公开(公告)号：US5739145A

公开(公告)日：1998-04-14

申请号：US393020

申请日：1995-04-27

申请人： Hiroshi Nagase ,  Koji Kawai ,  Takashi Endoh ,  Shinya Ueno ,  Yuji Negishi

发明人： Hiroshi Nagase ,  Koji Kawai ,  Takashi Endoh ,  Shinya Ueno ,  Yuji Negishi

IPC分类号： A61K31/47 ,  A61K31/485 ,  C07D221/28 ,  C07D489/00

CPC分类号： A61K31/47 ,  A61K31/485

摘要： There are provided novel antitussive agents different from existing antitussive agents or those under development. Antitussive agents containing morphinan derivatives represented by compound 6: ##STR1## or pharmacologically acceptable acid-addition salts thereof and those derivatives or their salts as effective components. The antitussive agents according to the present invention have strong antitussive effects as highly selective .kappa.-opioid agonists, and may thus be applied as useful antitussive agents in the prophylaxis and treatment of coughing in a patient in need thereof.

摘要翻译： PCT No.PCT / JP94 / 01047 Sec。 371日期：1995年04月27日 102（e）1995年4月27日PCT PCT 1995年6月28日PCT公布。 出版物WO95 / 01178 日期1995年1月12日提供与现有止咳剂或正在开发的镇咳药不同的新型镇咳药。 含有由化合物6表示的吗啡喃衍生物的镇咳剂：其加成盐及其衍生物或其盐作为有效成分。 根据本发明的止咳剂具有作为高选择性κ-激动剂的强镇咳作用，因此可用作预防和治疗有需要的患者咳嗽的有用止咳剂。

公开(公告)号：US5464490A

公开(公告)日：1995-11-07

申请号：US174156

申请日：1993-12-27

申请人： Kazuhito Sato ,  Yuji Negishi

发明人： Kazuhito Sato ,  Yuji Negishi

IPC分类号： G02F1/1333 ,  G02F1/1341 ,  B32B31/00

CPC分类号： G02F1/1341 ,  G02F1/133351 ,  Y10T156/1056 ,  Y10T156/1074

摘要： A process for manufacturing a liquid crystal display, comprising the steps of providing a first base plate of a resin and a second base plate of a resin, providing at least one of the base plates with an electrically connecting terminal, forming an opening in a base plate of the base plates opposite the electrically connecting terminal when the base plates are bonded to each other, providing at least one of the base plates with a seal, bonding the base plates to each other by means of the seal, providing a space between the base plates with a liquid crystal, and separating the base plates on a line adjoining an edge of the opening. The opening protects the connecting terminal from being physically damaged and separated at the separation step to improve the production yield of the display.

摘要翻译： 一种制造液晶显示器的方法，包括以下步骤：提供树脂的第一基板和树脂的第二基板，至少一个基板提供电连接端子，在基底中形成开口 当基板彼此接合时，基板的与电连接端子相对的板，使至少一个基板具有密封，借助于密封将基板彼此粘合，从而在第 具有液晶的基板，并且在与开口的边缘相邻的线上分离基板。 开口保护连接端子在分离步骤时被物理损坏和分离，以提高显示器的产量。

公开(公告)号：US20080237589A1

公开(公告)日：2008-10-02

申请号：US12079259

申请日：2008-03-26

申请人： Yuji Negishi

发明人： Yuji Negishi

IPC分类号： H01L23/58 ,  H01L21/58

CPC分类号： H01L23/5389 ,  H01L21/4857 ,  H01L22/32 ,  H01L23/5385 ,  H01L23/552 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor device includes a first circuit substrate having a plurality of lower wiring lines and a plurality of upper wiring lines on the lower surface side and upper surface side thereof, respectively. A second circuit substrate is provided on a lower side of the first circuit substrate, the second circuit substrate having an opening which exposes part of the first circuit substrate, the second circuit substrate also having, on the lower surface side thereof, a plurality of external-connection connection pads and a plurality of test connection pads connected to the lower wiring lines. A first semiconductor construct is disposed on the lower side of the first circuit substrate within the opening of the second circuit substrate, the first semiconductor construct having a plurality of external connection electrodes connected to the lower wiring lines. A third circuit substrate and/or an electronic component is provided on an upper side of the first circuit substrate and connected to the upper wiring lines.

摘要翻译： 半导体器件包括分别在其下表面侧和上表面侧具有多个下布线和多个上布线的第一电路基板。 第二电路基板设置在第一电路基板的下侧，第二电路基板具有露出第一电路基板的一部分的开口，第二电路基板在其下表面侧还具有多个外部 连接连接焊盘和连接到下布线的多个测试连接焊盘。 第一半导体构造设置在第二电路基板的开口内的第一电路基板的下侧，第一半导体构造具有连接到下布线的多个外部连接电极。 第三电路基板和/或电子部件设置在第一电路基板的上侧并连接到上布线。

公开(公告)号：US08089777B2

公开(公告)日：2012-01-03

申请号：US12042427

申请日：2008-03-05

申请人： Yuji Negishi

发明人： Yuji Negishi

IPC分类号： H05K7/02 ,  H01L21/50

CPC分类号： H01L25/105 ,  H01L23/5389 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/82039 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00014

摘要： A semiconductor device includes an upper circuit board which has a plurality of upper-layer wirings including a plurality of first upper-layer wirings, and has a plurality of first and second lower-layer wirings. A first semiconductor structure body is provided on an upper side of the upper circuit board and is electrically connected to the first upper-layer wirings. A lower circuit board which is provided on a peripheral part of a lower side of the upper circuit board, the lower circuit board including a plurality of external connection wirings that are electrically connected to the second lower-layer wirings, and an opening portion which exposes the first lower-layer wirings. A second semiconductor structure body which is disposed in the opening portion of the lower circuit board, second semiconductor structure body including a plurality of external connection electrodes that are electrically connected to the first lower-layer wirings of the upper circuit board.

摘要翻译： 半导体器件包括具有包括多个第一上层布线的多个上层布线的上电路板，并且具有多个第一和第二下层布线。 第一半导体结构体设置在上电路板的上侧并且电连接到第一上层布线。 一个下电路板，设置在上电路板的下侧的周边部分上，下电路板包括电连接到第二下层布线的多个外部连接布线，以及一个露出的开口部分 第一个下层布线。 第二半导体结构体，设置在下电路板的开口部分中，第二半导体结构体包括电连接到上电路板的第一下层布线的多个外部连接电极。

公开(公告)号：US5390037A

公开(公告)日：1995-02-14

申请号：US113838

申请日：1993-08-30

申请人： Yuji Negishi

发明人： Yuji Negishi

IPC分类号： G02F1/1337 ,  C09K19/00

CPC分类号： G02F1/133784

摘要： A method of efficiently orienting liquid crystal molecules on an orientation film formed on one surface of a film substrate which constitutes part of a liquid crystal display panel. In this method, the film substrate is conveyed between a rubbing roll and a backup roll disposed opposite the rubbing roll such that the orientation film faces the rubbing roll, that the rubbing and backup rolls are rotated in contact with the film substrate to thereby rub the orientation film formed on the film substrate for orienting the liquid crystal molecules. Thus, the orientation film formed on the film substrate is continuously rubbed while the film substrate is being conveyed to thereby achieve efficient rubbing.

摘要翻译： 在构成液晶显示面板的一部分的薄膜基板的一个面上形成的取向膜上有效地取向液晶分子的方法。 在该方法中，将薄膜基板在摩擦辊和与摩擦辊相对配置的支承辊之间输送，使得取向膜面向摩擦辊，摩擦辊和支承辊与薄膜基板接触旋转，从而摩擦 在薄膜基板上形成用于取向液晶分子的取向膜。 因此，在薄膜基板被输送的同时，在膜基板上形成的取向膜被持续地摩擦，从而实现有效的摩擦。

公开(公告)号：US07932517B2

公开(公告)日：2011-04-26

申请号：US12079259

申请日：2008-03-26

申请人： Yuji Negishi

发明人： Yuji Negishi

IPC分类号： H01L23/58

CPC分类号： H01L23/5389 ,  H01L21/4857 ,  H01L22/32 ,  H01L23/5385 ,  H01L23/552 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor device includes a first circuit substrate having a plurality of lower wiring lines and a plurality of upper wiring lines on the lower surface side and upper surface side thereof, respectively. A second circuit substrate is provided on a lower side of the first circuit substrate, the second circuit substrate having an opening which exposes part of the first circuit substrate, the second circuit substrate also having, on the lower surface side thereof, a plurality of external-connection connection pads and a plurality of test connection pads connected to the lower wiring lines. A first semiconductor construct is disposed on the lower side of the first circuit substrate within the opening of the second circuit substrate, the first semiconductor construct having a plurality of external connection electrodes connected to the lower wiring lines. A third circuit substrate and/or an electronic component is provided on an upper side of the first circuit substrate and connected to the upper wiring lines.

摘要翻译： 半导体器件包括分别在其下表面侧和上表面侧具有多个下布线和多个上布线的第一电路基板。 第二电路基板设置在第一电路基板的下侧，第二电路基板具有露出第一电路基板的一部分的开口，第二电路基板在其下表面侧还具有多个外部 连接连接焊盘和连接到下布线的多个测试连接焊盘。 第一半导体构造设置在第二电路基板的开口内的第一电路基板的下侧，第一半导体构造具有连接到下布线的多个外部连接电极。 第三电路基板和/或电子部件设置在第一电路基板的上侧并连接到上布线。