摘要:
A non-volatile memory device includes a substrate, an active region, an isolation layer, a tunnel insulation layer, a floating gate, a dielectric layer and a control gate. The active region includes an upper active region having a first width, and a lower active region beneath the upper active region and having a second width substantially larger than the first width. The isolation layer is adjacent to the active region. The tunnel insulation layer is on the upper active region. The floating gate is on the tunnel insulation layer and has a third width substantially larger than the first width. The dielectric layer is on the floating layer. The control gate is on the dielectric layer.
摘要:
A non-volatile memory device includes field insulating layer patterns on a substrate to define an active region of the substrate, upper portions of the field insulating layer patterns protruding above an upper surface of the substrate, a tunnel insulating layer on the active region, a charge trapping layer on the tunnel insulating layer, a blocking layer on the charge trapping layer, first insulating layers on upper surfaces of the field insulating layer patterns, and a word line structure on the blocking layer and first insulating layers.
摘要:
In some embodiments, a semiconductor memory device includes a substrate that includes a cell array region and a peripheral circuit region. The semiconductor memory device further includes a device isolation pattern on the substrate. The device isolation pattern defines a first active region and a second active region within the cell array region and a third active region in the peripheral circuit region. The semiconductor memory device further includes a first common source region, a plurality of first source/drain regions, and a first drain region in the first active region. The semiconductor memory device further includes a second common source region, a plurality of second source/drain regions, and a second drain region in the second active region. The semiconductor memory device further includes a third source/drain region in the third active region. The semiconductor memory device further includes a common source line contacting the first and second common source regions.
摘要:
Coupling among adjacent rows of memory cells on an integrated circuit substrate may reduced by forming the adjacent rows of memory cells on adjacent semiconductor pedestals that extend different distances away from the integrated circuit substrate. NAND flash memory devices that include different pedestal heights and fabrication methods for integrated circuit memory devices are also disclosed.
摘要:
A method of programming data in a NAND flash memory device including at least one even bitline and at least one odd bitline, the method including programming N-bit data into first cells coupled to the at least one even bitline or the at least one odd bitline and programming M-bit data into second cells coupled to the other of the at least one even bitline and the at least one odd bitline, where N is a natural number greater than one and M is a natural number greater than N.
摘要:
A fin type MOSFET and a method of manufacturing the fin type MOSFET are disclosed. Gate structures in the fin type MOSFET are formed by a damascene process without a photolithography process. Impurities used to form a channel region are selectively implanted into portions of a semiconductor substrate adjacent to the gate structures.
摘要:
A non-volatile memory device includes field insulating layer patterns on a substrate to define an active region of the substrate, upper portions of the field insulating layer patterns protruding above an upper surface of the substrate, a tunnel insulating layer on the active region, a charge trapping layer on the tunnel insulating layer, a blocking layer on the charge trapping layer, first insulating layers on upper surfaces of the field insulating layer patterns, and a word line structure on the blocking layer and first insulating layers.
摘要:
Methods of programming data in a non-volatile memory cell are provided. A memory cell according to some embodiments may include a gate structure that includes a tunnel oxide layer pattern, a floating gate, a dielectric layer and a control gate sequentially stacked on a substrate, impurity regions that are formed in the substrate at both sides of the gate structure, and a conductive layer pattern that is arranged spaced apart from and facing the floating gate. Embodiments of such methods may include applying a programming voltage to the control gate, grounding the impurity regions and applying a fringe voltage to the conductive layer pattern to generate a fringe field in the floating gate.
摘要:
A method of forming a semiconductor device pattern, a method of forming a charge storage pattern, a non-volatile memory device including a charge storage pattern and a method of manufacturing the same are provided. The method of forming the charge storage pattern including forming a trench on a substrate, and a device isolation pattern in the trench. The device isolation pattern protrudes from a surface of the substrate such that an opening exposing the substrate is formed. A tunnel oxide layer is formed on the substrate in the opening. A preliminary charge storage pattern is formed on the tunnel oxide layer and the device isolation pattern by selective deposition of conductive materials. The preliminary charge storage pattern may be removed from the device isolation pattern. The preliminary charge storage pattern remains only on the tunnel oxide layer to form the charge storage pattern on the substrate.
摘要:
A non-volatile memory device includes a substrate and a tunnel insulation layer pattern, such that each portion of the tunnel insulation pattern extends along a first direction and adjacent portions of the tunnel insulation layer pattern may be separated in a second direction that is substantially perpendicular to the first direction. A non-volatile memory device may include a gate structure formed on the tunnel insulation layer pattern. The gate structure may include a floating gate formed on the tunnel insulation layer pattern along the second direction, a first conductive layer pattern formed on the floating gate in the second direction, a dielectric layer pattern formed on the first conductive layer pattern along the second direction, and a control gate formed on the dielectric layer pattern in the second direction.