公开(公告)号：US4838914A

公开(公告)日：1989-06-13

申请号：US133435

申请日：1987-12-15

申请人： Hironori Ohta ,  Toshiyasu Kawaguchi ,  Takashi Mukaiyama ,  Katsuhiko Matsuzaki ,  Junichi Ebisawa ,  Naoki Taneda ,  Daikichi Arai ,  Noriyuki Yoshihara ,  Yoshikazu Yamada ,  Koushiro Kunii

发明人： Hironori Ohta ,  Toshiyasu Kawaguchi ,  Takashi Mukaiyama ,  Katsuhiko Matsuzaki ,  Junichi Ebisawa ,  Naoki Taneda ,  Daikichi Arai ,  Noriyuki Yoshihara ,  Yoshikazu Yamada ,  Koushiro Kunii

IPC分类号： C03B37/01 ,  C03C1/00 ,  C03C13/00 ,  C04B35/14 ,  C04B35/622 ,  D01F9/10

CPC分类号： D01F9/10 ,  C03B37/011 ,  C03C1/006 ,  C03C13/00 ,  C04B35/14 ,  C04B35/6224 ,  Y02P40/57 ,  Y10S264/19

摘要： A process for producing silica glass fibers comprising:a step of preparing a silica glass fiber spinning solution by adding a polymerization regulator to a silica sol solution obtained by the hydrolysis and condensation of a silicon alkoxide in the presence of an acid catalyst;a step of spinning the spinning solution into gel fibers by extruding the spinning solution from nozzles;a step of applying an oiling agent containing substantially no water or lower alcohol to the gel fibers;a step of forming a fiber cake by winding the oiled gel fibers on a tube or bobbin;a step of aging the gel fibers constituting the fiber cake;a step of sintering the gel fibers unwound from the fiber cake after the aging step, to form silica glass fibers.

公开(公告)号：US4981753A

公开(公告)日：1991-01-01

申请号：US246967

申请日：1988-09-21

申请人： Hironori Ohta ,  Takashi Mukaiyama

发明人： Hironori Ohta ,  Takashi Mukaiyama

IPC分类号： C03B37/01 ,  C03B37/075 ,  H05K1/03

CPC分类号： C03B37/011 ,  C03B37/075 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y10T428/2973 ,  Y10T428/298 ,  Y10T442/3008 ,  Y10T442/3114 ,  Y10T442/601 ,  Y10T442/611

摘要： A fabric for a printed circuit substrate composed essentially of inorganic fibers having a non-circular cross section.

摘要翻译： 用于印刷电路基板的织物，其基本上由具有非圆形横截面的无机纤维组成。

公开(公告)号：US20100193948A1

公开(公告)日：2010-08-05

申请号：US12160974

申请日：2007-01-10

申请人： Hironori Ohta

发明人： Hironori Ohta

IPC分类号： H01L23/498 ,  H01R12/32 ,  H05K1/18

CPC分类号： H05K1/0219 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a connecting structure between semiconductor device 1 of a BGA type which has external electrode terminals 9 including column-like electrode 17, insulating layer 16 formed around the column-like electrode 17 and annular electrode 15 formed around the insulating layer 16, and a printed wiring board capable of mounting the semiconductor device 1 and including lower-layer electrode 28 to be soldered to column-like electrode 17 of the aforementioned external electrode terminal 9 and upper-layer electrode 27 to be soldered to annular electrode 15 of the aforementioned external electrode terminal 9. Column-like electrode 17 of semiconductor device 1 is soldered to lower-layer electrode 28 of printed wiring board 2. Annular electrode 15 of semiconductor device 1 is soldered to upper-layer electrode 27 of printed wiring board 2.

摘要翻译： 本发明涉及一种BGA型半导体器件1之间的连接结构，其具有包括柱状电极17的外部电极端子9，形成在柱状电极17周围的绝缘层16和形成在绝缘层16周围的环形电极15 以及能够将半导体器件1安装并且包括要焊接的下层电极28的上述外部电极端子9的柱状电极17和要焊接的上层电极27的印刷电路板， 上述外部电极端子9.将半导体器件1的列状电极17焊接到印刷布线板2的下层电极28.半导体器件1的环形电极15被焊接到印刷线路板2的上层电极27 。

公开(公告)号：US08125081B2

公开(公告)日：2012-02-28

申请号：US12160974

申请日：2007-01-10

申请人： Hironori Ohta

发明人： Hironori Ohta

IPC分类号： H01L23/12

CPC分类号： H05K1/0219 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a connecting structure between semiconductor device 1 of a BGA type which has external electrode terminals 9 including column-like electrode 17, insulating layer 16 formed around the column-like electrode 17 and annular electrode 15 formed around the insulating layer 16, and a printed wiring board capable of mounting the semiconductor device 1 and including lower-layer electrode 28 to be soldered to column-like electrode 17 of the aforementioned external electrode terminal 9 and upper-layer electrode 27 to be soldered to annular electrode 15 of the aforementioned external electrode terminal 9. Column-like electrode 17 of semiconductor device 1 is soldered to lower-layer electrode 28 of printed wiring board 2. Annular electrode 15 of semiconductor device 1 is soldered to upper-layer electrode 27 of printed wiring board 2.

摘要翻译： 本发明涉及一种BGA型半导体器件1之间的连接结构，其具有包括柱状电极17的外部电极端子9，形成在柱状电极17周围的绝缘层16和形成在绝缘层16周围的环形电极15 以及能够将半导体器件1安装并且包括要焊接的下层电极28的上述外部电极端子9的柱状电极17和要焊接的上层电极27的印刷电路板， 上述外部电极端子9.将半导体器件1的列状电极17焊接到印刷布线板2的下层电极28.半导体器件1的环形电极15被焊接到印刷线路板2的上层电极27 。

公开(公告)号：US4062689A

公开(公告)日：1977-12-13

申请号：US672541

申请日：1976-04-01

申请人： Yoshiro Suzuki ,  Hironori Ohta ,  Masuo Shirasaka

发明人： Yoshiro Suzuki ,  Hironori Ohta ,  Masuo Shirasaka

IPC分类号： C03C3/076 ,  C03C3/078 ,  C03C13/00 ,  C03C3/04 ,  C04B31/06

CPC分类号： C03C13/002 ,  C03C3/076 ,  C03C3/078

摘要： A glass composition which possesses a chemical resistance. The glass composition consists essentially ofSiO.sub.2 : 45 - 65 wt.%ZrO.sub.2 : 10 - 20 wt.%Cr.sub.2 O.sub.3 : 0 - 5 wt.%SnO.sub.2 : 0 - 5 wt.%Ro: 0 - 18 wt.%R'.sub.2 o: 0 - 18 wt.%So.sub.3 : 0.05 - 1 wt.%Wherein the sum of contents of Cr.sub.2 O.sub.3 + SnO.sub.2 is 0.5 - 10 wt.%; the sum of contents of ZrO.sub.2 + SnO.sub.2 + Cr.sub.2 O.sub.3 is 12 - 25 wt.%; RO is selected from the group consisting of CaO, MgO, ZnO, BaO, and SrO; and R'.sub.2 O is selected from the group consisting of K.sub.2 O of 0 - 5 wt.%, Na.sub.2 O of 0 - 18 wt.% and Li.sub.2 O of 0 - 5 wt.%.

摘要翻译： 具有耐化学性的玻璃组合物。 该玻璃组合物主要由SiO 2：45-65wt。