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公开(公告)号：US5756600A
公开(公告)日：1998-05-26
申请号：US694688
申请日：1996-08-09
CPC分类号： C08G18/6705 , C08F290/14 , C08F8/30 , C08G18/672 , Y10T428/24994
摘要： A composition useful as a sheet or bulk molding compound comprises a urethane-modified vinyl ester resin (A), or acid-addition vinyl ester resn (A') obtained by reacting the hydroxyl groups in (A) with a polybasic acid anhydride (B), and a double bond(s)-containing monomer (C), wherein (A) is prepared by reacting a vinyl ester resin (F) derived from the reaction of an epoxy resin (D) and an unsaturated monobasic acid (E), with a polyisocyanate (H) and, optionally, a hydroxyl group(s)-containing (meth)acrylate (G) in an isocyanate:hydroxyl groups equivalent ratio of from 0.01-1.2:1.
摘要翻译： 可用作片或模塑料的组合物包含通过使（A）中的羟基与多元酸酐（B）反应获得的氨基甲酸酯改性的乙烯基酯树脂（A）或酸加成乙烯基酯（A'） ）和含双键的单体（C），其中（A）通过使来自环氧树脂（D）的反应的乙烯基酯树脂（F）与不饱和一元酸（E）的反应制备， ，异氰酸酯（H）和任选的含有（甲基）丙烯酸酯的羟基（G）的异氰酸酯：羟基当量比为0.01-1.2:1。
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公开(公告)号：US5886205A
公开(公告)日：1999-03-23
申请号：US843638
申请日：1997-04-10
CPC分类号： C07F7/0889 , C07F7/1892
摘要： A process for producing silicon-containing isocyanate compounds of the general formula II, comprising thermally induced decomposition of a silicon-containing carbamic ester of the general formula I at a pH of not higher than 8 in the presence of a catalyst of at least one metal or its compound.General Formula I: ##STR1## General Formula II: ##STR2## wherein R.sup.1 to R.sup.6 and R.sup.8 each represent a hydrocarbon group, R.sup.7 represents an alkylene group having 1 to 8 carbon atoms, n, m and l represent an integer of 0 to 3 and m+n+l=3, and a, b and c represent integers of 0 to 3, 0 to 2, and 0 to 8, respectively.
摘要翻译： 一种制备通式II的含硅异氰酸酯化合物的方法，包括在至少一种金属的催化剂存在下，在不高于8的pH下热分解通式I的含硅氨基甲酸酯 或其化合物。 通式I：
通式II：其中R 1至R 6和R 8各自表示烃基，R 7表示具有1至8个碳原子的亚烷基，n，m和l表示0至3的整数 和m + n + 1 = 3，a，b和c分别表示0至3,0至2和0至8的整数。 -
公开(公告)号：US07125623B2
公开(公告)日：2006-10-24
申请号：US09950081
申请日：2001-09-12
申请人： Hiroya Okumura , Takashi Shibata
发明人： Hiroya Okumura , Takashi Shibata
CPC分类号： C04B26/06 , C04B26/14 , C04B2111/00853 , C04B2111/94 , H01B1/122 , H01M8/0213 , H01M8/0226 , Y02P70/56 , C04B14/022
摘要： A separator for solid polymer-type fuel cell is produced by molding the resin composition which comprises an electroconductive agent and a radical-polymerizable thermosetting resin system by a resin molding method. The electroconductive agent comprises a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin (especially, a vinyl ester-series resin) and a radical-polymerizable diluent. It is preferred that the double bond equivalent of the radical-polymerizable resin may about 200 to 1,000 and that the hardened radical-polymerizable thermosetting resin system has a glass transition temperature of 120° C. or more. The weight ratio of the electroconductive agent to the radical-polymerizable thermosetting resin system may be about 55/45 to 95/5. Such a separator is suitable for fuel cell (in particular, solid polymer-type fuel cell), and can be produced with advantageous for commercial production.
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公开(公告)号：US5854313A
公开(公告)日：1998-12-29
申请号：US845206
申请日：1997-04-21
申请人： Yoshimasa Omori , Hiroya Okumura , Takashi Shibata
发明人： Yoshimasa Omori , Hiroya Okumura , Takashi Shibata
IPC分类号： C08F265/04 , C08F290/06 , C08G59/17 , C08L63/10 , C08K3/20
CPC分类号： C08L63/10 , C08F265/04 , C08F290/064 , C08G59/1466 , Y10S525/922
摘要： Fine particles of high heat resistant polymer obtained by emulsion polymerization or seeded polymerization of at least one epoxy ester (C) having two or more unsaturated bonds in one molecule and at least one reactive monomer (D) having at least one unsaturated double bond in one molecule, in the absence of a water-insoluble inorganic material as a dispersion stabilizer, the epoxy ester (C) being obtained by adding at least one unsaturated monobasic acid (B) to at least one epoxide (A-1) having at least one glycidyl group and one monocyclic hydrocarbon group in one molecule, and/or at least one epoxide (A-2) having at least one cycloaliphatic epoxy group in one molecule. The fine polymer particles have excellent heat resistance and solvent resistance, and an aqueous or alcoholic dispersion of such fine polymer particles is produced therefrom.
摘要翻译： 通过在一个分子中具有两个或更多个不饱和键的至少一个环氧酯（C）和至少一个在一个分子中具有至少一个不饱和双键的反应性单体（D）的乳液聚合或接种聚合而获得的高耐热聚合物的细颗粒 分子，在不存在作为分散稳定剂的水不溶性无机材料的情况下，环氧酯（C）是通过向至少一种具有至少一个的环氧化物（A-1）的至少一种环氧化物（A-1）加入至少一种不饱和一元酸 一个分子中的缩水甘油基和一个单环烃基，和/或至少一个在一个分子中具有至少一个脂环族环氧基的环氧化物（A-2）。 聚合物微粒具有优异的耐热性和耐溶剂性，由此生产这种聚合物微粒的水分散体或醇分散体。
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公开(公告)号：US20060240303A1
公开(公告)日：2006-10-26
申请号：US10545210
申请日：2004-02-13
CPC分类号： H01M8/0221 , H01B1/24 , H01M8/0213 , H01M8/0226
摘要： An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.
摘要翻译： 通过树脂模塑法将含有导电剂的导电树脂组合物和具有特定范围内酸值的自由基聚合性热固性树脂体系模制成导电板。 导电剂可以是碳粉末。 可自由基聚合的热固性树脂体系可以包含可自由基聚合的树脂和可自由基聚合的稀释剂。 可自由基聚合性树脂的双键当量优选为约200〜1000。硬化物的玻璃化转变温度优选为120℃以上。导电剂相对于可自由基聚合的比例（重量比） 热固性树脂体系[前者/后者]约为55/45至95/5。
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公开(公告)号：US06815053B2
公开(公告)日：2004-11-09
申请号：US10221373
申请日：2003-01-02
申请人： Tomoko Inoue , Hiroya Okumura , Isao Hirata , Shigehiro Okada
发明人： Tomoko Inoue , Hiroya Okumura , Isao Hirata , Shigehiro Okada
IPC分类号： B32B516
CPC分类号： B32B5/26 , B32B5/022 , B32B5/024 , B32B27/04 , B32B27/20 , B32B2260/046 , B32B2262/101 , B32B2264/02 , B32B2305/72 , B32B2307/734 , B32B2398/20 , B32B2605/00 , B32B2605/12 , C08F283/01 , C08F290/064 , C08J5/24 , H05K1/036 , H05K1/0366 , H05K1/0373 , H05K2201/0129 , H05K2201/0145 , H05K2201/0209 , H05K2201/0212 , H05K2201/068 , Y10T428/249924 , Y10T428/25 , Y10T428/254 , Y10T428/26 , Y10T428/2904 , Y10T428/2927 , Y10T428/298 , Y10T428/2991 , Y10T428/31786
摘要： A low thermal expansion laminated plate which has excellent heat resistance, water resistance and toughness and whose average linear expansion coefficient within the temperature ranging from 40 to 150° C. is not higher than 20×10−6/° C. can be obtained by laminating and curing fiber-reinforced layers impregnated with a resin composition consisting of a radically polymerizable resin, radically polymerizable monomer and inorganic filler combined with a specific amount of a thermoplastic resin.
摘要翻译： 具有优异的耐热性，耐水性和韧性以及在40至150℃的温度范围内的平均线性膨胀系数的低热膨胀层压板不高于20×10 -6 /℃可以通过 层压和固化由可自由基聚合的树脂，可自由基聚合的单体和与特定量的热塑性树脂组合的无机填料组成的树脂组合物浸渍的纤维增强层。
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公开(公告)号：US07604755B2
公开(公告)日：2009-10-20
申请号：US10545210
申请日：2004-02-13
CPC分类号： H01M8/0221 , H01B1/24 , H01M8/0213 , H01M8/0226
摘要： An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.
摘要翻译： 通过树脂模塑法将含有导电剂的导电树脂组合物和具有特定范围内酸值的自由基聚合性热固性树脂体系模制成导电板。 导电剂可以是碳粉末。 可自由基聚合的热固性树脂体系可以包含可自由基聚合的树脂和可自由基聚合的稀释剂。 可自由基聚合性树脂的双键当量优选为约200〜1000。硬化物的玻璃化转变温度优选为120℃以上。导电剂相对于可自由基聚合的比例（重量比） 热固性树脂体系[前者/后者]约为55/45至95/5。
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