公开(公告)号：US20050087747A1

公开(公告)日：2005-04-28

申请号：US10929522

申请日：2004-08-31

申请人： Hiroshi Yamada ,  Keiji Takaoka

发明人： Hiroshi Yamada ,  Keiji Takaoka

IPC分类号： H01S5/022 ,  G02B6/122 ,  G02B6/43 ,  H01L25/16 ,  H01L31/0232 ,  H01L31/12 ,  H01S5/00 ,  H01S5/02 ,  H01S5/42 ,  H04B10/28 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H01L33/00

CPC分类号： H05K1/0274 ,  G02B6/43 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01S5/005 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/423 ,  H05K1/181 ,  H05K3/4602 ,  H01L2924/00 ,  H01L2224/48

摘要： A optoelectronic semiconductor device, mountable on and electrically connectable to an electro-optical wiring board, a substrate thereof having a light input/output through-hole and electric connection through-holes, the light input/output through-hole being not formed in a stressed area of the circuit wiring board, but formed in a non-stressed area of the circuit wiring board, the stressed area being an area where a stress is larger in value than the mean value of stresses caused in the circuit wiring board by a difference in coefficient of thermal expansion between the circuit wiring board and the electro-optical wiring board when the electrode on the semiconductor optoelectronic device is mechanically fixed to and electrically connected to the electro-optical wiring board.

摘要翻译： 可安装在电光布线板上并可电连接到电光布线板的光电子半导体器件，具有光输入/输出通孔和电连接通孔的基片，光输入/输出通孔不形成在 电路布线板的受应力区域，但形成在电路布线板的非应力区域中，应力区域的应力比电路布线板中产生的应力的平均值大的差值 当半导体光电子器件上的电极被机械地固定并电连接到电光布线板时，电路布线板和电光布线板之间的热膨胀系数。

公开(公告)号：US07589282B2

公开(公告)日：2009-09-15

申请号：US10899154

申请日：2004-07-27

申请人： Hiroshi Yamada ,  Keiji Takaoka ,  Hideto Furuyama

发明人： Hiroshi Yamada ,  Keiji Takaoka ,  Hideto Furuyama

IPC分类号： H05K1/03

CPC分类号： G02B6/43 ,  G02B6/4214 ,  G02B6/4232 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0274 ,  H05K1/183 ,  H05K3/4602

摘要： A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.

摘要翻译： 布线板包括具有第一和第二芯板的芯复合层和光传输部分; 设置在所述芯复合层的一部分上的第一电极，适于将光学半导体模块安装在所述芯复合层上; 上下芯板布线布置在芯复合层的另一部分和下面; 以及堆叠在上下芯板布线上的上下叠层布线，适于安装半导体模块。

公开(公告)号：US07427804B2

公开(公告)日：2008-09-23

申请号：US11798955

申请日：2007-05-18

申请人： Hiroshi Yamada ,  Keiji Takaoka

发明人： Hiroshi Yamada ,  Keiji Takaoka

IPC分类号： H01L33/00 ,  H11L27/15

CPC分类号： H05K1/0274 ,  G02B6/43 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01S5/005 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/423 ,  H05K1/181 ,  H05K3/4602 ,  H01L2924/00 ,  H01L2224/48

摘要： A optoelectronic semiconductor device, mountable on and electrically connectable to an electro-optical wiring board, a substrate thereof having a light input/output through-hole and electric connection through-holes, the light input/output through-hole being not formed in a stressed area of the circuit wiring board, but formed in a non-stressed area of the circuit wiring board, the stressed area being an area where a stress is larger in value than the mean value of stresses caused in the circuit wiring board by a difference in coefficient of thermal expansion between the circuit wiring board and the electro-optical wiring board when the electrode on the semiconductor optoelectronic device is mechanically fixed to and electrically connected to the electro-optical wiring board.

摘要翻译： 可安装在电光布线板上并可电连接到电光布线板的光电子半导体器件，具有光输入/输出通孔和电连接通孔的基片，光输入/输出通孔不形成在 电路布线板的受应力区域，但形成在电路布线板的非应力区域中，应力区域的应力比电路布线板中产生的应力的平均值大的差值 当半导体光电子器件上的电极被机械地固定并电连接到电光布线板时，电路布线板和电光布线板之间的热膨胀系数。

公开(公告)号：US07463491B2

公开(公告)日：2008-12-09

申请号：US11707106

申请日：2007-02-16

申请人： Hiroshi Yamada ,  Keiji Takaoka ,  Hideto Furuyama

发明人： Hiroshi Yamada ,  Keiji Takaoka ,  Hideto Furuyama

IPC分类号： H05K7/00

CPC分类号： G02B6/43 ,  G02B6/4214 ,  G02B6/4232 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0274 ,  H05K1/183 ,  H05K3/4602

摘要： A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.

摘要翻译： 布线板包括具有第一和第二芯板的芯复合层和光传输部分; 设置在所述芯复合层的一部分上的第一电极，适于将光学半导体模块安装在所述芯复合层上; 上下芯板布线布置在芯复合层的另一部分和下面; 以及堆叠在上下芯板布线上的上下叠层布线，适于安装半导体模块。

公开(公告)号：US07230278B2

公开(公告)日：2007-06-12

申请号：US10929522

申请日：2004-08-31

申请人： Hiroshi Yamada ,  Keiji Takaoka

发明人： Hiroshi Yamada ,  Keiji Takaoka

IPC分类号： H01L33/00

CPC分类号： H05K1/0274 ,  G02B6/43 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01S5/005 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/423 ,  H05K1/181 ,  H05K3/4602 ,  H01L2924/00 ,  H01L2224/48

摘要： A optoelectronic semiconductor device, mountable on and electrically connectable to an electro-optical wiring board, a substrate thereof having a light input/output through-hole and electric connection through-holes, the light input/output through-hole being not formed in a stressed area of the circuit wiring board, but formed in a non-stressed area of the circuit wiring board, the stressed area being an area where a stress is larger in value than the mean value of stresses caused in the circuit wiring board by a difference in coefficient of thermal expansion between the circuit wiring board and the electro-optical wiring board when the electrode on the semiconductor optoelectronic device is mechanically fixed to and electrically connected to the electro-optical wiring board.

摘要翻译： 可安装在电光布线板上并可电连接到电光布线板的光电子半导体器件，具有光输入/输出通孔和电连接通孔的基片，光输入/输出通孔不形成在 电路布线板的受应力区域，但形成在电路布线板的非应力区域中，应力区域的应力比电路布线板中产生的应力的平均值大的差值 当半导体光电子器件上的电极被机械地固定并电连接到电光布线板时，电路布线板和电光布线板之间的热膨胀系数。

公开(公告)号：US20070221931A1

公开(公告)日：2007-09-27

申请号：US11798955

申请日：2007-05-18

申请人： Hiroshi Yamada ,  Keiji Takaoka

发明人： Hiroshi Yamada ,  Keiji Takaoka

IPC分类号： H01L33/00 ,  H01L27/15

CPC分类号： H05K1/0274 ,  G02B6/43 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01S5/005 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/423 ,  H05K1/181 ,  H05K3/4602 ,  H01L2924/00 ,  H01L2224/48

摘要： A optoelectronic semiconductor device, mountable on and electrically connectable to an electro-optical wiring board, a substrate thereof having a light input/output through-hole and electric connection through-holes, the light input/output through-hole being not formed in a stressed area of the circuit wiring board, but formed in a non-stressed area of the circuit wiring board, the stressed area being an area where a stress is larger in value than the mean value of stresses caused in the circuit wiring board by a difference in coefficient of thermal expansion between the circuit wiring board and the electro-optical wiring board when the electrode on the semiconductor optoelectronic device is mechanically fixed to and electrically connected to the electro-optical wiring board.

公开(公告)号：US20070151752A1

公开(公告)日：2007-07-05

申请号：US11707106

申请日：2007-02-16

申请人： Hiroshi Yamada ,  Keiji Takaoka ,  Hideto Furuyama

发明人： Hiroshi Yamada ,  Keiji Takaoka ,  Hideto Furuyama

IPC分类号： H05K1/03

CPC分类号： G02B6/43 ,  G02B6/4214 ,  G02B6/4232 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0274 ,  H05K1/183 ,  H05K3/4602

摘要： A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.

摘要翻译： 布线板包括具有第一和第二芯板的芯复合层和光传输部分; 设置在所述芯复合层的一部分上的第一电极，适于将光学半导体模块安装在所述芯复合层上; 上下芯板布线布置在芯复合层的另一部分和下面; 以及堆叠在上下芯板布线上的上下叠层布线，适于安装半导体模块。

公开(公告)号：US20050063635A1

公开(公告)日：2005-03-24

申请号：US10899154

申请日：2004-07-27

申请人： Hiroshi Yamada ,  Keiji Takaoka ,  Hideto Furuyama

发明人： Hiroshi Yamada ,  Keiji Takaoka ,  Hideto Furuyama

IPC分类号： G02B6/12 ,  G02B6/42 ,  G02B6/43 ,  H01L23/12 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46

CPC分类号： G02B6/43 ,  G02B6/4214 ,  G02B6/4232 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0274 ,  H05K1/183 ,  H05K3/4602

摘要： A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.

摘要翻译： 布线板包括具有第一和第二芯板的芯复合层和光传输部分; 设置在所述芯复合层的一部分上的第一电极，适于将光学半导体模块安装在所述芯复合层上; 上下芯板布线布置在芯复合层的另一部分和下面; 以及堆叠在上下芯板布线上的上下叠层布线，适于安装半导体模块。

公开(公告)号：US10859932B2

公开(公告)日：2020-12-08

申请号：US15522567

申请日：2015-10-08

申请人： Tsuyoshi Sugimoto ,  Shinya Nakayama ,  Hiroshi Yamada ,  Hideyuki Santo ,  Ryuta Chiba ,  Suzuka Amemori ,  Kohsuke Nagata

发明人： Tsuyoshi Sugimoto ,  Shinya Nakayama ,  Hiroshi Yamada ,  Hideyuki Santo ,  Ryuta Chiba ,  Suzuka Amemori ,  Kohsuke Nagata

IPC分类号： G03G9/087

摘要： A toner, including: a polyester resin, wherein the polyester resin has a structure represented by any one of formulas 1) to 3) below: 1) R1-(NHCONH-R2)n-, 2) R1-(NHCOO-R2)n-, and 3) R1-(OCONH-R2)n-, where n is 3 or more, R1 represents an aromatic organic group or an aliphatic organic group, and R2 represents a group derived from a resin that is polyester formed of polycarboxylic acid, polyol, or both thereof; or that is a modified polyester obtained by modifying polyester with isocyanate.

公开(公告)号：US10303072B2

公开(公告)日：2019-05-28

申请号：US15889461

申请日：2018-02-06

申请人： Akira Tanaka ,  Hiroyuki Takeda ,  Junichi Awamura ,  Hiroshi Yamada ,  Daichi Hisakuni ,  Yasuo Kamada

发明人： Akira Tanaka ,  Hiroyuki Takeda ,  Junichi Awamura ,  Hiroshi Yamada ,  Daichi Hisakuni ,  Yasuo Kamada

IPC分类号： G03G9/087 ,  C08G63/42 ,  C08G63/20 ,  G03G15/00 ,  C08G63/195 ,  C08G63/16 ,  C08G63/66 ,  C08G18/75 ,  C08G18/42

摘要： A toner is provided. The toner contains a polyester resin. The toner has a glass transition temperature (Tg1st) at first temperature rising of differential scanning calorimetry (DSC) of from 45° C. to 65° C. The toner includes a component insoluble in tetrahydrofuran (THF) having two glass transition temperatures (Tga1st and Tgb1st) at the first temperature rising of DSC, where Tga1st is in a range of −45° C. to 5° C. and Tgb1st is in a range of 45° C. to 70° C. The toner includes a component soluble in THF having a glass transition temperature (Tg2nd) at second temperature rising of DSC of from 40° C. to 65° C.