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公开(公告)号:US07581314B2
公开(公告)日:2009-09-01
申请号:US11358823
申请日:2006-02-21
申请人: Hariklia Deligianni , Panayotis Andricacos , L. Paivikki Buchwalter , John M. Cotte , Christopher Jahnes , Mahadevaiyer Krishnan , John H. Magerlein , Kenneth Stein , Richard P. Volant , James A. Tornello , Jennifer Lund
发明人: Hariklia Deligianni , Panayotis Andricacos , L. Paivikki Buchwalter , John M. Cotte , Christopher Jahnes , Mahadevaiyer Krishnan , John H. Magerlein , Kenneth Stein , Richard P. Volant , James A. Tornello , Jennifer Lund
IPC分类号: H01K3/10
CPC分类号: H01H59/0009 , H01H2001/0052 , Y10T29/49156 , Y10T29/49165 , Y10T29/49204
摘要: A semiconductor micro-electromechanical system (MEMS) switch provided with noble metal contacts that act as an oxygen barrier to copper electrodes is described. The MEMS switch is fully integrated into a CMOS semiconductor fabrication line. The integration techniques, materials and processes are fully compatible with copper chip metallization processes and are typically, a low cost and a low temperature process (below 400° C.). The MEMS switch includes: a movable beam within a cavity, the movable beam being anchored to a wall of the cavity at one or both ends of the beam; a first electrode embedded in the movable beam; and a second electrode embedded in an wall of the cavity and facing the first electrode, wherein the first and second electrodes are respectively capped by the noble metal contact.
摘要翻译: 描述了提供有作为铜电极的氧阻隔的贵金属触点的半导体微机电系统(MEMS)开关。 MEMS开关完全集成到CMOS半导体制造线中。 集成技术,材料和工艺完全兼容铜芯片金属化工艺,通常是低成本和低温工艺(低于400℃)。 MEMS开关包括:在空腔内的可移动光束,可移动光束在光束的一端或两端锚定到空腔的壁; 嵌入可移动光束中的第一电极; 以及第二电极,其嵌入在所述空腔的壁中并且面向所述第一电极,其中所述第一和第二电极分别被所述贵金属接触物覆盖。
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公开(公告)号:US07202764B2
公开(公告)日:2007-04-10
申请号:US10604278
申请日:2003-07-08
申请人: Hariklia Deligianni , Panayotis Andricacos , L. Paivikki Buchwalter , John M. Cotte , Christopher Jahnes , Mahadevaiyer Krishnan , John H. Magerlein , Kenneth Stein , Richard P. Volant , James A. Tornello , Jennifer Lund
发明人: Hariklia Deligianni , Panayotis Andricacos , L. Paivikki Buchwalter , John M. Cotte , Christopher Jahnes , Mahadevaiyer Krishnan , John H. Magerlein , Kenneth Stein , Richard P. Volant , James A. Tornello , Jennifer Lund
IPC分类号: H01H51/22
CPC分类号: H01H59/0009 , H01H2001/0052 , Y10T29/49156 , Y10T29/49165 , Y10T29/49204
摘要: A semiconductor micro-electromechanical system (MEMS) switch provided with noble metal contacts that act as an oxygen barrier to copper electrodes is described. The MEMS switch is fully integrated into a CMOS semiconductor fabrication line. The integration techniques, materials and processes are fully compatible with copper chip metallization processes and are typically, a low cost and a low temperature process (below 400° C.). The MEMS switch includes: a movable beam within a cavity, the movable beam being anchored to a wall of the cavity at one or both ends of the beam; a first electrode embedded in the movable beam; and a second electrode embedded in an wall of the cavity and facing the first electrode, wherein the first and second electrodes are respectively capped by the noble metal contact.
摘要翻译: 描述了提供有作为铜电极的氧阻隔的贵金属触点的半导体微机电系统(MEMS)开关。 MEMS开关完全集成到CMOS半导体制造线中。 集成技术,材料和工艺完全兼容铜芯片金属化工艺,通常是低成本和低温工艺(低于400℃)。 MEMS开关包括:在空腔内的可移动光束,可移动光束在光束的一端或两端锚定到空腔的壁; 嵌入可移动光束中的第一电极; 以及第二电极,其嵌入在所述空腔的壁中并且面向所述第一电极,其中所述第一和第二电极分别被所述贵金属接触物覆盖。
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公开(公告)号:US20060164194A1
公开(公告)日:2006-07-27
申请号:US11358823
申请日:2006-02-21
申请人: Hariklia Deligianni , Panayotis Andricacos , L. Paivikki Buchwalter , John Cotte , Christopher Jahnes , Mahadevaiyer Krishnan , John Magerlein , Kenneth Stein , Richard Volant , James Tornello , Jennifer Lund
发明人: Hariklia Deligianni , Panayotis Andricacos , L. Paivikki Buchwalter , John Cotte , Christopher Jahnes , Mahadevaiyer Krishnan , John Magerlein , Kenneth Stein , Richard Volant , James Tornello , Jennifer Lund
IPC分类号: H01H51/22
CPC分类号: H01H59/0009 , H01H2001/0052 , Y10T29/49156 , Y10T29/49165 , Y10T29/49204
摘要: A semiconductor micro-electromechanical system (MEMS) switch provided with noble metal contacts that act as an oxygen barrier to copper electrodes is described. The MEMS switch is fully integrated into a CMOS semiconductor fabrication line. The integration techniques, materials and processes are fully compatible with copper chip metallization processes and are typically, a low cost and a low temperature process (below 400° C.). The MEMS switch includes: a movable beam within a cavity, the movable beam being anchored to a wall of the cavity at one or both ends of the beam; a first electrode embedded in the movable beam; and a second electrode embedded in an wall of the cavity and facing the first electrode, wherein the first and second electrodes are respectively capped by the noble metal contact.
摘要翻译: 描述了提供有作为铜电极的氧阻隔的贵金属触点的半导体微机电系统(MEMS)开关。 MEMS开关完全集成到CMOS半导体制造线中。 集成技术,材料和工艺完全兼容铜芯片金属化工艺,通常是低成本和低温工艺(低于400℃)。 MEMS开关包括:在空腔内的可移动光束,可移动光束在光束的一端或两端锚定到空腔的壁; 嵌入可移动光束中的第一电极; 以及第二电极,其嵌入在所述空腔的壁中并且面向所述第一电极,其中所述第一和第二电极分别被所述贵金属接触物覆盖。
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公开(公告)号:US20050007217A1
公开(公告)日:2005-01-13
申请号:US10604278
申请日:2003-07-08
申请人: Hariklia Deligianni , Panayotis Andricacos , L. Buchwalter , John Cotte , Christopher Jahnes , Mahadevaiyer Krishnan , John Magerlein , Kenneth Stein , Richard Volant , James Tornello , Jennifer Lund
发明人: Hariklia Deligianni , Panayotis Andricacos , L. Buchwalter , John Cotte , Christopher Jahnes , Mahadevaiyer Krishnan , John Magerlein , Kenneth Stein , Richard Volant , James Tornello , Jennifer Lund
CPC分类号: H01H59/0009 , H01H2001/0052 , Y10T29/49156 , Y10T29/49165 , Y10T29/49204
摘要: A semiconductor micro-electromechanical system (MEMS) switch provided with noble metal contacts that act as an oxygen barrier to copper electrodes is described. The MEMS switch is fully integrated into a CMOS semiconductor fabrication line. The integration techniques, materials and processes are fully compatible with copper chip metallization processes and are typically, a low cost and a low temperature process (below 400°0 C.). The MEMS switch includes: a movable beam within a cavity, the movable beam being anchored to a wall of the cavity at one or both ends of the beam; a first electrode embedded in the movable beam; and a second electrode embedded in an wall of the cavity and facing the first electrode, wherein the first and second electrodes are respectively capped by the noble metal contact.
摘要翻译: 描述了提供有作为铜电极的氧阻隔的贵金属触点的半导体微机电系统(MEMS)开关。 MEMS开关完全集成到CMOS半导体制造线中。 集成技术,材料和工艺完全兼容铜芯片金属化工艺,通常是低成本和低温工艺(低于400°C)。 MEMS开关包括:在空腔内的可移动光束,可移动光束在光束的一端或两端锚定到空腔的壁; 嵌入可移动光束中的第一电极; 以及第二电极,其嵌入在所述空腔的壁中并且面向所述第一电极,其中所述第一和第二电极分别被所述贵金属接触物覆盖。
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公开(公告)号:US20050156695A1
公开(公告)日:2005-07-21
申请号:US11053732
申请日:2005-02-08
申请人: Panayotis Andricacos , L. Buchwalter , Hariklia Deligianni , Robert Groves , Christopher Jahnes , Jennifer Lund , Michael Meixner , David Seeger , Timothy Sullivan , Ping-Chuan Wang
发明人: Panayotis Andricacos , L. Buchwalter , Hariklia Deligianni , Robert Groves , Christopher Jahnes , Jennifer Lund , Michael Meixner , David Seeger , Timothy Sullivan , Ping-Chuan Wang
CPC分类号: H01H59/0009 , H01H2001/0078
摘要: A microelectromechanical switch including: at least one pair of actuator electrodes; at least one input electrode and at least one output electrode for input and output, respectively, of a radio frequency signal; and a beam movable by an attraction between the at least one pair of actuator electrodes, the movable beam having at least a portion electrically connected to the at least one input electrode and to the at least one output electrode when moved by the attraction between the at least one pair of actuator electrodes to make an electrical connection between the at least one input and output electrodes; wherein the at least one pair of actuator electrodes are electrically isolated from each of the at least one input and output electrodes. The microelectromechanical switch can be configured in single or multiple-poles and/or single or multiple throws.
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公开(公告)号:US20050024169A1
公开(公告)日:2005-02-03
申请号:US10915742
申请日:2004-08-11
CPC分类号: H01H59/0009 , H01H2001/0068 , H01H2001/0078
摘要: A switch comprising a substrate, an elongated movable part, a pair of electrical contacts disposed at one side of said part, an actuation electrode disposed at the one side of the part and separated from the pair of electrical contacts, wherein the part, the contacts and the electrode are disposed on the substrate, wherein the elongated movable part is arranged and dimensioned such that the part is movable in a generally lateral direction toward the contacts; the movable part includes a central elongated member fixed to a head having an electrical contact disposed at the one side. One end of the movable part is attached to the substrate by means of various anchoring arrangements.
摘要翻译: 一种开关,其包括基板,细长可动部分,设置在所述部分一侧的一对电触点,设置在该部分的一侧并与所述一对电触头分离的致动电极,其中所述部分,所述触点 并且所述电极设置在所述基板上,其中所述细长可动部分被布置和尺寸设定成使得所述部件能够沿大致横向方向朝向所述触点移动; 可移动部分包括固定到头部的中心细长构件,其具有设置在一侧的电触头。 可移动部分的一端通过各种锚定装置附接到基板。
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公开(公告)号:US20060017533A1
公开(公告)日:2006-01-26
申请号:US10523310
申请日:2002-08-26
IPC分类号: H01H51/22
CPC分类号: H01H59/0009
摘要: A micro-electromechanical (MEM) RF switch provided with a deflectable membrane (60) activates a switch contact or plunger (40). The membrane incorporates interdigitated metal electrodes (70) which cause a stress gradient in the membrane when activated by way of a DC electric field. The stress gradient results in a predictable bending or displacement of the membrane (60), and is used to mechanically displace the switch contact (30). An RF gap area (25) located within the cavity (250) is totally segregated from the gaps (71) between the interdigitated metal electrodes (70). The membrane is electrostatically displaced in two opposing directions, thereby aiding to activate and deactivate the switch. The micro-electromechanical switch includes: a cavity (250); at least one conductive path (20) integral to a first surface bordering the cavity; a flexible membrane (60) parallel to the first surface bordering the cavity (250), the flexible membrane (60) having a plurality of actuating electrodes (70); and a plunger (40) attached to the flexible membrane (60) in a direction away from the actuating electrodes (70), the plunger (40) having a conductive surface that makes electric contact with the conductive paths, opening and closing the switch.
摘要翻译: 设置有可偏转膜(60)的微机电(MEM)RF开关激活开关触点或柱塞(40)。 膜包含交叉指向的金属电极(70),其通过DC电场激活时引起膜中的应力梯度。 应力梯度导致膜(60)的可预测的弯曲或位移,并且用于机械地移动开关触点(30)。 位于空腔(250)内的RF间隙区域(25)与交叉指向的金属电极(70)之间的间隙(71)完全分离。 膜在两个相反的方向上静电位移,从而有助于启动和停用开关。 微机电开关包括:空腔(250); 至少一个导电通路(20),与所述空腔相邻的第一表面成一体; 柔性膜(60),其平行于与所述腔(250)接壤的所述第一表面,所述柔性膜(60)具有多个致动电极(70); 以及沿远离所述致动电极(70)的方向附接到所述柔性膜(60)的柱塞(40),所述柱塞(40)具有导电表面,所述导电表面与所述导电路径电接触,所述开关闭合。
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