摘要:
A flexible circuit connector is presented which is used to electrically and mechanically connect a flexible circuit to a circuit board or other electronic device. The connector also functions to wipe off any residue or debris on the electrical contacts before final connection. The connector is comprised of a male plug and a female adapter. The male plug comprises two interlocking pieces including a block and a cover. These two pieces allow for easy assembly and disassembly of the plug in conjunction with a flexible circuit. The female adapter comprises a hood which may be fastened directly to a circuit board. Alternatively, the hood may be fastened to a base plate which has gold plated contacts and conductive pins which pass through and which are soldered to the circuit board.
摘要:
An electrical connector is presented for effecting a non-wiping pressure mated connection between at least a pair of flexible circuits and another circuit device in a compact package with allowance for very tight tolerances on pad width and spacing.
摘要:
Processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.
摘要:
An automated canister reloading machine is able to reload a currency canister removed from an ATM. The reloading machine includes a supply of currency notes. The reloading machine can transfer currency notes from the supply into a storage area of the canister. The canister includes a memory that can store data representative of information concerning the canister, such as data representative of the type and number of currency notes held in the canister. The reloading machine is able to update the canister memory.
摘要:
A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for facilitating maintaining a controlled temperature environment inside of the component.
摘要:
A chassis member for carrying at least one circuit board for use in a WDM add/drop multiplexer unit, wherein the chassis member is adapted, in use, to function as a heatsink for a heat generating component mounted on the circuit board.
摘要:
A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for maintaining a controlled temperature environment inside of the component.
摘要:
Connector and processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed elastomeric sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.
摘要:
An electrical connector system for electrically interconnecting an integrated circuit chip unit having a plurality of arrays of first contacts arranged in a first pattern of peripheral form with a circuit board having a plurality of planar arrays of second contact pads arranged in a second pattern of peripheral form. The connector system includes a module member adapted to support the integrated circuit chip unit over the pattern of the circuit board, a plurality of rigid contact carrier members, and a plurality of multi-conductor flexible circuit structures extending between respective portions of the first and second peripheral patterns. Each flexible circuit structure has one ends of its conductors on the module member for electrical connection to respective contacts of the integrated circuit chip unit and the other ends of each flexible circuit structure secured to a corresponding contact carrier member with contact pads at those other conductor ends for electrical connection to corresponding contact pads of the circuit board. Each flexible circuit structure is in disposed within the interior of the connector system in an inwardly bowed configuration in which the flexible circuit structures extend inwardly from the peripheral patterns. A unitary clamping device causes movement of each of the contact carrier structures inwardly relative to the peripheral patterns on the circuit board to produce wiping during connecting motion.