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    Method for fabricating an optical transmitting subassembly
    1.
    发明授权
    Method for fabricating an optical transmitting subassembly 失效
    光发射子组件的制造方法

    公开(公告)号：US06693312B2

    公开(公告)日：2004-02-17

    申请号：US10200420

    申请日：2002-07-22

    申请人： Ralf Dietrich ,  Mathias Kämpf ,  Wolfgang Gramann ,  Martin Weigert

    发明人： Ralf Dietrich ,  Mathias Kämpf ,  Wolfgang Gramann ,  Martin Weigert

    IPC分类号： H01L310328

    CPC分类号： G02B6/4246 ,  G02B6/4214 ,  G02B6/423

    摘要： A photo-optical transmitter assembly is produced in the following manner: a glass wafer is fixed onto a transparent submount and a V-shaped recess is subsequently created between optical prism elements using targeted sawcuts. A rod-shaped element with a reflective coating is inserted into the V-shaped recess. A laser beam from a semiconductor laser is thus deflected by 90° on the rod-shaped element with the reflective coating and traverses the submount.

    摘要翻译： 以下列方式生产光电发射机组件：将玻璃晶片固定在透明底座上，随后使用目标锯齿形成在光学棱镜元件之间的V形凹槽。 将具有反射涂层的棒状元件插入到V形凹部中。 因此，来自半导体激光器的激光束在具有反射涂层的棒状元件上偏转90°，并穿过底座。

    Optical sensing head and method for fabricating the sensing head
    2.
    发明授权
    Optical sensing head and method for fabricating the sensing head 有权
    光学感测头及其制造方法

    公开(公告)号：US07223952B2

    公开(公告)日：2007-05-29

    申请号：US10667717

    申请日：2003-09-22

    申请人： Ulrich Steegmüller ,  Wolfgang Gramann ,  Frank Singer ,  Jürgen Dachs ,  Mathias Kämpf

    发明人： Ulrich Steegmüller ,  Wolfgang Gramann ,  Frank Singer ,  Jürgen Dachs ,  Mathias Kämpf

    IPC分类号： G01B7/00

    CPC分类号： G11B7/1263 ,  G02B6/4214 ,  G11B7/123 ,  G11B7/22

    摘要： An optical sensing head, which is for reading out an optical data memory, has a substrate with a main surface. An edge-emitting laser component is configured on the main surface of the substrate and has irradiation axis oriented essentially parallel to the first main plane. A deflection device is arranged on the main surface of the substrate and deflects the laser radiation in a direction that is essentially perpendicular to the main surface. At least one signal detector is provided for sensing the laser radiation that is reflected by the optical data memory. An optical element guides the deflected laser radiation to the optical data memory and guides reflected laser radiation to the signal detector. The optical element is connected to the substrate by at least one supporting element. The invention also includes a method for fabricating such a sensing head.

    摘要翻译： 用于读出光学数据存储器的光学检测头具有具有主表面的基板。 边缘发射激光器部件被构造在基板的主表面上，并具有基本上平行于第一主平面定向的照射轴。 偏转装置设置在基板的主表面上，并使激光辐射沿基本垂直于主表面的方向偏转。 提供至少一个信号检测器用于感测由光学数据存储器反射的激光辐射。 光学元件将偏转的激光辐射引导到光学数据存储器并将反射的激光辐射引导到信号检测器。 光学元件通过至少一个支撑元件连接到基板。 本发明还包括一种用于制造这种感测头的方法。

    Method for producing a plurality of optoelectronic semiconductor chips
    5.
    发明授权
    Method for producing a plurality of optoelectronic semiconductor chips 有权
    多个光电子半导体芯片的制造方法

    公开(公告)号：US08916403B2

    公开(公告)日：2014-12-23

    申请号：US13580491

    申请日：2011-02-03

    申请人： Ewald K. M. Günther ,  Mathias Kämpf ,  Jens Dennemarck ,  Nikolaus Gmeinwieser

    发明人： Ewald K. M. Günther ,  Mathias Kämpf ,  Jens Dennemarck ,  Nikolaus Gmeinwieser

    IPC分类号： H01L21/00 ,  H01L33/08 ,  H01L27/15 ,  H01L21/78 ,  B28D5/00

    CPC分类号： H01L27/153 ,  B28D5/0011 ,  H01L21/78

    摘要： A method for producing a plurality of optoelectronic semiconductor chips includes providing a carrier wafer having a first surface and a second surface opposite the first surface, wherein a plurality of individual component layer sequences spaced apart from one another in a lateral direction are applied on the first surface, the component layer sequences being separated from one another by separation trenches; introducing at least one crystal imperfection in at least one region of the carrier wafer which at least partly overlaps a separation trench in a vertical direction; singulating the carrier wafer along the at least one crystal imperfection into individual semiconductor chips.

    摘要翻译： 一种制造多个光电子半导体芯片的方法包括提供具有第一表面和与第一表面相对的第二表面的载体晶片，其中在横向上彼此间隔开的多个单独的部件层序列被施加在第一 表面，组分层序列通过分离沟槽彼此分离; 在载体晶片的至少一个区域中引入至少一个在垂直方向上至少部分地与分离沟槽重叠的晶体缺陷; 将载体晶片沿着至少一个晶体缺陷分离成单独的半导体芯片。

    METHOD FOR PRODUCING A PLURALITY OF OPTOELECTRONIC SEMICONDUCTOR CHIPS
    7.
    发明申请
    METHOD FOR PRODUCING A PLURALITY OF OPTOELECTRONIC SEMICONDUCTOR CHIPS 有权
    用于生产多光子半导体晶体管的方法

    公开(公告)号：US20130069086A1

    公开(公告)日：2013-03-21

    申请号：US13580491

    申请日：2011-02-03

    申请人： Ewald K. M. Günther ,  Mathias Kämpf ,  Jens Dennemarck ,  Nikolaus Gmeinwieser

    发明人： Ewald K. M. Günther ,  Mathias Kämpf ,  Jens Dennemarck ,  Nikolaus Gmeinwieser

    IPC分类号： H01L33/08

    CPC分类号： H01L27/153 ,  B28D5/0011 ,  H01L21/78

    摘要： A method for producing a plurality of optoelectronic semiconductor chips includes providing a carrier wafer having a first surface and a second surface opposite the first surface. wherein a plurality of individual component layer sequences spaced apart from one another in a lateral direction are applied on the first surface, the component layer sequences being separated from one another by separation trenches; introducing at least one crystal imperfection in at least one region of the carrier wafer which at least partly overlaps a separation trench in a vertical direction; singulating the carrier wafer along the at least one crystal imperfection into individual semiconductor.

    摘要翻译： 一种制造多个光电子半导体芯片的方法包括提供具有第一表面和与第一表面相对的第二表面的载体晶片。 其中在横向上彼此间隔开的多个单独组分层序列施加在第一表面上，组分层序列通过分离沟槽彼此分离; 在载体晶片的至少一个区域中引入至少一个在垂直方向上至少部分地与分离沟槽重叠的晶体缺陷; 将载体晶片沿着至少一个晶体缺陷分离成单个半导体。

    Method for producing a semiconductor body
    8.
    发明授权
    Method for producing a semiconductor body 有权
    半导体本体的制造方法

    公开(公告)号：US09324615B2

    公开(公告)日：2016-04-26

    申请号：US14111655

    申请日：2012-04-04

    申请人： Korbinian Perzlmaier ,  Heribert Zull ,  Franz Eberhard ,  Thomas Veit ,  Mathias Kämpf ,  Jens Dennemarck

    发明人： Korbinian Perzlmaier ,  Heribert Zull ,  Franz Eberhard ,  Thomas Veit ,  Mathias Kämpf ,  Jens Dennemarck

    IPC分类号： H01L21/00 ,  H01L21/78 ,  H01L33/00 ,  H01S5/02

    CPC分类号： H01L33/0095 ,  H01L21/78 ,  H01L2924/0002 ,  H01S5/0201 ,  H01L2924/00

    摘要： A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has, at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of: removing the transmissive layer within the separating region, applying an absorbent layer within the separating region, increasing the absorption coefficient of the transmissive layer within the separating region, and separating the chip regions along the separating regions by a laser.

    摘要翻译： 一种制造半导体本体的方法包括提供具有至少两个芯片区域和布置在芯片区域之间的至少一个分离区域的半导体晶片，其中半导体晶片包括层序列，其最外层具有至少在 分离区域对电磁辐射透射的透射层，执行以下至少一个：去除分离区域内的透射层，在分离区域内施加吸收层，增加分离区域内的透射层的吸收系数，以及分离 通过激光沿分离区域的芯片区域。