦合光学器件被布置在至少一个载体部分上，使得在激光器芯片中产生的辐射几乎垂直地撞击该透镜光学器件。

公开(公告)号：US5566265A

公开(公告)日：1996-10-15

申请号：US361519

申请日：1994-12-22

申请人： Werner Spaeth ,  Wolfgang Gramann ,  Hans-Ludwig Althaus ,  Ralf Dietrich

发明人： Werner Spaeth ,  Wolfgang Gramann ,  Hans-Ludwig Althaus ,  Ralf Dietrich

IPC分类号： G02B6/34 ,  G02B6/42 ,  H01L27/15 ,  H01S5/00 ,  H01S5/022 ,  H01S5/026 ,  H01S5/18 ,  H01S5/42 ,  H04B10/00 ,  G02B6/00 ,  G02B6/36

CPC分类号： G02B6/29361 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4227 ,  G02B6/4238 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02292 ,  H01S5/0683

摘要： A bidirectional transceiver module for message and signal transmission via a light waveguide is formed of a lens coupling optics, a laser chip as a light transmitter, a light receiver, and a beam splitter intervening in the beam path. These parts are at least partially surrounded by a housing. They are designed such that, given reduced manufacturing expense, a lens coupling optics arranged immediately in front of the laser chip can be adjusted in a simple way and can be fixed in stable fashion. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers and are inclined at an angle of approximately 45.degree. relative to the resonator faces for beam deflection onto the lens coupling optics secured above the laser chip on at least one carrier part. The mirror layer neighboring the front side of the laser chip is provided with the beam splitter. The light receiver or an optical coupling for this is provided at the underside of the common carrier.

摘要翻译： 用于通过光波导的消息和信号传输的双向收发器模块由透镜耦合光学器件，作为光发射器的激光芯片，光接收器和插入在光束路径中的分束器形成。 这些部件至少部分地由壳体包围。 它们被设计成使得在减少的制造成本的情况下，立即在激光芯片前面布置的透镜耦合光学元件可以以简单的方式进行调节并且可以以稳定的方式固定。 激光芯片布置在两个载体部件之间的公共载体上，其侧表面与激光芯片的谐振器面相邻设置有镜层，并且相对于共振器面以大约45°的角度倾斜以用于在透镜上的光束偏转 耦合光学器件固定在激光芯片上方的至少一个载体部分上。 与激光芯片的前侧相邻的镜面层设置有分束器。 光接收器或光耦合器设置在公共载体的下侧。

公开(公告)号：US5981945A

公开(公告)日：1999-11-09

申请号：US614836

申请日：1996-03-08

申请人： Werner Spaeth ,  Wolfgang Gramann ,  Georg Bogner ,  Ralf Dietrich

发明人： Werner Spaeth ,  Wolfgang Gramann ,  Georg Bogner ,  Ralf Dietrich

IPC分类号： G02B6/42 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58 ,  H01J5/02

CPC分类号： H01L33/58 ,  G02B6/4204 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/32225

摘要： An optoelectronic transducer includes a base plate, a radiation-emitting or transmitting semiconductor component disposed on the base plate, an optical lens system aimed at the semiconductor component and a spacer joined to the base plate for the lens system. The base plate, the spacer and the lens system are formed of materials with at least similar coefficients of thermal expansion. A method for producing an optoelectronic transducer includes forming indentations in a base plate for receiving semiconductor components, while leaving a land remaining on at least one side of each of the indentations. A first plate of the size of the base plate is placed on the lands and joined to the lands by material locking. The first plate is removed between the lands producing spacers joined to the base plate. A number of the semiconductor components are inserted into the indentations in accordance with a predetermined grid pattern and are joined to the base plate to form substrates. The substrates are covered with a second plate including a number of lens systems correspopnding to number of semiconductor components, while placing the lens systems of the second plate in the same grid pattern. The second plate is adjusted relative to the substrates for aiming each of the lens systems at a respective one of the semiconductor components. The second plate is secured to the substrates.

摘要翻译： 光电转换器包括基板，设置在基板上的辐射发射或透射半导体部件，瞄准半导体部件的光学透镜系统和连接到透镜系统的基板的间隔件。 基板，间隔件和透镜系统由具有至少相似的热膨胀系数的材料形成。 一种光电子换能器的制造方法包括：在基板中形成用于接收半导体部件的凹陷部，同时留下残留在每个压痕的至少一侧上的焊盘。 基板的尺寸的第一板被放置在平台上，并通过材料锁定而接合到平台上。 第一板在连接到基板的间隔件之间移除。 根据预定的格栅图案将多个半导体部件插入到凹陷中，并且与基板接合以形成基板。 在将第二板的透镜系统放置在相同的格栅图案中的同时，用包括多个半导体部件的多个透镜系统的第二板覆盖基板。 相对于基板调整第二板，以将每个透镜系统瞄准相应的一个半导体部件。 第二板固定在基板上。

公开(公告)号：US5066090A

公开(公告)日：1991-11-19

申请号：US569624

申请日：1990-08-20

申请人： Franz Mayerhofer ,  Holger Karstensen ,  Ralf Dietrich ,  Werner Spaeth

发明人： Franz Mayerhofer ,  Holger Karstensen ,  Ralf Dietrich ,  Werner Spaeth

IPC分类号： G02B6/42 ,  G02B7/02

CPC分类号： G02B7/027 ,  G02B6/4204 ,  G02B6/4225 ,  G02B6/4238 ,  Y10S359/90

摘要： An optical coupling element having a convex, refractive microlens is characterized by a ball having a flat, planar surface being mounted in a through-hole of a carrier lamina with the flat, planar surface extending parallel to a planar surface of the lamina. The coupling element is preferably made by a method which involves forming a through-hole in a lamina, mounting a ball in the through-hole, processing a surface of the ball to form the planar surface that extends parallel to a surface of the lamina. Preferably, a plurality of coupling elements are formed by providing a plurality of through-holes in an enlarged carrier and after processing, each individual coupling element is then separated from this enlarged carrier.

摘要翻译： 具有凸折射微透镜的光耦合元件的特征在于具有平坦的平坦表面的球，其平坦的平面表面安装在载体层的通孔中，平坦的平面表面平行于层的平面延伸。 耦合元件优选地通过一种方法来制造，该方法包括在层中形成通孔，将球安装在通孔中，处理球的表面以形成平行于层的表面延伸的平面。 优选地，通过在扩大的载体中设置多个通孔来形成多个耦合元件，并且在处理之后，每个单独的耦合元件然后与该放大的载体分离。

公开(公告)号：US06693312B2

公开(公告)日：2004-02-17

申请号：US10200420

申请日：2002-07-22

申请人： Ralf Dietrich ,  Mathias Kämpf ,  Wolfgang Gramann ,  Martin Weigert

发明人： Ralf Dietrich ,  Mathias Kämpf ,  Wolfgang Gramann ,  Martin Weigert

IPC分类号： H01L310328

CPC分类号： G02B6/4246 ,  G02B6/4214 ,  G02B6/423

摘要： A photo-optical transmitter assembly is produced in the following manner: a glass wafer is fixed onto a transparent submount and a V-shaped recess is subsequently created between optical prism elements using targeted sawcuts. A rod-shaped element with a reflective coating is inserted into the V-shaped recess. A laser beam from a semiconductor laser is thus deflected by 90° on the rod-shaped element with the reflective coating and traverses the submount.

摘要翻译： 以下列方式生产光电发射机组件：将玻璃晶片固定在透明底座上，随后使用目标锯齿形成在光学棱镜元件之间的V形凹槽。 将具有反射涂层的棒状元件插入到V形凹部中。 因此，来自半导体激光器的激光束在具有反射涂层的棒状元件上偏转90°，并穿过底座。

公开(公告)号：US5907151A

公开(公告)日：1999-05-25

申请号：US863357

申请日：1997-05-27

申请人： Wolfgang Gramann ,  Georg Bogner ,  Ralf Dietrich ,  Martin Weigert

发明人： Wolfgang Gramann ,  Georg Bogner ,  Ralf Dietrich ,  Martin Weigert

IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/58 ,  H01J40/14

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L33/0095

摘要： An optoelectronic transducer has a radiation-emitting and/or radiation-receiving body on a carrier unit. The carrier unit has a mounting surface provided with a number of terminal parts. The terminal parts are provided with electrical terminal areas defining a contacting plane. The distance of the contacting plane from the mounting surface is greater than a maximum height of the body from the mounting surface, including all optional electrical conductors and covers.

摘要翻译： 光电转换器在载体单元上具有辐射发射和/或辐射接收体。 承载单元具有设置有多个端子部的安装面。 端子部分设置有限定接触平面的电端子区域。 接触平面与安装表面的距离大于主体与安装表面的最大高度，包括所有可选的电导体和盖。

公开(公告)号：US5705025A

公开(公告)日：1998-01-06

申请号：US539198

申请日：1995-10-04

申请人： Ralf Dietrich ,  Gerhard Franz

发明人： Ralf Dietrich ,  Gerhard Franz

IPC分类号： G02B6/124 ,  G02B3/00 ,  H01L21/00

CPC分类号： G02B6/1245 ,  Y10S438/978

摘要： A method for dry etching of a semiconductor substrate includes producing convex structures on a surface of a semiconductor wafer by using a suitable masking and a suitable etchant. A thick photoresist layer is applied to a semiconductor wafer and structured. The structured photoresist layer is liquified by the influence of temperature to produce a spherical structure and is then hardened as an etchable masking. The semiconductor wafer structured with the photoresist layer is etched in plasma at etching speeds being similar for the semiconductor material and the photoresist, for transferring a convex structure of the photoresist layer to the semiconductor wafer, during etching down of the photoresist layer.

摘要翻译： 用于干蚀刻半导体衬底的方法包括通过使用合适的掩模和合适的蚀刻剂在半导体晶片的表面上产生凸起结构。 将厚的光致抗蚀剂层施加到半导体晶片并构造。 结构化光致抗蚀剂层通过温度的影响而液化以产生球形结构，然后作为可蚀刻掩模进行硬化。 用蚀刻速度与半导体材料和光致抗蚀剂类似的蚀刻速度等离子体蚀刻由光致抗蚀剂层构成的半导体晶片，用于在蚀刻光致抗蚀剂层期间将光致抗蚀剂层的凸起结构转移到半导体晶片。