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公开(公告)号:US5071359A
公开(公告)日:1991-12-10
申请号:US515830
申请日:1990-04-27
IPC分类号: H01R11/01 , B23K26/38 , H01L21/48 , H01L23/498 , H01R12/51 , H01R13/22 , H01R24/00 , H01R43/00 , H05K3/42
CPC分类号: H01L21/486 , B23K26/382 , B23K26/40 , B23K26/402 , H01L23/49827 , H01R13/22 , H05K3/42 , B23K2201/35 , B23K2203/12 , B23K2203/172 , B23K2203/42 , B23K2203/50 , H01L2924/0002 , H05K2201/09563 , H05K2201/09736
摘要: Connector and processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed elastomeric sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.
摘要翻译: 连接器及其制备方法,用于可互换连接接触焊盘阵列。 连接器具有预先形成的弹性体片状部件,该部件设置有一系列通孔,每个孔通过导电镀金属沉积物延伸。 沉积物的整体端向外突出超过片状构件的表面,形成用于可释放地接合焊盘的接触表面。
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公开(公告)号:US5245751A
公开(公告)日:1993-09-21
申请号:US782608
申请日:1991-10-25
IPC分类号: B23K26/38 , H01L21/48 , H01L23/498 , H01R13/22 , H05K3/42
CPC分类号: H01L21/486 , B23K26/382 , B23K26/386 , B23K26/40 , B23K26/402 , H01L23/49827 , H01R13/22 , H05K3/42 , B23K2201/35 , B23K2201/42 , B23K2203/12 , B23K2203/172 , B23K2203/42 , B23K2203/50 , B23K2203/56 , H01L2924/0002 , H05K2201/09563 , H05K2201/09736 , Y10T29/49165
摘要: Processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.
摘要翻译: 用于制备相同的用于可接地互连接触焊盘阵列的方法。 连接器具有预先形成的片状部件,该片状部件设有一系列通孔,每个孔通过导电镀金属沉积物延伸。 沉积物的整体端向外突出超过片状构件的表面,形成用于可释放地接合焊盘的接触表面。
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公开(公告)号:US5287619A
公开(公告)日:1994-02-22
申请号:US847895
申请日:1992-03-09
申请人: W. David Smith , John A. Olenick , Carlos L. Barton , Jane L. Cercena , Daniel J. Navarro , Kathleen R. Olenick , Angela M. Kneeland , Thomas S. Kneeland , Mark F. Sylvester , Curtis H. Kempton , Scott E. Derosier , Lynn E. Burdick , Richard T. Traskos , Robert B. Huntington , James S. Rivers , Samuel Gazit , Jeffrey B. Ott , William P. Harper
发明人: W. David Smith , John A. Olenick , Carlos L. Barton , Jane L. Cercena , Daniel J. Navarro , Kathleen R. Olenick , Angela M. Kneeland , Thomas S. Kneeland , Mark F. Sylvester , Curtis H. Kempton , Scott E. Derosier , Lynn E. Burdick , Richard T. Traskos , Robert B. Huntington , James S. Rivers , Samuel Gazit , Jeffrey B. Ott , William P. Harper
IPC分类号: H01L21/48 , H01L23/498 , H01L23/538 , H05K1/00 , H05K1/02 , H05K3/20 , H05K3/24 , H05K3/28 , H05K3/32 , H05K3/42 , H05K3/46 , H01K3/10
CPC分类号: H05K3/4682 , H01L21/4857 , H01L23/49894 , H01L23/5383 , H05K3/205 , H05K3/4617 , H05K3/4632 , H05K3/4647 , H01L2221/68345 , H01L2924/0002 , H05K1/0206 , H05K1/0289 , H05K2201/0129 , H05K2201/015 , H05K2201/09563 , H05K2203/0726 , H05K2203/0733 , H05K2203/1189 , H05K3/20 , H05K3/243 , H05K3/28 , H05K3/328 , H05K3/423 , H05K3/4652 , H05K3/4658 , Y10S428/901 , Y10T29/49165
摘要: In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process promotes reliable bonding between the fluoropolymer composite material and the plated copper. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. The MCM substrate device of the present invention may have multiple metal layers and multiple dielectric layers; four or five, or more, of each in a single structure would be easily achieved and is typical. The structure would include lead lines in separate mutually orthogonal planes (sometimes referred to as "x" and "y" lead lines) sandwiched between ground and power voltage planes of copper. The MCM substrate device of the present invention also has solid copper vias, which may be used either as electrical interconnection between layers of the MCM substrate and/or to the I/C's to be packaged in the module, or as thermal vias for heat conduction for thermal management. The manufacturing process of the present invention makes it possible to start or stop any via in any layer of the device.
摘要翻译: 根据本发明,使用多层含氟聚合物复合材料和铜的添加工艺制造MCM基板产品。 镀铜层,层压含氟聚合物复合层。 接种工艺促进了氟聚合物复合材料和镀铜之间的可靠接合。 使用填充的氟聚合物复合材料消除了在绝缘体和导体之间的阻挡金属层的需要。 本发明的MCM衬底器件可以具有多个金属层和多个电介质层; 单个结构中的四个或五个或更多个将容易实现并且是典型的。 该结构将包括夹在铜的接地和电源电压平面之间的分开的相互正交的平面(有时称为“x”和“y”引线)中的引线。 本发明的MCM衬底器件还具有固体铜通孔,其可以用作MCM衬底的层和/或要封装在模块中的I / C之间的电互连,或者用作用于热传导的热通孔 用于热管理。 本发明的制造过程使得可以在设备的任何层中启动或停止任何通孔。
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