公开(公告)号：US20220037284A1

公开(公告)日：2022-02-03

申请号：US17309506

申请日：2018-12-12

Applicant: Heraeus Materials Singapore Pte. Ltd.

Inventor： Yean M. Pun ,  Murali Sarangapani ,  Xi Zhang ,  Il T. Kang ,  Abito D. Bayaras ,  Kim H. Chong ,  Sylvia Sutiono ,  Chee W. Tok ,  Tae Y. Kim

IPC: H01L23/00 ,  B23K20/00

Abstract: A process for electrically connecting contact surfaces of electronic components by capillary wedge bonding a round wire of 8 to 80 μm to the contact surface of a first electronic component, forming a wire loop, and stitch bonding the wire to the contact surface of a second electronic component, wherein the wire comprises a wire core having a silver or silver-based wire core with a double-layered coating comprised of a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.

公开(公告)号：US12084784B2

公开(公告)日：2024-09-10

申请号：US18248482

申请日：2021-08-10

Applicant: Heraeus Materials Singapore Pte. Ltd.

Inventor： Miew Wan Lo ,  Murali Sarangapani

IPC: C25D7/06 ,  C22C1/02 ,  C22C5/02 ,  C22C5/06 ,  C22F1/14 ,  C25D3/12 ,  C25D3/48 ,  C25D3/50 ,  C25D5/10 ,  C25D5/12 ,  C25D5/34 ,  C25D5/50 ,  H01B5/02 ,  H01B13/00 ,  H01B1/02

CPC classification number: C25D7/0607 ,  C22C1/02 ,  C22C5/02 ,  C22C5/06 ,  C22F1/14 ,  C25D3/12 ,  C25D3/48 ,  C25D3/50 ,  C25D5/10 ,  C25D5/12 ,  C25D5/34 ,  C25D5/50 ,  H01B5/02 ,  H01B13/0016 ,  H01B1/02 ,  Y10T428/12875

Abstract: A wire comprising a silver-based wire core having a double-layer coating comprised of an inner layer of palladium or nickel and an adjacent outer layer of gold, wherein the wire exhibits at least one of the intrinsic properties A1) to A3):



A1) the average grain size of the crystal grains in the wire core, measured in longitudinal direction, is in the range of from 0.7 to 1.1 μm;
A2) the fraction of twin boundaries, measured in longitudinal direction of the wire, is in the range of from 5 to 40%; and,
A3) 20 to 70% of the crystal grains of the wire core are oriented in direction, and 3 to 40% of the crystal grains of the wire core are oriented in direction, each % with respect to the total number of crystal grains with orientation parallel to the drawing direction of the wire.

公开(公告)号：US10960498B2

公开(公告)日：2021-03-30

申请号：US15778009

申请日：2016-09-16

Applicant: Heraeus Materials Singapore Pte., Ltd. ,  Heraeus Oriental HiTec Co., Ltd.

Inventor： Il Tae Kang ,  Yong-Deok Tark ,  Mong Hyun Cho ,  Jong Su Kim ,  Hyun Seok Jung ,  Tae Yeop Kim ,  Xi Zhang ,  Murali Sarangapani

IPC: B23K35/30 ,  B23K35/02 ,  C22C5/06 ,  H01L23/00 ,  C25D5/12 ,  C25D5/50 ,  C25D7/06 ,  C25D5/10 ,  C23C28/02 ,  B23K20/00 ,  C22F1/00 ,  C22F1/02 ,  C22F1/14 ,  C22C5/08 ,  B23K35/40 ,  C23C14/02 ,  C23C14/16

Abstract: A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core includes: (a) pure silver consisting of silver and further components; or (b) doped silver consisting of silver, at least one doping element, and further components; or (c) a silver alloy consisting of silver, palladium and further components; or (d) a silver alloy consisting of silver, palladium, gold, and further components; or (e) a doped silver alloy consisting of silver, palladium, gold, at least one doping element, and further components, wherein the individual amount of any further component is less than 30 wt.-ppm and the individual amount of any doping element is at least 30 wt.-ppm, and the coating layer is a single-layer of gold or palladium or a double-layer comprised of an inner layer of nickel or palladium and an adjacent outer layer of gold.

公开(公告)号：US11791309B2

公开(公告)日：2023-10-17

申请号：US17309506

申请日：2018-12-12

Applicant: Heraeus Materials Singapore Pte. Ltd.

Inventor： Yean Mee Pun ,  Murali Sarangapani ,  Xi Zhang ,  Il Tae Kang ,  Abito Danila Bayaras ,  Kim Hui Chong ,  Sylvia Sutiono ,  Chee Wei Tok ,  Tae Yeop James Kim

IPC: B23K20/00 ,  H01L23/00

CPC classification number: H01L24/85 ,  B23K20/005 ,  H01L24/45 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/85181 ,  H01L2224/85205

Abstract: A process for electrically connecting contact surfaces of electronic components by capillary wedge bonding a round wire of 8 to 80 μm to the contact surface of a first electronic component, forming a wire loop, and stitch bonding the wire to the contact surface of a second electronic component, wherein the wire comprises a wire core having a silver or silver-based wire core with a double-layered coating comprised of a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.

公开(公告)号：US11236430B2

公开(公告)日：2022-02-01

申请号：US16312703

申请日：2017-08-18

Applicant: Heraeus Materials Singapore Pte. Ltd.

Inventor： Yee Weon Lim ,  Xi Zhang ,  Senthil Kumar Balasubramanian ,  Suat Teng Tan ,  Jin Zhi Liao ,  Dan Su ,  Chee Wei Tok ,  Murali Sarangapani ,  Jurgen Scharf

IPC: C25D5/10 ,  C25D3/46 ,  C25D5/48 ,  C25D7/06 ,  H01B13/32 ,  H01B13/02 ,  H01B1/02

Abstract: A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: (a) pure silver consisting of (a1) silver in an amount in the range of from 99.99 to 100 wt.-% and (a2) further components in a total amount of from 0 to 100 wt.-ppm or (b) doped silver consisting of (b1) silver in an amount in the range of from >99.49 to 99.997 wt.-%, (b2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to 89.49 to 99.497 wt.-%, (d2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to 200 to 1000 nm thick outer layer of gold.

公开(公告)号：US20180345421A1

公开(公告)日：2018-12-06

申请号：US15778009

申请日：2016-09-16

Applicant: Heraeus Materials Singapore Pte., Ltd. ,  Heraeus Oriental HiTec Co., Ltd.

Inventor： Il Tae Kang ,  Yong-Deok Tark ,  Mong Hyun Cho ,  Jong Su Kim ,  Hyun Seok Jung ,  Tae Yeop Kim ,  Xi Zhang ,  Murali Sarangapani

IPC: B23K35/30 ,  B23K20/00 ,  B23K35/02 ,  C22C5/06 ,  C22F1/14 ,  C22F1/02 ,  C22F1/00 ,  C23C14/16 ,  C23C14/02 ,  C25D5/12 ,  C25D7/06 ,  C25D5/50 ,  B23K35/40 ,  H01L23/00

CPC classification number: B23K35/3006 ,  B23K20/007 ,  B23K35/0227 ,  B23K35/0261 ,  B23K35/404 ,  C22C5/06 ,  C22C5/08 ,  C22F1/002 ,  C22F1/02 ,  C22F1/14 ,  C23C14/022 ,  C23C14/165 ,  C23C28/021 ,  C25D5/10 ,  C25D5/12 ,  C25D5/50 ,  C25D7/0607 ,  H01L24/42 ,  H01L24/43 ,  H01L24/44 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/43125 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/48511 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01078 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755

Abstract: A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core includes: (a) pure silver consisting of silver and further components; or (b) doped silver consisting of silver, at least one doping element, and further components; or (c) a silver alloy consisting of silver, palladium and further components; or (d) a silver alloy consisting of silver, palladium, gold, and further components; or (e) a doped silver alloy consisting of silver, palladium, gold, at least one doping element, and further components, wherein the individual amount of any further component is less than 30 wt.-ppm and the individual amount of any doping element is at least 30 wt.-ppm, and the coating layer is a single-layer of gold or palladium or a double-layer comprised of an inner layer of nickel or palladium and an adjacent outer layer of gold.

公开(公告)号：US20210222313A1

公开(公告)日：2021-07-22

申请号：US16312703

申请日：2017-08-18

Applicant: Heraeus Materials Singapore Pte. Ltd.

Inventor： Yee Weon Lim ,  Xi Zhang ,  Senthil Kumar Balasubramanian ,  Suat Teng Tan ,  Jin Zhi Liao ,  Dan Su ,  Chee Wei Tok ,  Murali Sarangapani ,  Jurgen Scharf

IPC: C25D7/06 ,  C25D3/46 ,  C25D5/10 ,  C25D5/48

Abstract: A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: (a) pure silver consisting of (a1) silver in an amount in the range of from 99.99 to 100 wt.-% and (a2) further components in a total amount of from 0 to 100 wt.-ppm or (b) doped silver consisting of (b1) silver in an amount in the range of from >99.49 to 99.997 wt.-%, (b2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to 89.49 to 99.497 wt.-%, (d2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to 200 to 1000 nm thick outer layer of gold.