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公开(公告)号：US20160332450A1
公开(公告)日：2016-11-17
申请号：US15111148
申请日：2014-01-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Sterling Chaffins , Kevin P. Dekam , Chien-Hua Chen
CPC classification number: B41J2/175 , B29B11/06 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1637 , B41J2002/14362 , H01L2924/181 , H01L2924/186
Abstract: A fluid directing assembly can comprise a molded support comprising a modified epoxy molded compound which includes epoxy resin, cross-linker, filler, and is devoid of wax release agent. The assembly can also include a silicon die attached to the molded support and wherein the silicon die and the molded support define a fluid directing channel.
Abstract translation: 流体引导组件可以包括模制支撑体，其包含改性环氧模塑化合物，其包括环氧树脂，交联剂，填料，并且不含脱蜡剂。 组件还可以包括附接到模制支撑件的硅模具，并且其中硅模具和模制支撑件限定流体引导通道。
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Patent Agency Ranking
公开(公告)号：US11312877B2
公开(公告)日：2022-04-26
申请号：US16074279
申请日：2016-10-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Sterling Chaffins , Kevin P. Dekam
IPC: C09D11/52 , C09D11/54 , B33Y10/00 , B29C64/165 , B33Y70/10 , C09D11/037 , C09D11/10 , C09D11/322 , C09D11/38 , C09D11/40 , B29K101/12 , B29K105/00 , B29K505/08
Abstract: The present disclosure is drawn to fluid sets, material sets, and 3-dimensional printing systems. A fluid set can include a pretreat composition that includes a salt of an alkali metal with bromide or iodide. The fluid set can also include a conductive fusing agent composition including a transition metal for fusing thermoplastic powder when exposed to electromagnetic radiation.
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公开(公告)号：US20210282276A1
公开(公告)日：2021-09-09
申请号：US16491186
申请日：2017-12-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Sterling Chaffins , Kevin P. Dekam , Thomas A. Saksa , Juan Sebastian Ramirez
IPC: H05K3/46 , B29C64/188 , B29C64/165 , H05K3/12 , H05K1/03
Abstract: According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.
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公开(公告)号：US12042986B2
公开(公告)日：2024-07-23
申请号：US17891453
申请日：2022-08-19
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Sterling Chaffins , Cassady Sparks Roop , Kevin P. Dekam , Vladek Kasperchik , Ali Emamjomeh , Johnathon Holroyd , Stephen G. Rudisill , Alexey S. Kabalnov
IPC: B29C64/00 , B29C64/10 , B29C64/153 , B29C64/176 , B29C64/182 , B29C64/20 , B29C64/205 , B29C64/227 , B29C64/245 , B29C64/25 , B29C64/255 , B29C64/30 , B29C64/307 , B29C64/336 , B29C64/40 , B29C70/88 , B33Y30/00 , B33Y40/00 , B33Y40/10 , B33Y40/20 , B33Y50/00 , B33Y70/10 , B33Y80/00 , B33Y99/00 , C08K3/08 , C08K3/22 , C08L67/04 , C09D11/322 , C09D11/40 , C09D11/52 , B29K505/08 , B33Y10/00 , B33Y70/00 , C08L77/02
CPC classification number: B29C64/153 , B29C64/00 , B29C64/10 , B29C64/176 , B29C64/182 , B29C64/20 , B29C64/205 , B29C64/227 , B29C64/245 , B29C64/25 , B29C64/255 , B29C64/30 , B29C64/307 , B29C64/336 , B29C64/40 , B29C70/882 , B33Y30/00 , B33Y40/00 , B33Y40/10 , B33Y40/20 , B33Y50/00 , B33Y70/10 , B33Y80/00 , B33Y99/00 , C08K3/08 , C08K3/22 , C08L67/04 , C09D11/322 , C09D11/40 , C09D11/52 , B29K2505/08 , B33Y10/00 , B33Y70/00 , C08K2003/0806 , C08K2003/0831 , C08K2003/085 , C08K2003/2258 , C08K2201/005 , C08K2201/011 , C08L77/02 , C08K3/22 , C08L77/02 , C08K3/08 , C08L77/02
Abstract: The present disclosure is drawn to 3-dimensional printed parts that can include a conductive composite portion and an insulating portion. The conductive composite portion can include a matrix of fused thermoplastic polymer particles interlocked with a matrix of sintered elemental transition metal particles. The insulating portion can include a matrix of fused thermoplastic polymer particles that are continuous with the matrix of fused thermoplastic polymer particles in the conductive composite portion. The insulating portion can be substantially free of sintered elemental transition metal particles and can include transition metal oxide bronze particles.
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公开(公告)号：US12011874B2
公开(公告)日：2024-06-18
申请号：US17376742
申请日：2021-07-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Sterling Chaffins , Kevin P. Dekam , Cassady Sparks Roop
IPC: B29C64/153 , B29C64/295 , B29C64/307 , G01B1/00 , G01B7/16 , G01L1/22
CPC classification number: B29C64/153 , B29C64/295 , B29C64/307 , G01B1/00 , G01B7/18 , G01L1/2287
Abstract: A strain sensor can include a resistor, a first electrical contact at a first end of the resistor, and a second electrical contact at a second end of the resistor. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles.
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公开(公告)号：US11304313B2
公开(公告)日：2022-04-12
申请号：US16491186
申请日：2017-12-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Sterling Chaffins , Kevin P. Dekam , Thomas A. Saksa , Juan Sebastian Ramirez
IPC: H05K3/46 , B29C64/188 , B29C64/165 , H05K1/03 , H05K3/12 , B33Y10/00 , B33Y70/00
Abstract: According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.
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