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    Semiconductor manufacturing apparatus
    2.
    发明授权
    Semiconductor manufacturing apparatus 有权
    半导体制造装置

    公开(公告)号：US07218985B2

    公开(公告)日：2007-05-15

    申请号：US11371677

    申请日：2006-03-08

    申请人： Hidemitsu Naya ,  Koji Hashimoto ,  Masamichi Kawano ,  Rikio Tomiyoshi

    发明人： Hidemitsu Naya ,  Koji Hashimoto ,  Masamichi Kawano ,  Rikio Tomiyoshi

    IPC分类号： G06F19/00

    CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G05B19/41855 ,  G05B2219/31323 ,  G05B2219/45028 ,  H01J37/3023 ,  H01J37/3174 ,  H01J2237/30411 ,  H01J2237/3175 ,  H01J2237/31762 ,  Y02P90/185 ,  Y02P90/24

    摘要： A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.

    摘要翻译： 半导体制造装置包括：计算单元，具有至少一个用于处理半导体设计信息的计算机; 控制单元，用于根据半导体设计信息的处理结果控制电子辐射; 用于根据控制单元的指令发射电子的写入单元; 和至少一个存储设备。 半导体制造装置允许存储装置，计算单元，控制单元和写入单元之间的通信。 半导体制造装置还包括可以控制存储装置的通信通路。

    Semiconductor manufacturing apparatus
    4.
    发明授权
    Semiconductor manufacturing apparatus 失效
    半导体制造装置

    公开(公告)号：US07027888B2

    公开(公告)日：2006-04-11

    申请号：US11186455

    申请日：2005-07-21

    申请人： Hidemitsu Naya ,  Koji Hashimoto ,  Masamichi Kawano ,  Rikio Tomiyoshi

    发明人： Hidemitsu Naya ,  Koji Hashimoto ,  Masamichi Kawano ,  Rikio Tomiyoshi

    IPC分类号： G06F19/00

    CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G05B19/41855 ,  G05B2219/31323 ,  G05B2219/45028 ,  H01J37/3023 ,  H01J37/3174 ,  H01J2237/30411 ,  H01J2237/3175 ,  H01J2237/31762 ,  Y02P90/185 ,  Y02P90/24

    摘要： A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.

    摘要翻译： 半导体制造装置包括：计算单元，具有至少一个用于处理半导体设计信息的计算机; 控制单元，用于根据半导体设计信息的处理结果控制电子辐射; 用于根据控制单元的指令发射电子的写入单元; 和至少一个存储设备。 半导体制造装置允许存储装置，计算单元，控制单元和写入单元之间的通信。 半导体制造装置还包括可以控制存储装置的通信通路。

    Substrate processing device and substrate processing method
    7.
    发明授权
    Substrate processing device and substrate processing method 有权

    公开(公告)号：US09601357B2

    公开(公告)日：2017-03-21

    申请号：US14383817

    申请日：2012-09-07

    申请人： Koji Hashimoto ,  Masahiro Miyagi ,  Mitsukazu Takahashi

    发明人： Koji Hashimoto ,  Masahiro Miyagi ,  Mitsukazu Takahashi

    IPC分类号： C03C15/00 ,  H01L21/67 ,  H01L21/677

    CPC分类号： H01L21/6704 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67751

    摘要： A substrate processing apparatus and method includes, a plate that has a size equal to or larger than a principal face of the substrate, and has a horizontal and flat liquid holding face opposing the principal face of the substrate from below. A processing liquid supply unit supplies a processing liquid to the liquid holding face. A control unit controls the processing liquid supply unit and a movement unit to supply the processing liquid to the liquid holding face to form a processing liquid film, a contact step of bringing the principal face of the substrate and the liquid holding face close to each other to bring the principal face of the substrate into contact with the processing liquid film, and a liquid contact maintenance step of maintaining the processing liquid in contact with the principal face of the substrate.

    Casing and assembling method of casing
    8.
    发明授权
    Casing and assembling method of casing 有权
    套管套管组装方法

    公开(公告)号：US09101066B2

    公开(公告)日：2015-08-04

    申请号：US13788855

    申请日：2013-03-07

    申请人： Isao Azumi ,  Koji Hashimoto

    发明人： Isao Azumi ,  Koji Hashimoto

    IPC分类号： H05K7/00 ,  H05K5/06 ,  H05K5/00

    CPC分类号： H05K5/069 ,  H05K5/0052 ,  H05K5/062 ,  Y10T29/49213

    摘要： An outer circumferential groove filled with a seal material and an opposing surface portion are provided to a fit portion of a case. A tray portion opposing the opposing surface portion and an outer circumferential protruding portion entering the outer circumferential groove are provided to the fit portion of a cover. Master dimensions are set so that an outer clearance A0 between the outer circumferential groove and the outer circumferential protruding portion is always larger than an inner clearance C0 between the former and the latter when center positions of the cover and the case coincide with each other.

    摘要翻译： 填充有密封材料的外周槽和相对的表面部分设置在壳体的配合部分。 在盖的配合部分设置有与相对表面部分相对的托盘部分和进入外周槽的外周突出部分。 设定主尺寸，使得当外壳和外周突出部之间的外部间隙A0总是大于前者与后者之间的内部间隙C0时，盖和壳体的中心位置彼此重合。

    Vehicle-mounted electronic control device
    9.
    发明授权
    Vehicle-mounted electronic control device 有权
    车载电子控制装置

    公开(公告)号：US08994220B2

    公开(公告)日：2015-03-31

    申请号：US13343804

    申请日：2012-01-05

    申请人： Yuki Iwagami ,  Koji Hashimoto ,  Manabu Yamashita ,  Yuji Zushi ,  Mitsunori Nishida

    发明人： Yuki Iwagami ,  Koji Hashimoto ,  Manabu Yamashita ,  Yuji Zushi ,  Mitsunori Nishida

    IPC分类号： H04B3/00 ,  B60R16/00

    CPC分类号： B60R16/00

    摘要： In a vehicle-mounted electronic control device having a switching power supply in which a switching element is controlled to obtain a predetermined intermediate voltage Va stepped down from a vehicle-mounted battery, and to which a downstream side coil, a flywheel diode, and an output capacitor are connected to suppress a pulsating voltage, a circuit for suppressing reverse conduction for the switching element is provided in order to prevent that the switching element is reversely conducted and thus a charging voltage of the output capacitor is abnormally lowered when a power supply voltage Vb of the vehicle-mounted battery is abnormally lowered.

    摘要翻译： 在具有开关电源的车载电子控制装置中，其中开关元件被控制以获得从车载电池下降的预定中间电压Va，并且下游侧线圈，续流二极管和 连接输出电容器以抑制脉动电压，为了防止开关元件反向导通，设置用于抑制反向导通的电路，因此当电源电压为0V时，输出电容器的充电电压异常降低 车载电池的Vb异常地下降。

    Switch unit
    10.
    发明授权
    Switch unit 有权
    开关单元

    公开(公告)号：US08963031B2

    公开(公告)日：2015-02-24

    申请号：US13635794

    申请日：2011-02-07

    申请人： Takeyoshi Fujimoto ,  Yasuo Motohashi ,  Koji Hashimoto

    发明人： Takeyoshi Fujimoto ,  Yasuo Motohashi ,  Koji Hashimoto

    IPC分类号： H01H9/04 ,  H01H23/06 ,  H01H21/24 ,  H01H21/22 ,  H01H21/08

    CPC分类号： H01H9/047 ,  H01H21/08 ,  H01H21/24 ,  H01H23/06 ,  H01H2021/225 ,  H01H2223/004 ,  H01H2300/01

    摘要： A switch unit includes an upper case that has an operation portion attached therein; a circuit board that has a switch attached thereto that is able to switch contact points by operation of the operation portion; and a lower case that fits into the upper case such that the lower case is surrounded by the upper case, and that accommodates the circuit board between the upper case and the lower case. A draining portion is provided at a side surface of the upper case, and the draining portion is integrally formed with a sidewall forming the side surface and protrudes downward, and has a width that gradually narrows from the top to the bottom thereof.

    摘要翻译： 一种开关单元包括：一个具有附接在其中的操作部分的上壳体; 电路板，其具有附接到其上的开关，其能够通过操作部的操作来切换接触点; 以及下壳体，其适合于上壳体，使得下壳体被上壳体包围，并且将电路板容纳在上壳体和下壳体之间。 排水部设置在上壳体的侧面，排水部与形成侧面的侧壁一体形成，向下方突出，宽度从顶部到底部逐渐变窄。