公开(公告)号：US07438481B2

公开(公告)日：2008-10-21

申请号：US11200045

申请日：2005-08-10

申请人： Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

发明人： Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

IPC分类号： G02B6/30 ,  G02B6/36

CPC分类号： G02B6/3644 ,  G02B6/3652 ,  G02B6/4201 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/428 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/15311 ,  H05K1/0274 ,  H01L2924/00 ,  H01L2224/0401

摘要： An optical semiconductor module comprises a guide which has a positioning portion for an optical transmission line, an optical semiconductor mounting surface from which one end face of the optical transmission line disposed in the positioning portion is exposed, and a wiring layer formed on the optical semiconductor mounting surface. An optical semiconductor element is mounted on the optical semiconductor mounting surface of the guide, with a light-emitting surface or a light-receiving surface thereof facing the one end face of the optical transmission line, and is electrically connected to the wiring layer.

摘要翻译： 光学半导体模块包括具有用于光传输线路的定位部分的引导件，设置在定位部分中的光传输线的一个端面从该半导体安装表面露出的光学半导体安装表面和形成在光学半导体上的布线层 安装面。 将光学半导体元件安装在引导件的光学半导体安装面上，其发光面或受光面朝向光传输线的一个端面，并与导线层电连接。

公开(公告)号：US07364369B2

公开(公告)日：2008-04-29

申请号：US11711862

申请日：2007-02-28

申请人： Wataru Sakurai ,  Kazuhito Saito ,  Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

发明人： Wataru Sakurai ,  Kazuhito Saito ,  Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

IPC分类号： G02B6/36

CPC分类号： G02B6/43 ,  G02B6/4202 ,  H01L2924/0002 ,  H01L2924/00

摘要： When a resin 59 to form a molded body 20 is poured and a lead frame 30 is attached to a front end face 21 of the molded body 20 by insert molding, protective leads 32 provided on both outsides of a lead pattern 31 of the lead frame 30 moderate the flow of the resin 59 and the force acting on the lead pattern 31 is decreased, so that misregistration of the lead pattern 31 can be prevented. Accordingly, the inserted and molded lead frame 30 can be wired on the front end face 21 of the molded body 20 for easily accomplishing three-dimensional electric wiring.

摘要翻译： 当浇铸形成模制体20的树脂59并且通过嵌件模制将引线框架30附接到模制体20的前端面21时，设置在引线框架的引线图案31的外侧的保护引线32 30使树脂59的流动缓和，并且作用在引线图案31上的力减小，从而可以防止引线图案31的不对准。 因此，插入成型的引线框架30可以布线在成型体20的前端面21上，以便于实现三维电线。

公开(公告)号：US20060035510A1

公开(公告)日：2006-02-16

申请号：US11200173

申请日：2005-08-10

申请人： Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

发明人： Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

IPC分类号： H01R13/62

CPC分类号： H01L23/66 ,  G02B6/43 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R4/027 ,  H01R43/0249 ,  H05K1/0231 ,  H05K1/0263 ,  H05K1/181 ,  H05K1/184 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10492 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/0401

摘要： A LSI package having an interface function with an exterior and a circuit device including the same comprises an interposer having a conductive terminal for connection to a mounting board, and an interface module which is electrically and mechanically connected to a surface of the interposer on which the conductive terminal is disposed, and interfaces signal input/output from/to the exterior and the interposer. Alternatively, the interface module is electrically and mechanically connected to a surface opposite a surface of the mounting board to which the interposer is connected.

摘要翻译： 具有外部接口功能的LSI封装和包括其的电路器件包括具有用于连接到安装板的导电端子的插入件，以及电连接和机械连接到插入件的表面的接口模块， 导电端子被布置，并且接口从/向外部和内插器输入/输出信号。 或者，接口模块电连接和机械地连接到与插入器连接的安装板的表面相对的表面。

公开(公告)号：US20060050493A1

公开(公告)日：2006-03-09

申请号：US11205142

申请日：2005-08-17

申请人： Hiroshi Hamasaki ,  Hideto Furuyama ,  Hideo Numata ,  Chiaki Takubo

发明人： Hiroshi Hamasaki ,  Hideto Furuyama ,  Hideo Numata ,  Chiaki Takubo

IPC分类号： H05K7/10

CPC分类号： H05K1/181 ,  G02B6/2552 ,  G02B6/4201 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/43 ,  H01L2924/0002 ,  H05K1/0239 ,  H05K3/301 ,  H05K2201/10325 ,  H05K2201/10522 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

摘要： According to an aspect of the present invention, there is provided an LSI package with an interface module including: an interposer, on which a signal processing LSI is mounted, having a mounting board connecting electrical terminal; and an interface module having a transmission line to wire a high-speed signal to the exterior and a socket connecting electrical terminal corresponding to a mounting board connecting socket, in which the interposer and the interface module have at least either loop electrodes or plate electrodes, respectively, and the interposer and the interface module are electrically connected by inductive coupling, electrostatic coupling, or combined coupling of these two couplings by at least either the loop electrodes or the plate electrodes.

摘要翻译： 根据本发明的一个方面，提供了一种具有接口模块的LSI封装，包括：安装有信号处理LSI的插入器，具有连接电端子的安装板; 以及接口模块，其具有将高速信号连接到外部的传输线和连接与安装板连接插座对应的电端子的插座，其中插入器和接口模块至少具有环形电极或板电极， 并且插入器和接口模块通过电感耦合，静电耦合或这两个耦合器通过至少环形电极或平板电极的组合耦合而电连接。

公开(公告)号：US07401983B2

公开(公告)日：2008-07-22

申请号：US11640861

申请日：2006-12-19

申请人： Wataru Sakurai ,  Kazuhito Saito ,  Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

发明人： Wataru Sakurai ,  Kazuhito Saito ,  Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

IPC分类号： G02B6/36

CPC分类号： G02B6/3644 ,  G02B6/3652 ,  G02B6/3696 ,  G02B6/4202

摘要： After a wiring plate 30 having a plurality of leads 31 been insert-molded to an edge face 21 of a molded article 20, unwanted portions of the wiring plate 30 are cut, thereby enabling easy three-dimensional wiring. As a result, an electrode terminal section 43 of a photoelectric conversion element 41 disposed opposite an end face 11b of an optical fiber 11 can be electrically coupled to an electrical wiring section 23 of an optical coupling part 10.

摘要翻译： 在具有多根引线31的布线板30嵌入成型到成形品20的边缘面21之后，切断布线板30的不希望的部分，从而能够容易地进行三维布线。 结果，与光纤11的端面11b相对设置的光电转换元件41的电极端子部43可以电耦合到光耦合部10的电配线部23。

公开(公告)号：US20060045434A1

公开(公告)日：2006-03-02

申请号：US11200045

申请日：2005-08-10

申请人： Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

发明人： Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

IPC分类号： G02B6/36

CPC分类号： G02B6/3644 ,  G02B6/3652 ,  G02B6/4201 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/428 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/15311 ,  H05K1/0274 ,  H01L2924/00 ,  H01L2224/0401

摘要： An optical semiconductor module comprises a guide which has a positioning portion for an optical transmission line, an optical semiconductor mounting surface from which one end face of the optical transmission line disposed in the positioning portion is exposed, and a wiring layer formed on the optical semiconductor mounting surface. An optical semiconductor element is mounted on the optical semiconductor mounting surface of the guide, with a light-emitting surface or a light-receiving surface thereof facing the one. end face of the optical transmission line, and is electrically connected to the wiring layer.

摘要翻译： 光学半导体模块包括具有用于光传输线路的定位部分的引导件，设置在定位部分中的光传输线的一个端面从该半导体安装表面露出的光学半导体安装表面和形成在光学半导体上的布线层 安装面。 光学半导体元件安装在引导件的光学半导体安装表面上，其发光表面或其光接收表面面向一个。 并且与导线层电连接。

公开(公告)号：US20070212001A1

公开(公告)日：2007-09-13

申请号：US11711862

申请日：2007-02-28

申请人： Wataru Sakurai ,  Kazuhito Saito ,  Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

发明人： Wataru Sakurai ,  Kazuhito Saito ,  Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

IPC分类号： G02B6/36

CPC分类号： G02B6/43 ,  G02B6/4202 ,  H01L2924/0002 ,  H01L2924/00

摘要： When a resin 59 to form a molded body 20 is poured and a lead frame 30 is attached to a front end face 21 of the molded body 20 by insert molding, protective leads 32 provided on both outsides of a lead pattern 31 of the lead frame 30 moderate the flow of the resin 59 and the force acting on the lead pattern 31 is decreased, so that misregistration of the lead pattern 31 can be prevented. Accordingly, the inserted and molded lead frame 30 can be wired on the front end face 21 of the molded body 20 for easily accomplishing three-dimensional electric wiring.

摘要翻译： 当浇铸形成模制体20的树脂59并且通过嵌件模制将引线框架30附接到模制体20的前端面21时，设置在引线框架的引线图案31的外侧的保护引线32 30使树脂59的流动缓和，并且作用在引线图案31上的力减小，从而可以防止引线图案31的不对准。 因此，插入成型的引线框架30可以布线在成型体20的前端面21上，以便于实现三维电线。

公开(公告)号：US20070165986A1

公开(公告)日：2007-07-19

申请号：US11640861

申请日：2006-12-19

申请人： Wataru Sakurai ,  Kazuhito Saito ,  Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

发明人： Wataru Sakurai ,  Kazuhito Saito ,  Hideo Numata ,  Chiaki Takubo ,  Hideto Furuyama ,  Hiroshi Hamasaki

IPC分类号： G02B6/36

CPC分类号： G02B6/3644 ,  G02B6/3652 ,  G02B6/3696 ,  G02B6/4202

摘要： After a wiring plate 30 having a plurality of leads 31 been insert-molded to an edge face 21 of a molded article 20, unwanted portions of the wiring plate 30 are cut, thereby enabling easy three-dimensional wiring. As a result, an electrode terminal section 43 of a photoelectric conversion element 41 disposed opposite an end face 11b of an optical fiber 11 can be electrically coupled to an electrical wiring section 23 of an optical coupling part 10.

摘要翻译： 在具有多根引线31的布线板30嵌入成型到成形品20的边缘面21之后，切断布线板30的不希望的部分，从而能够容易地进行三维布线。 结果，与光纤11的端面11b相对设置的光电转换元件41的电极端子部43可以电耦合到光耦合部10的电配线部23。

公开(公告)号：US20050184373A1

公开(公告)日：2005-08-25

申请号：US11062664

申请日：2005-02-23

申请人： Hideo Numata ,  Chiaki Takubo

发明人： Hideo Numata ,  Chiaki Takubo

IPC分类号： H01L23/12 ,  H01L21/301 ,  H01L21/58 ,  H01L21/68 ,  H01L21/98 ,  H01L23/58 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/27005 ,  H01L2224/2732 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

摘要： A method of fabrication a semiconductor device characerized by: mounting a first semiconductor chip on a wiring substrate; bonding a spacer having a first main surface and a second main surface oppose to the first main surface so that the first main surface contact to the first semiconductor chip; and bonding a second semiconductor chip having a third main surface larger than the first main surface, onto the second main surface via a layer of a die bonding material selectively formed on a part of the third main surface.

摘要翻译： 一种制造半导体器件的方法，其特征在于：将第一半导体芯片安装在布线基板上; 将具有第一主表面和第二主表面的间隔件与第一主表面相对接合，使得第一主表面接触第一半导体芯片; 以及将具有大于所述第一主表面的第三主表面的第二半导体芯片通过选择性地形成在所述第三主表面的一部分上的管芯接合材料层接合到所述第二主表面上。

公开(公告)号：US08338904B2

公开(公告)日：2012-12-25

申请号：US12883674

申请日：2010-09-16

申请人： Kazumasa Tanida ,  Chiaki Takubo ,  Hideo Numata ,  Yoshihisa Imori

发明人： Kazumasa Tanida ,  Chiaki Takubo ,  Hideo Numata ,  Yoshihisa Imori

IPC分类号： H01L31/05

CPC分类号： H01L27/14603 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14683

摘要： According to an embodiment, there is provided a semiconductor device including a semiconductor substrate having a first surface on which an active layer having a light receiving portion is provided and a second surface to be a light receiving surface for the light receiving portion, a wiring layer provided on the active layer, an insulating layer provided to cover the wiring layer, and a supporting substrate joined to the semiconductor substrate via the insulating layer to face the first surface of the semiconductor substrate. A joined body of the semiconductor substrate and the supporting substrate includes an intercalated portion provided between its outer peripheral surface and the active surface. The intercalated portion is provided to penetrate the semiconductor substrate and the insulating layer from the second surface of the semiconductor substrate and to reach inside the supporting substrate.

摘要翻译： 根据实施例，提供了一种半导体器件，其包括具有第一表面的半导体衬底，在该第一表面上设置有具有光接收部分的有源层和作为光接收部分的光接收表面的第二表面，布线层 设置在有源层上，设置为覆盖布线层的绝缘层，以及经由绝缘层与半导体基板接合以与半导体基板的第一表面相对的支撑基板。 半导体衬底和支撑衬底的接合体包括设置在其外周表面和活性表面之间的插入部分。 插入部分被设置为从半导体衬底的第二表面穿透半导体衬底和绝缘层并到达支撑衬底内部。