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    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号：US20130020584A1

    公开(公告)日：2013-01-24

    申请号：US13639199

    申请日：2010-04-22

    申请人： Toshiyuki Oishi ,  Hiroshi Otsuka ,  Koji Yamanaka ,  Akira Inoue

    发明人： Toshiyuki Oishi ,  Hiroshi Otsuka ,  Koji Yamanaka ,  Akira Inoue

    IPC分类号： H01L29/78

    CPC分类号： H01L29/7787 ,  H01L29/0657 ,  H01L29/1029 ,  H01L29/2003 ,  H01L29/42316

    摘要： In the present invention, provided is a semiconductor device, including: a GaN channel layer which is provided on a substrate and through which electrons run; a barrier layer which is provided on the GaN channel layer and which contains at least one of In, Al, and Ga and contains N; a gate electrode which is provided on the barrier layer; and a source electrode and a drain electrode which are provided on the substrate across the gate electrode, in which, in a portion of the barrier layer between the gate electrode and the drain electrode, a magnitude of polarization of the barrier layer is smaller on the gate electrode side than on the drain electrode side. Thus, PAE can be improved by reducing Rd and Cgd simultaneously.

    摘要翻译： 在本发明中，提供了一种半导体器件，包括：GaN沟道层，其设置在基板上，电子通过该沟道层运行; 阻挡层，其设置在所述GaN沟道层上并且包含In，Al和Ga中的至少一个并且包含N; 设置在所述阻挡层上的栅电极; 以及源极电极和漏电极，其设置在跨越栅电极的基板上，其中在栅电极和漏电极之间的阻挡层的一部分中，阻挡层的极化大小在 栅电极侧比漏极侧。 因此，通过同时减少Rd和Cgd可以改善PAE。

    SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    5.
    发明申请
    SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    半导体器件及制造半导体器件的方法

    公开(公告)号：US20130175544A1

    公开(公告)日：2013-07-11

    申请号：US13824357

    申请日：2010-11-10

    申请人： Toshiyuki Oishi ,  Hiroshi Otsuka ,  Koji Yamanaka ,  Kazuhisa Yamauchi ,  Masatake Hangai ,  Masatoshi Nakayama

    发明人： Toshiyuki Oishi ,  Hiroshi Otsuka ,  Koji Yamanaka ,  Kazuhisa Yamauchi ,  Masatake Hangai ,  Masatoshi Nakayama

    IPC分类号： H01L29/20 ,  H01L21/02

    CPC分类号： H01L29/2003 ,  H01L21/0254 ,  H01L29/0607 ,  H01L29/0657 ,  H01L29/205 ,  H01L29/7786

    摘要： It is an object to attain both high gain and a broad band (that is, to attain both reduction in a gate-drain capacitance and reduction in a source-drain capacitance). Provided is a semiconductor device, including: a GaN channel layer (3) through which electrons travel; a barrier layer (4) which is provided on the GaN channel layer in order to form two-dimensional electron gas in the GaN channel layer and which contains at least any one of In, Al, and Ga and contains N; a gate electrode (8), a source electrode (6), and a drain electrode (7); and a plate (20) formed of a material having polarization, which is provided between the gate electrode (8) and the drain electrode (7), the plate being held in contact with a part of the barrier layer (4).

    摘要翻译： 本发明的目的是获得高增益和宽带（即，获得栅极 - 漏极电容的减小和源极 - 漏极电容的减小）。 提供了一种半导体器件，包括：电子行进通过的GaN沟道层（3）; 阻挡层（4），其设置在所述GaN沟道层上，以在所述GaN沟道层中形成二维电子气，并且其包含In，Al和Ga中的至少任一个并且包含N; 栅电极（8），源电极（6）和漏电极（7）; 以及设置在所述栅极（8）和所述漏电极（7）之间的具有偏振材料的板（20），所述板与所述阻挡层（4）的一部分保持接触。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    10.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号：US20090142871A1

    公开(公告)日：2009-06-04

    申请号：US12323634

    申请日：2008-11-26

    申请人： Kenichi Ohtsuka ,  Yoichiro Tarui ,  Yosuke Suzuki ,  Katsuomi Shiozawa ,  Kyozo Kanamoto ,  Toshiyuki Oishi ,  Yasunori Tokuda ,  Tatsuo Omori

    发明人： Kenichi Ohtsuka ,  Yoichiro Tarui ,  Yosuke Suzuki ,  Katsuomi Shiozawa ,  Kyozo Kanamoto ,  Toshiyuki Oishi ,  Yasunori Tokuda ,  Tatsuo Omori

    IPC分类号： H01L21/20 ,  H01L33/00

    CPC分类号： H01S5/34333 ,  B82Y20/00 ,  H01L33/325 ,  H01L33/40 ,  H01S5/0421 ,  H01S5/0425 ,  H01S5/22 ,  H01S5/2214 ,  H01S5/3063

    摘要： A method of manufacturing a semiconductor device provides a semiconductor device with a gallium-nitride-based semiconductor structure that allows long-term stable operation without degradation in device performance. After formation of an insulation film on a surface other than on a ridge surface, an oxygen-containing gas such as O2, O3, NO, N2O, or NO2 is supplied to oxidize a p-type GaN contact layer from the surface and to thereby form an oxide film on the surface of the p-type GaN contact layer. Then, a p-type electrode that establishes contact with the p-type GaN contact layer is formed by evaporation or sputtering on the oxide film and on the insulation film. Heat treatment is subsequently performed at temperatures between 400 and 700° C. in an atmosphere containing a nitrogen-containing gas such as N2 or NH3 or an inert gas such as Ar or He.

    摘要翻译： 半导体器件的制造方法为半导体器件提供了氮化镓基半导体结构，其允许长期稳定的操作而不会降低器件性能。 在表面以外的表面上形成绝缘膜之后，供给诸如O 2，O 3，NO，N 2 O或NO 2的含氧气体以从表面氧化p型GaN接触层，由此 在p型GaN接触层的表面上形成氧化膜。 然后，通过在氧化物膜和绝缘膜上的蒸发或溅射形成与p型GaN接触层建立接触的p型电极。 随后在含有含氮气体如N 2或NH 3或惰性气体例如Ar或He的气氛中，在400-700℃的温度下进行热处理。