公开(公告)号：US5926375A

公开(公告)日：1999-07-20

申请号：US626940

申请日：1996-04-03

申请人： Hideki Watanabe ,  Tsutomu Imai ,  Takeshi Yamaguchi ,  Tositada Netsu ,  Kenichi Kasai ,  Fumio Imahashi ,  Satoru Ezaki ,  Mitugu Shirai

发明人： Hideki Watanabe ,  Tsutomu Imai ,  Takeshi Yamaguchi ,  Tositada Netsu ,  Kenichi Kasai ,  Fumio Imahashi ,  Satoru Ezaki ,  Mitugu Shirai

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K7/10

CPC分类号： H05K3/3421 ,  H05K1/111 ,  H05K1/112 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10704 ,  H05K3/4007 ,  Y02P70/611 ,  Y02P70/613

摘要： A circuit board is provided with blind connection vias which are filled with solder. The end portions of the pins of an electronic component are inserted into the connection vias, and are connected to the connection vias by solder. The electronic component is surface mounted on the circuit board with the major portions of the pins exposed.

摘要翻译： 电路板上设置有填充有焊料的盲孔连接孔。 电子部件的销的端部插入到连接通孔中，并通过焊料连接到连接通孔。 电子元件表面安装在电路板上，引脚的主要部分被暴露。

公开(公告)号：US5402563A

公开(公告)日：1995-04-04

申请号：US105111

申请日：1993-08-12

申请人： Takanori Satoh ,  Satoru Ezaki ,  Tatsumi Shibata

发明人： Takanori Satoh ,  Satoru Ezaki ,  Tatsumi Shibata

IPC分类号： H05K3/34 ,  H05K13/04 ,  H05K3/00 ,  B23P19/00

CPC分类号： H05K13/0486 ,  Y10T29/49124 ,  Y10T29/53183

摘要： An apparatus for removing an electronic device from a printed circuit board includes a board support for supporting the printed circuit board with the first main surface thereof directed upwardly and for vertically moving the printed circuit board; a lower heating device for applying heat from the second main surface side of the printed circuit board; an upper heating device for applying heat from the first main surface side of the printed circuit board; a withdrawal device disposed on the first main surface side of the printed circuit board for applying a force to withdraw the electronic device from the printed circuit board, the withdrawal device detecting the withdrawal of the electronic device; and a solder elimination device disposed on the first main surface side of the printed circuit board, the solder elimination device comprising a hood for covering that portion of the printed circuit board where the electronic device is mounted, and a pressure control device for increasing or decreasing a pressure within an internal space of the hood to drive the solder out of the through holes by pressurization or suction.

摘要翻译： 一种用于从印刷电路板移除电子装置的装置包括用于支撑印刷电路板的板支撑件，其第一主表面向上指向并用于垂直移动印刷电路板; 用于从印刷电路板的第二主表面侧施加热量的下加热装置; 用于从印刷电路板的第一主表面侧施加热量的上加热装置; 提取装置，其设置在所述印刷电路板的所述第一主表面侧，用于施加力以从所述印刷电路板抽出所述电子装置;所述提取装置检测所述电子装置的退出; 以及设置在印刷电路板的第一主表面侧的消除焊料的装置，所述焊料消除装置包括用于覆盖安装有电子装置的印刷电路板的该部分的罩，以及用于增加或减少的压力控制装置 在罩的内部空间内的压力，以通过加压或抽吸将焊料驱出通孔。

公开(公告)号：US5142121A

公开(公告)日：1992-08-25

申请号：US585404

申请日：1990-09-20

申请人： Satoru Ezaki ,  Kiyofumi Tanaka

发明人： Satoru Ezaki ,  Kiyofumi Tanaka

IPC分类号： H02G1/12

CPC分类号： H02G1/1256 ,  H02G1/128

摘要： According to the method for terminating a cable and the apparatus used therefor of the present invention, first the thermosetting resin layer of the cable is heat-cured, for example, by laser beam. The heat-cured thermosetting resin layer is lowered in stress and strain at rupture and hence can be easily cut and then this thermosetting resin layer is cut and peeled off.

摘要翻译： 根据本发明的端接电缆的方法及其使用的装置，首先将电缆的热固性树脂层例如通过激光束热固化。 热固性热固性树脂层的应力和断裂应变降低，因此可以容易地切断，然后将该热固性树脂层切断并剥离。

公开(公告)号：US4858659A

公开(公告)日：1989-08-22

申请号：US215534

申请日：1988-07-06

申请人： Satoru Ezaki ,  Kiyofumi Tanaka ,  Tsukasa Kasahara ,  Tetsuya Hirose ,  Tetsuro Nakagawa

发明人： Satoru Ezaki ,  Kiyofumi Tanaka ,  Tsukasa Kasahara ,  Tetsuya Hirose ,  Tetsuro Nakagawa

IPC分类号： H01R43/00 ,  H01R43/28

CPC分类号： H01R43/28 ,  H01R12/62

摘要： An apparatus for forming and cutting a flat type multi-core cable is disclosed, in which core conductors of a flat type multi-core cable, whose core conductors are previously exposed by exfoliating a part of a jacket therefor, are divided into a plurality of units; the core conductors are formed and cut separately for every unit; and at the same time the pitch of the core conductors is corrected. Further the number and/or the pitch of the core conductors are calculated by using information obtained by the scanning of the core conductors and cables, for which the number of the core conductors is not in agreement with predetermined one, or cables, for which errors in the pitch of the core conductors exceed a certain limit, are excluded as deficiencies.

摘要翻译： 公开了一种用于形成和切割扁平型多芯电缆的装置，其中芯体导体预先通过剥离外壳的一部分而露出的扁平型多芯电缆的芯导体被分成多个 单位; 每个单元分别形成和切割芯导体; 并且同时校正芯导体的间距。 此外，芯导体的数量和/或节距通过使用通过芯导体和电缆的扫描而获得的信息来计算，芯导体的数量与预定的芯导体的数量不一致，或者线缆的错误 核心导体的间距超过一定限度，被排除为缺陷。

公开(公告)号：US4472056A

公开(公告)日：1984-09-18

申请号：US286068

申请日：1981-07-23

申请人： Yasuo Nakagawa ,  Hiroshi Makihira ,  Souhei Ikeda ,  Satoru Ezaki ,  Osamu Harada

发明人： Yasuo Nakagawa ,  Hiroshi Makihira ,  Souhei Ikeda ,  Satoru Ezaki ,  Osamu Harada

IPC分类号： G01B11/25 ,  H01R13/20 ,  H04N7/18

CPC分类号： G01B11/2518 ,  H01R13/20

摘要： Disclosed is a shape detecting apparatus comprising a slit projector for projecting a slit bright line on a number of objects arrayed in a line, an image forming lens for forming the bright line image, an image scanning mechanism for the bright line image formed through the image forming lens in a height direction of the object and a one-dimensional image sensing device for self-scanning the bright line image formed therein with an array of image sensing elements orthogonal to the scanning direction by the image scanning mechanism.

摘要翻译： 本发明公开了一种形状检测装置，包括：狭缝投影仪，用于将一条狭缝亮线投射在排列成一行的多个物体上;形成用于形成亮线图像的成像透镜;用于通过图像形成的亮线图像的图像扫描机构; 在物体的高度方向形成透镜，以及一维图像感测装置，用于通过图像扫描机构与扫描方向正交的图像感测元件的阵列自身扫描其中形成的亮线图像。