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公开(公告)号：US5175211A
公开(公告)日：1992-12-29
申请号：US702323
申请日：1991-05-17
申请人： Takashi Sanada , Kaoru Kitadono , Yasurou Suzuki , Taichi Nishio , Hiroomi Abe , Noriyasu Kagawa
发明人： Takashi Sanada , Kaoru Kitadono , Yasurou Suzuki , Taichi Nishio , Hiroomi Abe , Noriyasu Kagawa
CPC分类号： C08L77/00 , C08K5/0008 , C08K5/35 , C08L71/123 , Y10S525/905
摘要： A thermoplastic resin composition comprises a polyphenylene ether having a reduced viscosity within the range of 0.30 dl/g or more and less than 0.45 dl/g, an aliphatic polyamide, a specified compatibilizing agent, and a rubber material. The composition has a high in heat distortion temperature and is superior in processability.
摘要翻译： 热塑性树脂组合物包含粘度在0.30dl / g以上且小于0.45dl / g的范围内的聚苯醚，脂肪族聚酰胺，规定的相容剂和橡胶材料。 该组合物的热变形温度高，加工性优异。
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公开(公告)号：US5086105A
公开(公告)日：1992-02-04
申请号：US448338
申请日：1989-12-11
申请人： Hiroomi Abe , Taichi Nishio , Kaoru Kitadono
发明人： Hiroomi Abe , Taichi Nishio , Kaoru Kitadono
IPC分类号： C08K3/00 , C08G65/48 , C08K3/34 , C08K5/09 , C08K5/1515 , C08K7/14 , C08L9/00 , C08L15/00 , C08L19/00 , C08L21/00 , C08L25/04 , C08L51/08 , C08L71/00 , C08L71/12 , C08L77/00 , C08L101/00
CPC分类号： C08L71/123 , C08G65/485 , C08K7/14 , C08L77/00 , C08K2201/016
摘要： The present invention provides a filler-containing thermoplastic resin composition which is well balanced in dimensinoal stability, rigidity, heat resistance and impact strength. This composition comprises: (I) 100 parts by weight of a resin comprising 5-95% by weight of a polyphenylene ether resin, a mixture of a polyphenylene ether resin and a styrene resin or a graft polymer of a polyphenylene ether resin and styrene and 95-5% by weight of polyamide resin, (II) 0-50 parts by weight of a rubber-like material, (III) 2.0-50 parts by weight of an inorganic filler having an average particle size of 5.0.mu. or less and/or a glass fiber and (IV) 0.01-10 parts by weight of at least one compatibilizing agent which improves compatibility between the polyphenylene resin and the polyamide resin. Talc is preferred as the inorganic filler.
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公开(公告)号：US5073620A
公开(公告)日：1991-12-17
申请号：US317838
申请日：1989-03-03
申请人： Takashi Sanada , Kaoru Kitadono , Yasurou Suzuki , Taichi Nishio , Hiroomi Abe , Noriyasu Kagawa
发明人： Takashi Sanada , Kaoru Kitadono , Yasurou Suzuki , Taichi Nishio , Hiroomi Abe , Noriyasu Kagawa
CPC分类号： C08L71/123 , C08F291/00 , C08K5/0008 , C08L51/08 , C08L77/00 , F02F7/006 , Y10S525/905
摘要： (A) 10-70 parts by weight of a polyphenylene ether, a mixture of a polyphenylene ether and a polystyrene or a polyphenylene ether-styrene graft copolymer,(B) 90-30 parts by weight of a mixture of (i) a thermoplastic aromatic copolyamide and/or an aromatic nuclear-hydrogenated copolyamide in an amount of 0.1-70% by weight of existing total polyamide and (ii) a thermoplastic aliphatic polyamide in a complementary amount of 99.9-30% by weight of existing total polyamide, and(C) 0.01-30 parts by weight, based on 100 parts by weight of the above components (A) and (B) of, at least one compound selected from the group consisting of oxazoline and a compound having, in its molecule, (a) carbon-carbon double bond or a carbon-carbon triple bond and (b) at least one functional group selected from carboxyl group, acid anhydride group, amino group, acid amide group, imido group, epoxy group, carboxylate ester group, isocyanate group, methylol group, oxazolidine group and hydroxyl group.This composition may further contain an impact strength modifier, namely, rubber-like material and/or modified rubber-like material.
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公开(公告)号：US4929675A
公开(公告)日：1990-05-29
申请号：US203775
申请日：1988-06-07
申请人： Hiroomi Abe , Taichi Nishio , Yasurou Suzuki , Takashi Sanada , Mitsuji Tsuji
发明人： Hiroomi Abe , Taichi Nishio , Yasurou Suzuki , Takashi Sanada , Mitsuji Tsuji
CPC分类号： C08L77/00 , C08K5/09 , C08L71/123 , Y10S525/905
摘要： A thermoplastic resin composition which comprises100 parts by weight of a composition (A) which comprises 5-95% by weight of a polyphenylene ether resin and 95-5% by weight of a polyamide,5-50 parts by weight of a modified rubber-like material (B) wherein 5-100 parts by weight of an aromatic vinyl compound is graft-polymerized with 100 parts by weight of a rubber-like material, the grafting ratio of the aromatic vinyl compound being 50% by weight or more, and0.05-20 parts by weight of an .alpha., .beta.-unsaturated carboxylic acid or its derivative (C).
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公开(公告)号：US5559185A
公开(公告)日：1996-09-24
申请号：US372863
申请日：1995-01-13
申请人： Hiroomi Abe , Taichi Nishio , Yasurou Suzuki , Mitsuji Tsuji , Takashi Sanada
发明人： Hiroomi Abe , Taichi Nishio , Yasurou Suzuki , Mitsuji Tsuji , Takashi Sanada
CPC分类号： C08L71/123 , C08L51/04 , C08L71/12 , C08L77/00 , C08L63/00
摘要： A thermoplastic resin composition superior in impact resistance, heat resistance, flexural rigidity, processability and solvent resistance which comprises: (A) 100 parts by weight of a resin composition comprising 5-95% by weight of a polyphenylene ether, or a polyphenylene ether and polystyrene, and 95-5% by weight of a polyamide resin; (B) 5-50 parts by weight of a modified saturated rubber obtained by grafting 5-100 parts by weight of an aromatic vinyl compound on 100 parts by weight of a saturated type rubber and allowing 0.05-10 parts by weight of a compatibilizing agent to react with said rubber; and (c) 0.05-20 parts by weight of a compatibilizing agent.
摘要翻译： 耐冲击性，耐热性，弯曲刚性，加工性和耐溶剂性优异的热塑性树脂组合物，其特征在于：（A）100重量份含有5-95重量％聚苯醚或聚苯醚的树脂组合物， 聚苯乙烯和95-5重量％的聚酰胺树脂; （B）5-50重量份通过在100重量份的饱和型橡胶上接枝5-100重量份的芳族乙烯基化合物而获得的改性饱和橡胶，并且允许0.05-10重量份的相容剂 与所述橡胶反应; 和（c）0.05-20重量份的相容剂。
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公开(公告)号：US5182336A
公开(公告)日：1993-01-26
申请号：US624304
申请日：1990-12-07
申请人： Hiroomi Abe , Kenji Nagaoka , Taichi Nishio , Hideo Shinonaga , Takashi Sanada
发明人： Hiroomi Abe , Kenji Nagaoka , Taichi Nishio , Hideo Shinonaga , Takashi Sanada
IPC分类号： C08L23/30 , C08K5/18 , C08K5/315 , C08K5/3412 , C08K5/3492 , C08L23/26 , C08L25/08 , C08L71/12 , C08L77/00
CPC分类号： C08L71/123 , C08K5/18 , C08K5/315 , C08K5/3412 , C08K5/34922 , C08L77/00 , Y10S525/905
摘要： The present invention provides a thermoplastic resin composition which comprises:(i) at least one compatibilizing agent in an amount effective for compatibilization,(ii) (A) a polyphenylene ether in an amount of about 40-100% by weight based on the total amount of (A) and (B) and(B) a homopolymer of alkenyl aromatic compound or a random copolymer of alkenyl aromatic compound and unsaturated compound in an amount of 0-about 60% by weight based on the total amount of (A) and (B), the total amount of (A) and (B) being about 10% by weight or more based on total amount of all polymer components,(iii) at least one polyamide in an amount more than the amount required for forming a continuous phase, and(iv) a compound having a molecular weight of 2,000 or less, containing nitrogen element, and having ring opening or condensation polymerizability or reactivity with acid or amine.
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公开(公告)号：US5162447A
公开(公告)日：1992-11-10
申请号：US564515
申请日：1991-02-13
申请人： Hiroomi Abe , Taichi Nishio , Yasurou Suzuki , Takashi Sanada
发明人： Hiroomi Abe , Taichi Nishio , Yasurou Suzuki , Takashi Sanada
IPC分类号： C08F283/08 , C08G65/48 , C08L71/12 , C08L77/00
CPC分类号： C08G65/485 , C08F283/08 , C08L71/126 , C08L77/00 , Y10S525/905
摘要： A process for making a thermoplastic resin composition which comprises a melting and mixing 100 parts by weight of polyphenylene ether (A) and 0.01-5.0 parts by weight of at least one compound (B) which contains in its molecule both (a) carbon-carbon double bond or carbon-carbon triple bond and (b) carboxyl group, acid anhydride group, acid amide group, imide group, carboxylic acid ester group, epoxy group, amino group or hydroxyl group in the presence of 0.01% or more and less than 0.1% by weight of radical initiator based on the polyphenylene ether (A),said polyphenylene ether (A) being obtained by oxidation-polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 represent a hydrogen atom, a halogen atom, a hydrocarbon or a substituted hydrocarbon group, with a proviso that at least one of them is a hydrogen atom, and said polyphenylene ether (a) having a reduced viscosity .eta..sub.sp/c of 0.40-0.58 deciliter/gram.
摘要翻译： 一种制备热塑性树脂组合物的方法，其包括熔融并混合100重量份的聚苯醚（A）和0.01-5.0重量份的至少一种化合物（B），其在分子中包含（a）碳 - 碳双键或碳 - 碳三键，和（b）羧基，酸酐基，酰胺基，酰亚胺基，羧酸酯基，环氧基，氨基或羟基，在0.01％以上 相对于聚苯醚（A）为0.1重量％以上的自由基引发剂，所述聚苯醚（A）是通过至少一种由下式表示的酚化合物的氧化聚合得到的：其中R1，R2，R3， R 4和R 5表示氢原子，卤素原子，烃基或取代的烃基，条件是它们中的至少一个是氢原子，并且所述聚苯醚（a）具有降低的粘度eta sp / c 0.40-0.58分升/克。
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公开(公告)号：US5147942A
公开(公告)日：1992-09-15
申请号：US476687
申请日：1990-02-08
申请人： Hiroomi Abe , Taichi Nishio , Yasurou Suzuki , Takeshi Sanada , Masahiro Kakugo
发明人： Hiroomi Abe , Taichi Nishio , Yasurou Suzuki , Takeshi Sanada , Masahiro Kakugo
IPC分类号： C08L51/00 , C08G65/48 , C08L51/06 , C08L53/00 , C08L67/00 , C08L71/00 , C08L71/12 , C08L75/00 , C08L77/00 , C08L81/00 , C08L101/00
CPC分类号： C08L71/12 , C08G65/485 , C08L77/00 , C08L67/00 , C08L71/00 , C08L75/00 , C08L81/00 , Y10S525/905
摘要： Disclosed is a thermoplastic resin composition improved in low-temperature impact resistance and processability which comprises:(A) 5-95% by weight of a polyamide resin which has a relative viscosity of 3.1-4.5 and has a ratio .alpha. of terminal amino group to terminal carboxyl group of 0
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公开(公告)号：US5166237A
公开(公告)日：1992-11-24
申请号：US482629
申请日：1990-02-20
申请人： Hiroomi Abe , Taichi Nishio , Takashi Sanada , Noriyasu Kagawa
发明人： Hiroomi Abe , Taichi Nishio , Takashi Sanada , Noriyasu Kagawa
IPC分类号： C08L33/08 , C08L33/04 , C08L33/10 , C08L33/18 , C08L63/00 , C08L71/12 , C08L77/00 , C08L77/06 , C09D133/08 , C09D133/10 , C09D133/18 , C09D177/06
CPC分类号： C08L71/123 , C08L77/00 , C08L63/00
摘要： A novel thermoplastic composition having improved paint adhesion strength comprising,A) from about 5 to 95 weight % of a6t least one polyphenylene ether.B) from about 95 to 5 weight % of at least one polyamide,C) paint adhesion improving amount of at least one paint adhesion improver selected from the class consisting of(1) homopolymers or copolymers of unsaturated nitrile compounds and(2) homopolymers or copolymers of alkyl (meth)acrylate, excluding an ethylene alkylacrylate copolymer having about 50 weight % or higher of ethylene,D) from about 0.01 to 30 parts by weight of at least one compatibilizer, based on 100 by weight of the total of the polyphenylene either and polyamide.
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公开(公告)号：US5073590A
公开(公告)日：1991-12-17
申请号：US698337
申请日：1991-05-07
申请人： Hiroomi Abe , Taichi Nishio , Kiyoshi Mitsui , Satoru Sogabe , Takashi Sanada
发明人： Hiroomi Abe , Taichi Nishio , Kiyoshi Mitsui , Satoru Sogabe , Takashi Sanada
IPC分类号： C08K3/34 , C08J3/20 , C08K3/00 , C08L1/00 , C08L23/08 , C08L23/10 , C08L23/26 , C08L33/04 , C08L35/00 , C08L51/06 , C08L53/00 , C08L57/00 , C08L57/10 , C08L77/00
CPC分类号： C08L77/00 , C08L23/10 , C08L2205/035 , C08L23/0869 , C08L51/06
摘要： A thermoplastic resin composition is obtained by blending 100 parts by weight of a resin blend consisting of 10 to 90% by weight of at least one polypropylene type resin (A) selected from the group consisting of modified polypropylenes and compounds composed of modified polypropylenes and polypropylenes, and 90 to 10% by weight of a polyamide resin (B); 2 to 30 parts by weight of an epoxy group containing copolymer (C) and 2 to 100 parts by weight of an ethylene-.alpha..beta.-unsaturated carboxylic acid alkyl estermaleic anhydride terpolymer (D).The composition can easily be processed into a molded product, a film, a sheet or the like by a conventional processing method such as injection molding and extrusion molding. The resulting product has a very good balance in physical properties such as heat resistance, coating properties, impact strength and flexural modulus. The composition of this invention is useful in the fields of automobiles, electric industry and electronic industry.
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