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公开(公告)号：US07545032B2
公开(公告)日：2009-06-09
申请号：US11456544
申请日：2006-07-10
IPC分类号： H01L23/48
CPC分类号： H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/4334 , H01L23/49548 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle; soldering a stiffener structure; having an opening; on the mounting structure; connecting the stiffener structure to a ground; and molding the integrated circuit die and partially the stiffener structure through the opening.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有外部互连件，桨形件和连接杆的安装结构; 在桨上安装集成电路管芯; 焊接加强筋结构; 有开口 在安装结构上; 将加强筋结构连接到地面上; 并且通过开口模制集成电路模具并且部分地加强加强件结构。
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公开(公告)号：US20080006926A1
公开(公告)日：2008-01-10
申请号：US11456544
申请日：2006-07-10
CPC分类号： H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/4334 , H01L23/49548 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle; soldering a stiffener structure; having an opening; on the mounting structure; connecting the stiffener structure to a ground; and molding the integrated circuit die and partially the stiffener structure through the opening.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有外部互连件，桨形件和连接杆的安装结构; 在桨上安装集成电路管芯; 焊接加强筋结构; 有开口 在安装结构上; 将加强筋结构连接到地面上; 并且通过开口模制集成电路模具并且部分地加强加强件结构。
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公开(公告)号：US08207597B2
公开(公告)日：2012-06-26
申请号：US11670899
申请日：2007-02-02
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L21/4828 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a lead frame including forming an inner lead having a planar surface, the inner lead extending inwardly from the lead frame and forming a stiffening structure integral with the lead frame for maintaining the planar surface; encapsulating the inner lead with an electrical connection to an integrated circuit die and with a first inner lead body of the inner lead exposed; and singulating the inner lead from the lead frame.
摘要翻译： 提供了一种集成电路封装系统，包括形成引线框架，该引线框架包括形成具有平坦表面的内引线，该内引线从引线框架向内延伸并形成与引线框架一体的加强结构，用于保持平面; 将内部引线封装到集成电路管芯的电连接处，并且内部引线的第一内部引线体被暴露; 并从引线框架中分离出内引线。
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公开(公告)号：US20090250798A1
公开(公告)日：2009-10-08
申请号：US12484131
申请日：2009-06-12
IPC分类号： H01L23/495 , H01L21/56 , H01L23/498 , H01L23/28
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L2224/10175 , H01L2224/16 , H01L2224/16245 , H01L2924/3841 , Y10T29/49121 , Y10T29/49169 , Y10T29/49181
摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路在芯片上的支持。
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公开(公告)号：US07420265B2
公开(公告)日：2008-09-02
申请号：US11164321
申请日：2005-11-17
IPC分类号： H01L23/495
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/49548 , H01L23/49558 , H01L24/73 , H01L2224/1012 , H01L2224/16245 , H01L2224/81136 , H01L2224/81138 , H01L2924/00013 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2224/29099 , H01L2924/00
摘要： An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the leadframe with the electrical interconnects connected to the leadframe.
摘要翻译： 一种集成电路封装系统，包括集成电路管芯，引线框架和集成电路支架。 集成电路管芯与引线框架之间的集成电路支持，电气互连连接到引线框。
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公开(公告)号：US20080012100A1
公开(公告)日：2008-01-17
申请号：US11670899
申请日：2007-02-02
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L21/4828 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a lead frame including forming an inner lead having a planar surface, the inner lead extending inwardly from the lead frame and forming a stiffening structure integral with the lead frame for maintaining the planar surface; encapsulating the inner lead with an electrical connection to an integrated circuit die and with a first inner lead body of the inner lead exposed; and singulating the inner lead from the lead frame.
摘要翻译： 提供了一种集成电路封装系统，包括形成引线框架，该引线框架包括形成具有平坦表面的内引线，该内引线从引线框架向内延伸并形成与引线框架一体的加强结构，用于保持平面; 将内部引线封装到集成电路管芯的电连接处，并且内部引线的第一内部引线体被暴露; 并从引线框架中分离出内引线。
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公开(公告)号：US20070170559A1
公开(公告)日：2007-07-26
申请号：US11307128
申请日：2006-01-24
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L23/49548 , H01L24/81 , H01L2224/16 , H01L2224/16237 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81385 , H01L2224/81801 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： An integrated circuit package system is provided forming a lead finger from a padless lead frame, forming a lead tip hole in the lead finger, mounting an integrated circuit die having a solder bump on the lead finger, and reflowing the solder bump on the lead tip hole of the lead finger.
摘要翻译： 提供一种集成电路封装系统，从无铅引线框架形成引线指，在引线指中形成引线尖端孔，将具有焊料凸点的集成电路芯片安装在引线指状物上，并将引线尖端上的焊料凸点回流 导针的孔。
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公开(公告)号：US08629537B2
公开(公告)日：2014-01-14
申请号：US11339176
申请日：2006-01-23
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/83856 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming a die support system from a padless lead frame having die supports with each substantially equally spaced from another, and attaching an integrated circuit die having a peripheral area on the die supports.
摘要翻译： 提供了一种集成电路封装系统，其从具有管芯支撑件的无衬垫引线框架形成管芯支撑系统，每个管芯支架各自与另一个基本上等间隔开，并且在管芯支撑件上附接具有周边区域的集成电路管芯。
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9.发明授权公开(公告)号：US08415778B2
公开(公告)日：2013-04-09
申请号：US13215131
申请日：2011-08-22
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L2924/0002 , H01L2924/3025 , H01L2924/00
摘要： A non-leaded integrated circuit package system includes: a die paddle of a lead frame; a dual row of terminals including an outer terminal and an inner terminal; and an inner terminal and an adjacent inner terminal to form a fused lead.
摘要翻译： 一种非引线集成电路封装系统，包括：引线框的裸片; 包括外端子和内端子的双列端子; 以及内部端子和相邻的内部端子，以形成熔融引线。
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10.发明申请公开(公告)号：US20110298108A1
公开(公告)日：2011-12-08
申请号：US13215131
申请日：2011-08-22
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L2924/0002 , H01L2924/3025 , H01L2924/00
摘要： A non-leaded integrated circuit package system includes: a die paddle of a lead frame; a dual row of terminals including an outer terminal and an inner terminal; and an inner terminal and an adjacent inner terminal to form a fused lead.
摘要翻译： 一种非引线集成电路封装系统，包括：引线框的裸片; 包括外端子和内端子的双列端子; 以及内部端子和相邻的内部端子，以形成熔融引线。
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