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    Optoelectronic transducer formed of a semiconductor component and a lens system
    1.
    发明授权
    Optoelectronic transducer formed of a semiconductor component and a lens system 失效
    由半导体元件和透镜系统形成的光电换能器

    公开(公告)号：US5981945A

    公开(公告)日：1999-11-09

    申请号：US614836

    申请日：1996-03-08

    申请人： Werner Spaeth ,  Wolfgang Gramann ,  Georg Bogner ,  Ralf Dietrich

    发明人： Werner Spaeth ,  Wolfgang Gramann ,  Georg Bogner ,  Ralf Dietrich

    IPC分类号： G02B6/42 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58 ,  H01J5/02

    CPC分类号： H01L33/58 ,  G02B6/4204 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/32225

    摘要： An optoelectronic transducer includes a base plate, a radiation-emitting or transmitting semiconductor component disposed on the base plate, an optical lens system aimed at the semiconductor component and a spacer joined to the base plate for the lens system. The base plate, the spacer and the lens system are formed of materials with at least similar coefficients of thermal expansion. A method for producing an optoelectronic transducer includes forming indentations in a base plate for receiving semiconductor components, while leaving a land remaining on at least one side of each of the indentations. A first plate of the size of the base plate is placed on the lands and joined to the lands by material locking. The first plate is removed between the lands producing spacers joined to the base plate. A number of the semiconductor components are inserted into the indentations in accordance with a predetermined grid pattern and are joined to the base plate to form substrates. The substrates are covered with a second plate including a number of lens systems correspopnding to number of semiconductor components, while placing the lens systems of the second plate in the same grid pattern. The second plate is adjusted relative to the substrates for aiming each of the lens systems at a respective one of the semiconductor components. The second plate is secured to the substrates.

    摘要翻译： 光电转换器包括基板，设置在基板上的辐射发射或透射半导体部件，瞄准半导体部件的光学透镜系统和连接到透镜系统的基板的间隔件。 基板，间隔件和透镜系统由具有至少相似的热膨胀系数的材料形成。 一种光电子换能器的制造方法包括：在基板中形成用于接收半导体部件的凹陷部，同时留下残留在每个压痕的至少一侧上的焊盘。 基板的尺寸的第一板被放置在平台上，并通过材料锁定而接合到平台上。 第一板在连接到基板的间隔件之间移除。 根据预定的格栅图案将多个半导体部件插入到凹陷中，并且与基板接合以形成基板。 在将第二板的透镜系统放置在相同的格栅图案中的同时，用包括多个半导体部件的多个透镜系统的第二板覆盖基板。 相对于基板调整第二板，以将每个透镜系统瞄准相应的一个半导体部件。 第二板固定在基板上。

    Optoelectronic component and method for the manufacture thereof
    2.
    发明授权
    Optoelectronic component and method for the manufacture thereof 失效
    光电子元件及其制造方法

    公开(公告)号：US5875205A

    公开(公告)日：1999-02-23

    申请号：US799494

    申请日：1997-02-12

    申请人： Werner Spaeth ,  Wolfgang Gramann ,  Hans-Ludwig Althaus ,  Ralf Dietrich

    发明人： Werner Spaeth ,  Wolfgang Gramann ,  Hans-Ludwig Althaus ,  Ralf Dietrich

    IPC分类号： H01L33/00 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/18 ,  H01S3/19

    CPC分类号： H01S5/02284 ,  H01S5/02292 ,  H01S5/0201 ,  H01S5/02248 ,  H01S5/0683

    摘要： In an optoelectronic component having a laser chip as a light transmitter and a lens coupling optics for defined emission of radiation generated in the laser chip, the lens coupling optics is arranged immediately in front of the laser chip and is adjusted and fixed in stable fashion in a simple way. The component is rationally manufactured in a wafer union. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers, and that are inclined at an angle of 45.degree. relative to the resonator faces. Thus the radiation generated in the laser chip is directed nearly perpendicularly upward to the surface of the common carrier and the lens coupling optics is arranged on at least the one carrier part such that the radiation generated in the laser chip impinges this lens optics nearly perpendicularly.

    摘要翻译： 在具有作为光发射器的激光芯片和用于在激光芯片中产生的辐射的定义发射的透镜耦合光学器件的光电子部件中，透镜耦合光学器件被立即布置在激光器芯片的前面，并且以稳定的方式被调整和固定 一个简单的方法。 该组件在晶片联合中合理制造。 激光芯片布置在两个载体部件之间的公共载体上，其相对于激光芯片的谐振器面的侧表面设置有镜层，并且相对于谐振器面倾斜45度。 因此，在激光芯片中产生的辐射几乎垂直地向上引导到公共载体的表面，并且透镜耦合光学器件被布置在至少一个载体部分上，使得在激光器芯片中产生的辐射几乎垂直地撞击该透镜光学器件。

    Transmission and reception module for a bidirectional, optical message and signal transmission
    4.
    发明授权
    Transmission and reception module for a bidirectional, optical message and signal transmission 失效
    发送和接收模块，用于双向，光消息和信号传输

    公开(公告)号：US5566265A

    公开(公告)日：1996-10-15

    申请号：US361519

    申请日：1994-12-22

    申请人： Werner Spaeth ,  Wolfgang Gramann ,  Hans-Ludwig Althaus ,  Ralf Dietrich

    发明人： Werner Spaeth ,  Wolfgang Gramann ,  Hans-Ludwig Althaus ,  Ralf Dietrich

    IPC分类号： G02B6/34 ,  G02B6/42 ,  H01L27/15 ,  H01S5/00 ,  H01S5/022 ,  H01S5/026 ,  H01S5/18 ,  H01S5/42 ,  H04B10/00 ,  G02B6/00 ,  G02B6/36

    CPC分类号： G02B6/29361 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4227 ,  G02B6/4238 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02292 ,  H01S5/0683

    摘要： A bidirectional transceiver module for message and signal transmission via a light waveguide is formed of a lens coupling optics, a laser chip as a light transmitter, a light receiver, and a beam splitter intervening in the beam path. These parts are at least partially surrounded by a housing. They are designed such that, given reduced manufacturing expense, a lens coupling optics arranged immediately in front of the laser chip can be adjusted in a simple way and can be fixed in stable fashion. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers and are inclined at an angle of approximately 45.degree. relative to the resonator faces for beam deflection onto the lens coupling optics secured above the laser chip on at least one carrier part. The mirror layer neighboring the front side of the laser chip is provided with the beam splitter. The light receiver or an optical coupling for this is provided at the underside of the common carrier.

    摘要翻译： 用于通过光波导的消息和信号传输的双向收发器模块由透镜耦合光学器件，作为光发射器的激光芯片，光接收器和插入在光束路径中的分束器形成。 这些部件至少部分地由壳体包围。 它们被设计成使得在减少的制造成本的情况下，立即在激光芯片前面布置的透镜耦合光学元件可以以简单的方式进行调节并且可以以稳定的方式固定。 激光芯片布置在两个载体部件之间的公共载体上，其侧表面与激光芯片的谐振器面相邻设置有镜层，并且相对于共振器面以大约45°的角度倾斜以用于在透镜上的光束偏转 耦合光学器件固定在激光芯片上方的至少一个载体部分上。 与激光芯片的前侧相邻的镜面层设置有分束器。 光接收器或光耦合器设置在公共载体的下侧。

    Method for fabricating an optical transmitting subassembly
    7.
    发明授权
    Method for fabricating an optical transmitting subassembly 失效
    光发射子组件的制造方法

    公开(公告)号：US06693312B2

    公开(公告)日：2004-02-17

    申请号：US10200420

    申请日：2002-07-22

    申请人： Ralf Dietrich ,  Mathias Kämpf ,  Wolfgang Gramann ,  Martin Weigert

    发明人： Ralf Dietrich ,  Mathias Kämpf ,  Wolfgang Gramann ,  Martin Weigert

    IPC分类号： H01L310328

    CPC分类号： G02B6/4246 ,  G02B6/4214 ,  G02B6/423

    摘要： A photo-optical transmitter assembly is produced in the following manner: a glass wafer is fixed onto a transparent submount and a V-shaped recess is subsequently created between optical prism elements using targeted sawcuts. A rod-shaped element with a reflective coating is inserted into the V-shaped recess. A laser beam from a semiconductor laser is thus deflected by 90° on the rod-shaped element with the reflective coating and traverses the submount.

    摘要翻译： 以下列方式生产光电发射机组件：将玻璃晶片固定在透明底座上，随后使用目标锯齿形成在光学棱镜元件之间的V形凹槽。 将具有反射涂层的棒状元件插入到V形凹部中。 因此，来自半导体激光器的激光束在具有反射涂层的棒状元件上偏转90°，并穿过底座。

    Method for encapsulating at least one organic light-emitting (OLED) device and OLED device
    9.
    发明申请
    Method for encapsulating at least one organic light-emitting (OLED) device and OLED device 有权
    用于封装至少一种有机发光（OLED）器件和OLED器件的方法

    公开(公告)号：US20060128042A1

    公开(公告)日：2006-06-15

    申请号：US11268338

    申请日：2005-11-07

    申请人： Wolfgang Gramann ,  Ewald Guenther

    发明人： Wolfgang Gramann ,  Ewald Guenther

    IPC分类号： H01L21/00

    CPC分类号： H01L51/5259 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/525

    摘要： A method for encapsulating at least one organic light-emitting (OLED) device (22) comprising the step of forming a concave region (24) on a plate (6) by applying a negative pressure to a predetermined area of the plate. The plate is attached to a substrate (1) comprising at least one active region (23) such that the concave region (24) of the plate (6) spans over the active region (23). Also disclosed is a OLED device (22), in which at least a part of an encapsulation of the device is formed by applying a negative pressure to a predetermined area of a plate (6) forming a concave region (24) of the plate (6).

    摘要翻译： 一种用于封装至少一个有机发光（OLED）器件（22）的方法，包括通过向板的预定区域施加负压来在板（6）上形成凹区（24）的步骤。 板被附接到包括至少一个有源区（23）的衬底（1），使得板（6）的凹区（24）跨越有源区（23）。 还公开了一种OLED器件（22），其中通过向形成板的凹区域（24）的板（6）的预定区域施加负压来形成装置的至少一部分封装（22） 6）。

    Method for measuring product parameters of components formed on a wafer and device for performing the method
    10.
    发明授权
    Method for measuring product parameters of components formed on a wafer and device for performing the method 有权
    用于测量在晶片上形成的部件的产品参数的方法和用于执行该方法的装置

    公开(公告)号：US06946864B2

    公开(公告)日：2005-09-20

    申请号：US10078146

    申请日：2002-02-19

    申请人： Wolfgang Gramann ,  Raimund Oberschmid ,  Werner Späth ,  Wolfgang Teich

    发明人： Wolfgang Gramann ,  Raimund Oberschmid ,  Werner Späth ,  Wolfgang Teich

    IPC分类号： G01N21/66 ,  G01R31/28

    CPC分类号： G01N21/66

    摘要： A measuring arrangement for measuring product parameters of a component in the epitaxial layer (28) of a wafer comprises measuring probe (3) on whose contact side (23) a recess (24) is installed, into which an electrolyte can be poured. The electrolyte produces an electrical connection between a contact body (11), which is charged with a signal from a pulsed-current source, and the surface (22) of the wafer (2). A detector (16) serves for detecting the light which is emitted by the component.

    摘要翻译： 用于测量晶片的外延层（28）中的部件的产品参数的测量装置包括测量探针（3），其上安装有接触侧（23）的凹部（24），可以将电解液倒入其中。 电解液在与脉冲电流源的信号充电的接触体（11）和晶片（2）的表面（22）之间产生电连接。 检测器（16）用于检测由该部件发出的光。