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公开(公告)号：US20060064191A1
公开(公告)日：2006-03-23
申请号：US10545658
申请日：2003-09-17
IPC分类号： G06F19/00
CPC分类号： H01L23/544 , G05B19/4183 , G05B2219/31304 , G05B2219/45031 , H01L21/67276 , H01L21/67294 , H01L2223/5442 , H01L2223/54433 , H01L2223/5444 , H01L2924/0002 , Y02P90/04 , Y02P90/10 , H01L2924/00
摘要： The present invention provides a semiconductor device furnished with tamper-resistant identification information by forming a circuit pattern 2B which differs from one semiconductor chip to another in a semiconductor chip 2 packaged in a semiconductor device 1 in addition to an original circuit pattern 2A and expressing the identification information by this circuit pattern 2B and the invention further provides a semiconductor manufacturing management system targeted at a product mounted with this semiconductor device, capable of managing the product from the manufacturing to the mode of use of the semiconductor device.
摘要翻译： 本发明提供了一种半导体器件，其通过在除了原始电路图案2A和半导体器件1之外的半导体器件1中封装的半导体芯片2中形成不同于一个半导体芯片的电路图案2B而配备防篡改识别信息，以及 通过该电路图案2B表示识别信息，并且本发明还提供了一种针对安装有该半导体器件的产品的半导体制造管理系统，其能够管理从半导体器件的制造到使用模式的产品。
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公开(公告)号：US06941186B2
公开(公告)日：2005-09-06
申请号：US10625887
申请日：2003-07-23
IPC分类号： G03F1/84 , G03F1/86 , G03F7/20 , H01J37/302 , H01J37/317 , H01L21/02 , H01L21/027 , G06F19/00
CPC分类号： B82Y10/00 , B82Y40/00 , G05B19/41855 , G05B2219/31323 , G05B2219/45028 , H01J37/3023 , H01J37/3174 , H01J2237/30411 , H01J2237/3175 , H01J2237/31762 , Y02P90/185 , Y02P90/24
摘要： A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.
摘要翻译： 半导体制造装置包括：计算单元，具有至少一个用于处理半导体设计信息的计算机; 控制单元，用于根据半导体设计信息的处理结果控制电子辐射; 用于根据控制单元的指令发射电子的写入单元; 和至少一个存储设备。 半导体制造装置允许存储装置，计算单元，控制单元和写入单元之间的通信。 半导体制造装置还包括可以控制存储装置的通信通路。
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公开(公告)号：US07218985B2
公开(公告)日：2007-05-15
申请号：US11371677
申请日：2006-03-08
IPC分类号： G06F19/00
CPC分类号： B82Y10/00 , B82Y40/00 , G05B19/41855 , G05B2219/31323 , G05B2219/45028 , H01J37/3023 , H01J37/3174 , H01J2237/30411 , H01J2237/3175 , H01J2237/31762 , Y02P90/185 , Y02P90/24
摘要： A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.
摘要翻译： 半导体制造装置包括：计算单元，具有至少一个用于处理半导体设计信息的计算机; 控制单元，用于根据半导体设计信息的处理结果控制电子辐射; 用于根据控制单元的指令发射电子的写入单元; 和至少一个存储设备。 半导体制造装置允许存储装置，计算单元，控制单元和写入单元之间的通信。 半导体制造装置还包括可以控制存储装置的通信通路。
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公开(公告)号：US20060155414A1
公开(公告)日：2006-07-13
申请号：US11371677
申请日：2006-03-08
IPC分类号： G06F19/00
CPC分类号： B82Y10/00 , B82Y40/00 , G05B19/41855 , G05B2219/31323 , G05B2219/45028 , H01J37/3023 , H01J37/3174 , H01J2237/30411 , H01J2237/3175 , H01J2237/31762 , Y02P90/185 , Y02P90/24
摘要： A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.
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公开(公告)号：US07027888B2
公开(公告)日：2006-04-11
申请号：US11186455
申请日：2005-07-21
IPC分类号： G06F19/00
CPC分类号： B82Y10/00 , B82Y40/00 , G05B19/41855 , G05B2219/31323 , G05B2219/45028 , H01J37/3023 , H01J37/3174 , H01J2237/30411 , H01J2237/3175 , H01J2237/31762 , Y02P90/185 , Y02P90/24
摘要： A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.
摘要翻译： 半导体制造装置包括：计算单元，具有至少一个用于处理半导体设计信息的计算机; 控制单元，用于根据半导体设计信息的处理结果控制电子辐射; 用于根据控制单元的指令发射电子的写入单元; 和至少一个存储设备。 半导体制造装置允许存储装置，计算单元，控制单元和写入单元之间的通信。 半导体制造装置还包括可以控制存储装置的通信通路。
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公开(公告)号：US20050270857A1
公开(公告)日：2005-12-08
申请号：US11186455
申请日：2005-07-21
IPC分类号： G03F1/84 , G03F1/86 , G03F7/20 , H01J37/302 , H01J37/317 , H01L21/02 , H01L21/027 , G11C5/00
CPC分类号： B82Y10/00 , B82Y40/00 , G05B19/41855 , G05B2219/31323 , G05B2219/45028 , H01J37/3023 , H01J37/3174 , H01J2237/30411 , H01J2237/3175 , H01J2237/31762 , Y02P90/185 , Y02P90/24
摘要： A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.
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公开(公告)号：US5281827A
公开(公告)日：1994-01-25
申请号：US763145
申请日：1991-09-20
IPC分类号： H01L21/30 , H01J37/302 , H01J37/317 , H01L21/027
CPC分类号： B82Y10/00 , B82Y40/00 , H01J37/302 , H01J37/3174
摘要： A column section is disposed within a thermostatic chamber within a clean room, a section for analog controlling each portion of the column section is disposed within the clean room and outside of the thermostatic chamber, and a section for digital controlling the analog control section is disposed outside of the clean room.
摘要翻译： 柱部分设置在洁净室内的恒温室中，用于模拟控制柱部分的每个部分的部分设置在洁净室内和恒温室外部，并且设置用于数字控制模拟控制部分的部分 在洁净室外。
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公开(公告)号：US20060033050A1
公开(公告)日：2006-02-16
申请号：US11251807
申请日：2005-10-18
申请人： Kimiaki Ando , Haruo Yoda , Rikio Tomiyoshi , Masamichi Kawano
发明人： Kimiaki Ando , Haruo Yoda , Rikio Tomiyoshi , Masamichi Kawano
IPC分类号： G21K5/10
CPC分类号： B82Y10/00 , B82Y40/00 , H01J37/09 , H01J37/3174 , H01J2237/31776
摘要： In the case of drawing an oblique figure pattern, when drawing an oblique figure by using a slender rectangular beam, a problem occurs that edge roughness occurs at an oblique-side portion to deteriorate the drawing accuracy. The present invention solves the above problem and provides an electron-beam drawing apparatus and an electron-beam drawing method capable of accurately drawing even an oblique figure. A first rectangular aperture and a second parallelogrammatic aperture are used and a variable parallelogrammatic electron beam formed by two apertures is used to draw a desired pattern on the surface of a sample. Moreover, oblique-side-portion-contour decomposition means is used to draw an oblique-side portion by a variable parallelogram and the inside of an oblique side by a triangle and a quadrangle (rectangle).
摘要翻译： 在绘制斜图形图形的情况下，当使用细长矩形波束绘制斜图时，会出现在倾斜侧部分发生边缘粗糙度以降低绘图精度的问题。 本发明解决了上述问题，并且提供了能够精确地绘制斜图的电子束描绘装置和电子束描绘方法。 使用第一矩形孔和第二平行四边形孔，并且使用由两个孔形成的可变平行四边形电子束来在样品的表面上画出期望的图案。 此外，倾斜侧部分轮廓分解装置用于通过可变的平行四边形和斜边的内侧以三角形和四边形（矩形）绘制斜侧部分。
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公开(公告)号：US06478900B1
公开(公告)日：2002-11-12
申请号：US08674102
申请日：1996-07-01
IPC分类号： C21D800
CPC分类号： C21D8/005 , C21D7/00 , C21D9/0093
摘要： An improved method of forging a precipitation hardening type stainless steel. The method comprises the steps of soaking the precipitation hardening type stainless steel at a temperature of austenitizing range, cooling the steel to a temperature in the range of 200-700° C., preferably 400-600° C., and subjecting the steel to forging at the temperature in this range. Conventional lubricants and die cooling oils can be used without being deteriorated due to high temperature. It is preferable to forcibly cool the soaked steel to adjust the temperature of the steel at which it is forged. The forged steel is then age hardened to exhibit inherent hardness.
摘要翻译： 一种改进的沉淀硬化型不锈钢锻造方法。 该方法包括以下步骤：将沉淀硬化型不锈钢浸渍在奥氏体化程度的温度下，将钢冷却至200-700℃，优选400-600℃的温度， 锻造在这个范围内的温度。 可以使用常规的润滑剂和模具冷却油，而不会由于高温而劣化。 优选将浸渍钢强制地冷却来调整锻造时的钢的温度。 然后将锻钢进行老化硬化以显示固有的硬度。
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公开(公告)号：US5424550A
公开(公告)日：1995-06-13
申请号：US183770
申请日：1994-01-21
IPC分类号： H01L21/30 , H01J37/302 , H01J37/317 , H01L21/027
CPC分类号： B82Y10/00 , B82Y40/00 , H01J37/302 , H01J37/3174
摘要： A charged particle beam exposure apparatus includes an irradiator for irradiating a sample with a charged particle beam, an analog controller for analog controlling the charged particle beam, a digital controller for digital controlling the analog controller, and a digital transmission path connecting the analog controller to the digital controller. The analog controller is disposed inside a room, and the digital controller is disposed outside the room.
摘要翻译： 带电粒子束曝光装置包括用于对带有粒子束的样品进行照射的照射器，用于模拟控制带电粒子束的模拟控制器，用于数字控制模拟控制器的数字控制器和将模拟控制器连接到 数字控制器。 模拟控制器设置在房间内，数字控制器设置在房间外。
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