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41 条记录 (耗时 0.02 秒)

    Capacitance sensor
    1.
    发明授权
    Capacitance sensor 有权
    电容传感器

    公开(公告)号：US08427177B2

    公开(公告)日：2013-04-23

    申请号：US12912580

    申请日：2010-10-26

    申请人： Heewon Jeong ,  Kiyoko Yamanaka ,  Yasushi Goto ,  Toshiaki Nakamura ,  Masahide Hayashi

    发明人： Heewon Jeong ,  Kiyoko Yamanaka ,  Yasushi Goto ,  Toshiaki Nakamura ,  Masahide Hayashi

    IPC分类号： G01R27/26 ,  G01R27/08

    CPC分类号： G01P21/00 ,  G01C19/5719 ,  G01P15/125 ,  G01P2015/0814

    摘要： A technique in which a false detection and a wrong diagnosis can be suppressed in a capacitance sensor represented by an acceleration sensor is provided. A first capacitative element and a second capacitative element, which configure a capacitance detection unit, and a third capacitative element and a fourth capacitative element, which configure a forced oscillation generation unit, are electrically separated from each other. That is, the diagnosis movable electrode that configures the third capacitative element and the fourth capacitative element is formed integrally with the movable part. On the other hand, the diagnosis fixed electrode and the diagnosis fixed electrode are electrically separated from the detection fixed electrode and the detection fixed electrode.

    摘要翻译： 提供了一种在由加速度传感器表示的电容传感器中可以抑制错误检测和错误诊断的技术。 构成电容检测单元的第一电容元件和第二电容元件以及配置强制振荡产生单元的第三电容元件和第四电容元件彼此电分离。 也就是说，构成第三电容元件和第四电容元件的诊断可移动电极与可动部一体地形成。 另一方面，诊断固定电极和诊断固定电极与检测固定电极和检测固定电极电分离。

    Angular velocity detecting device
    2.
    发明授权
    Angular velocity detecting device 有权
    角速度检测装置

    公开(公告)号：US08327706B2

    公开(公告)日：2012-12-11

    申请号：US12832965

    申请日：2010-07-08

    申请人： Heewon Jeong ,  Yasushi Goto

    发明人： Heewon Jeong ,  Yasushi Goto

    IPC分类号： G01P15/08

    CPC分类号： G01P3/22 ,  G01C19/5747 ,  G01C19/5762

    摘要： A high-performance angular rate detecting device is provided. A driving part including a drive frame and a Coriolis frame is levitated by at least two fixing beams which share a fixed end and are extending in a direction orthogonal to a driving direction, thereby vibrating the driving part. Even when a substrate is deformed by mounting or heat fluctuation, internal stress generated to the fixed beam and a supporting beam is small, thereby maintaining a vibrating state such as resonance frequency and vibration amplitude constant. Therefore, a high-performance angular rate detecting device which is robust to changes in mounting environment can be obtained.

    摘要翻译： 提供了一种高性能角速率检测装置。 包括驱动框架和科里奥利框架的驱动部分通过共享固定端并且沿与驱动方向正交的方向延伸的至少两个固定梁悬浮，从而使驱动部分振动。 即使当通过安装或热波动使基板变形时，产生到固定梁和支撑梁的内应力也小，从而保持振动状态，例如共振频率和振动幅度恒定。 因此，可以获得对安装环境变化坚固的高性能角速度检测装置。

    Semiconductor device with integrated circuit electrically connected to a MEMS sensor by a through-electrode
    3.
    发明授权
    Semiconductor device with integrated circuit electrically connected to a MEMS sensor by a through-electrode 有权
    具有集成电路的半导体器件通过通孔与MEMS传感器电连接

    公开(公告)号：US07919814B2

    公开(公告)日：2011-04-05

    申请号：US12270463

    申请日：2008-11-13

    申请人： Yasushi Goto ,  Tsukasa Fujimori ,  Heewon Jeong ,  Kiyoko Yamanaka

    发明人： Yasushi Goto ,  Tsukasa Fujimori ,  Heewon Jeong ,  Kiyoko Yamanaka

    IPC分类号： H01L27/12

    CPC分类号： B81C1/00246 ,  B81B2201/0235 ,  B81C2203/0728 ,  B81C2203/0735 ,  B81C2203/0778 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

    摘要： As well as achieving both downsizing and thickness reduction and sensitivity improvement of a semiconductor device that has: a MEMS sensor formed by bulk micromachining technique such as an acceleration sensor and an angular rate sensor; and an LSI circuit, a packaging structure of the semiconductor device having the MEMS sensor and the LSI circuit can be simplified. An integrated circuit having MISFETs and wirings is formed on a silicon layer of an SOI substrate, and the MEMS sensor containing a structure inside is formed by processing a substrate layer of the SOI substrate. In other words, by using both surfaces of the SOI substrate, the integrated circuit and the MEMS sensor are mounted on one SOI substrate. The integrated circuit and the MEMS sensor are electrically connected to each other by a through-electrode provided in the SOI substrate.

    摘要翻译： 以及实现半导体器件的小型化和厚度降低以及灵敏度提高，其具有：通过体积微加工技术（例如加速度传感器和角速度传感器）形成的MEMS传感器; 和LSI电路，可以简化具有MEMS传感器和LSI电路的半导体器件的封装结构。 在SOI衬底的硅层上形成具有MISFET和布线的集成电路，并且通过处理SOI衬底的衬底层来形成包含内部结构的MEMS传感器。 换句话说，通过使用SOI衬底的两个表面，集成电路和MEMS传感器安装在一个SOI衬底上。 集成电路和MEMS传感器通过设置在SOI衬底中的通孔电连接。

    ANGULAR VELOCITY DETECTING DEVICE
    5.
    发明申请
    ANGULAR VELOCITY DETECTING DEVICE 有权
    角速度检测装置

    公开(公告)号：US20100269589A1

    公开(公告)日：2010-10-28

    申请号：US12832965

    申请日：2010-07-08

    申请人： Heewon Jeong ,  Yasushi Goto

    发明人： Heewon Jeong ,  Yasushi Goto

    IPC分类号： G01C19/56

    CPC分类号： G01P3/22 ,  G01C19/5747 ,  G01C19/5762

    摘要： A high-performance angular rate detecting device is provided. A driving part including a drive frame and a Coriolis frame is leviated by at least two fixing beams which share a fixed end and are extending in a direction orthogonal to a driving direction, thereby vibrating the driving part. Even when a substrate is deformed by mounting or heat fluctuation, internal stress generated to the fixed beam and a supporting beam is small, thereby maintaining a vibrating state such as resonance frequency and vibration amplitude constant. Therefore, a high-performance angular rate detecting device which is robust to changes in mounting environment can be obtained.

    摘要翻译： 提供了一种高性能角速率检测装置。 包括驱动框架和科里奥利框架的驱动部分由共享固定端并且沿与驱动方向正交的方向延伸的至少两个固定梁而缓冲，从而使驱动部分振动。 即使当通过安装或热波动使基板变形时，产生到固定梁和支撑梁的内应力也小，从而保持振动状态，例如共振频率和振动幅度恒定。 因此，可以获得对安装环境变化坚固的高性能角速度检测装置。

    Method of manufacturing micro electro mechanical systems device
    7.
    发明授权
    Method of manufacturing micro electro mechanical systems device 有权
    微机电系统装置的制造方法

    公开(公告)号：US07972886B2

    公开(公告)日：2011-07-05

    申请号：US12143372

    申请日：2008-06-20

    申请人： Heewon Jeong ,  Yasushi Goto ,  Yuko Hanaoka ,  Tsukasa Fujimori

    发明人： Heewon Jeong ,  Yasushi Goto ,  Yuko Hanaoka ,  Tsukasa Fujimori

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00952 ,  B81B2201/0235 ,  B81B2203/0307 ,  B81C1/00039 ,  B81C2201/019 ,  B81C2203/058 ,  G01C19/5733 ,  G01C19/5755 ,  G01P15/0802 ,  G01P15/125

    摘要： Provided is a MEMS device which is robust to the misalignment and does not require the double-side wafer processing in the manufacture of a MEMS device such as an angular velocity sensor, an acceleration sensor, a combined sensor or a micromirror. After preparing a substrate having a space therein, holes are formed in a device layer at positions where fixed components such as a fixing portion, a terminal portion and a base that are fixed to a supporting substrate are to be formed, and the holes are filled with a fixing material so that the fixing material reaches the supporting substrate, thereby fixing the device layer around the holes to the supporting substrate.

    摘要翻译： 提供了一种MEMS装置，其对于未对准是坚固的，并且不需要在诸如角速度传感器，加速度传感器，组合传感器或微镜的MEMS装置的制造中的双面晶片处理。 在制备其中具有空间的基板之后，在要形成固定到支撑基板上的诸如固定部分，端子部分和基座等固定部件的位置的器件层中形成孔，并且填充孔 固定材料使得固定材料到达支撑基板，从而将装置层围绕孔固定到支撑基板。

    Angular velocity detecting device
    8.
    发明授权
    Angular velocity detecting device 有权
    角速度检测装置

    公开(公告)号：US07770451B2

    公开(公告)日：2010-08-10

    申请号：US12136759

    申请日：2008-06-10

    申请人： Heewon Jeong ,  Yasushi Goto

    发明人： Heewon Jeong ,  Yasushi Goto

    IPC分类号： G01P15/08

    CPC分类号： G01P3/22 ,  G01C19/5747 ,  G01C19/5762

    摘要： A high-performance angular rate detecting device is provided. A driving part including a drive frame and a Coriolis frame is levitated by at least two fixing beams which share a fixed end and are extending in a direction orthogonal to a driving direction, thereby vibrating the driving part. Even when a substrate is deformed by mounting or heat fluctuation, internal stress generated to the fixed beam and a supporting beam is small, thereby maintaining a vibrating state such as resonance frequency and vibration amplitude constant. Therefore, a high-performance angular rate detecting device which is robust to changes in mounting environment can be obtained.

    摘要翻译： 提供了一种高性能角速率检测装置。 包括驱动框架和科里奥利框架的驱动部分通过共享固定端并且沿与驱动方向正交的方向延伸的至少两个固定梁悬浮，从而使驱动部分振动。 即使当通过安装或热波动使基板变形时，产生到固定梁和支撑梁的内应力也小，从而保持振动状态，例如共振频率和振动幅度恒定。 因此，可以获得对安装环境变化坚固的高性能角速度检测装置。

    Semiconductor device and method of manufacturing the same
    9.
    发明申请
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号：US20090134459A1

    公开(公告)日：2009-05-28

    申请号：US12270463

    申请日：2008-11-13

    申请人： Yasushi GOTO ,  Tsukasa Fujimori ,  Heewon Jeong ,  Kiyoko Yamanaka

    发明人： Yasushi GOTO ,  Tsukasa Fujimori ,  Heewon Jeong ,  Kiyoko Yamanaka

    IPC分类号： H01L27/105 ,  H01L21/77

    CPC分类号： B81C1/00246 ,  B81B2201/0235 ,  B81C2203/0728 ,  B81C2203/0735 ,  B81C2203/0778 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

    摘要： As well as achieving both downsizing and thickness reduction and sensitivity improvement of a semiconductor device that has: a MEMS sensor formed by bulk micromachining technique such as an acceleration sensor and an angular rate sensor; and an LSI circuit, a packaging structure of the semiconductor device having the MEMS sensor and the LSI circuit can be simplified. An integrated circuit having MISFETs and wirings is formed on a silicon layer of an SOI substrate, and the MEMS sensor containing a structure inside is formed by processing a substrate layer of the SOI substrate. In other words, by using both surfaces of the SOI substrate, the integrated circuit and the MEMS sensor are mounted on one SOI substrate. The integrated circuit and the MEMS sensor are electrically connected to each other by a through-electrode provided in the SOI substrate.

    摘要翻译： 以及实现半导体器件的小型化和厚度降低以及灵敏度提高，其具有：通过体积微加工技术（例如加速度传感器和角速度传感器）形成的MEMS传感器; 并且LSI电路，可以简化具有MEMS传感器和LSI电路的半导体器件的封装结构。 在SOI衬底的硅层上形成具有MISFET和布线的集成电路，并且通过处理SOI衬底的衬底层来形成包含内部结构的MEMS传感器。 换句话说，通过使用SOI衬底的两个表面，集成电路和MEMS传感器安装在一个SOI衬底上。 集成电路和MEMS传感器通过设置在SOI衬底中的通孔电连接。

    Sensor module and sensor system
    10.
    发明授权
    Sensor module and sensor system 有权
    传感器模块和传感器系统

    公开(公告)号：US09279827B2

    公开(公告)日：2016-03-08

    申请号：US13976372

    申请日：2011-11-24

    申请人： Daisuke Maeda ,  Heewon Jeong ,  Masahide Hayashi

    发明人： Daisuke Maeda ,  Heewon Jeong ,  Masahide Hayashi

    IPC分类号： G01P21/00 ,  G01C19/5776 ,  G01C21/16

    CPC分类号： G01P21/00 ,  G01C19/5776 ,  G01C21/16

    摘要： Reliability and accuracy of a sensor are secured while adjustment cost of a sensor module is suppressed. A signal component analysis part 10 receives a signal output from a signal processing part 7 before passing through a low-pass filter 8, analyzes whether or not application of a fragile frequency with respect to a physical quantity is equal to or more than a threshold level, if the application of the fragile frequency is equal to or more than the threshold level, outputs output stop signals to output signal control parts 9, 16. The output signal control parts 9, 16 receive control signals output from the signal component analysis part 10, and outputs an acceleration signal and a physical quantity signal from which noise has been removed by the low-pass filters 8, 15 through the signal processing parts 7, 14.

    摘要翻译： 确保传感器模块的调整成本得到抑制，从而确保传感器的可靠性和精度。 信号分量分析部分10在通过低通滤波器8之前接收从信号处理部分7输出的信号，分析相对于物理量的脆弱频率的施加是否等于或大于阈值水平 如果脆弱频率的应用等于或大于阈值电平，则将输出停止信号输出到输出信号控制部9,16。输出信号控制部9,16接收从信号分量分析部10输出的控制信号 并且通过信号处理部件7,14输出通过低通滤波器8,15除去噪声的加速度信号和物理量信号。