摘要:
In at least one embodiment, each of stages connected in cascade includes a first circuit which causes a predetermined section in a corresponding one of the stages to be connected to a low-potential power source, the first circuit being constituted by TFTs, a first type of clock signal being used as a signal which is transferred to an output terminal of each of the stages so as to be outputted as an output signal, a second type of clock signal being used as a signal which drives the first circuit. With the arrangement, it is possible to realize a shift register circuit that is capable of further suppressing a shift phenomenon of a threshold voltage in each of the TFTs.
摘要:
In a shift register that operates based on four-phase clock signals, including two-phase clock signals that are provided to odd-order stages and two-phase clock signals that are provided to even-order stages, of which phases are shifted by 90 degrees from each other, a potential of a first clock appears as a potential of a scanning signal, when a potential of a first node is at a high level, in each stage. In this configuration, the potential of the first node included in each stage is set to a high level based on a pulse of a scanning signal outputted from a pre-stage, and is set to a low level based on a pulse of a scanning signal outputted from a third stage after a stage concerned.
摘要:
An object is shortening a clock fall-rise period while suppressing an increase in a circuit area, an increase in current consumption, and a cost increase, without generating an abnormal operation, in a shift register within a monolithic gate driver.In a shift register (410) that operates based on four-phase clock signals, including two-phase clock signals (GCK1, GCK3) that are provided to odd-order stages and two-phase clock signals (GCK2, GCK4) that are provided to even-order stages, of which phases are shifted by 90 degrees from each other, a potential of a first clock (CKA) appears as a potential of a scanning signal (GOUT), when a potential of a first node is at a high level, in each stage. In this configuration, the potential of the first node included in each stage is set to a high level based on a pulse of a scanning signal outputted from a pre-stage, and is set to a low level based on a pulse of a scanning signal outputted from a third stage after a stage concerned.
摘要:
The circuit board (1) of the present invention includes a plurality of transistor elements provided on a single insulating substrate (2) for respective pixels that are two-dimensionally arranged or respective pixels in a group of a predetermined number of the pixels. At least one of the plurality of transistor elements is an oxide TFT (10) having a channel layer (11) formed by an oxide semiconductor, and at least another of the plurality of transistor elements is an a-Si TFT (20) having a channel layer (21) formed by, for example, an amorphous silicon semiconductor. Each of the oxide TFT (10) and the a-Si TFT (20) is a bottom-gate transistor.
摘要:
In at least one embodiment, a TFT includes: a first capacitor formed of a first capacitor electrode connected to a source electrode and a second capacitor electrode; a second capacitor formed of a third capacitor electrode and a fourth capacitor electrode; a first lead-out line; a second lead-out line connected to a gate electrode; a third lead-out line; a fourth lead-out line; a first interconnection; and a second interconnection. This realizes a TFT which can be easily saved from being a defective product even if leakage occurs in a capacitor connected to a TFT body section.
摘要:
A distance (d1) from an edge of a first region (R) at places (D) where branch electrodes (4b) extending, which branch off from an electrode line (4a) of a second source/drain electrode (4), start to overlap with a first region (R) to the electrode line (4a) is 5 μm or more. This realizes a TFT including a comb-shaped source/drain structure that enables easy repair of a source-drain leakage.
摘要:
A circuit board (1) includes a plurality of transistor elements on an insulating substrate (2). At least one of the plurality of transistor elements is an oxide TFT (10) including, as a channel layer (11), an oxide semiconductor. At least one of the plurality of transistor elements is an a-SiTFT (20) (i) being different from the oxide TFT (10) in functions as circuit components and (ii) including, as a channel layer (21), an amorphous silicon semiconductor. The oxide TFT (10) is a top gate transistor, and the a-SiTFT (20) is a bottom gate transistor. This provides: a configuration that can (a) enhance the performance of the circuit board equipped with the TFTs differing in their respective functions as circuit components and (b) reduce the area necessary for mounting the TFTs; and a method for producing the circuit board.
摘要:
A circuit board (1) includes a plurality of transistor elements on an insulating substrate (2). At least one of the plurality of transistor elements is an oxide TFT (10) including, as a channel layer (11), an oxide semiconductor. At least one of the plurality of transistor elements is an a-SiTFT (20) (i) being different from the oxide TFT (10) in functions as circuit components and (ii) including, as a channel layer (21), an amorphous silicon semiconductor. The oxide TFT (10) is a top gate transistor, and the a-SiTFT (20) is a bottom gate transistor. This provides: a configuration that can (a) enhance the performance of the circuit board equipped with the TFTs differing in their respective functions as circuit components and (b) reduce the area necessary for mounting the TFTs; and a method for producing the circuit board.
摘要:
A source and drain electrode layer (3s/3d) of an oxide TFT element (3) is formed by a first conductive layer. A gate electrode (3g) of the oxide TFT element (3) and a gate electrode (5g) of an a-Si TFT element (5) are formed by a single conductive layer, that is, a second conductive layer. A source and drain electrode layer (5s/5d) of the a-Si TFT element (5) is formed by a third conductive layer. The third conductive layer is formed above the second conductive layer in a thickness direction in which each conductive layer is stacked on an insulating substrate (2). Further, the first conductive layer is formed below the second conductive layer in the thickness direction. Therefore, it is possible to provide a circuit board that can have an improved degree of integration of transistor elements formed on the insulating substrate.
摘要:
A distance (d1) from an edge of a first region (R) at places (D) where branch electrodes (4b) extending, which branch off from an electrode line (4a) of a second source/drain electrode (4), start to overlap with a first region (R) to the electrode line (4a) is 5 μm or more. This realizes a TFT including a comb-shaped source/drain structure that enables easy repair of a source-drain leakage.