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1.发明申请公开(公告)号：US20110062029A1
公开(公告)日：2011-03-17
申请号：US12840564
申请日：2010-07-21
申请人： Toshihisa Isono , Naoyuki Omura , Koji Shimizu , Shinji Tachibana
发明人： Toshihisa Isono , Naoyuki Omura , Koji Shimizu , Shinji Tachibana
摘要： For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ε-caprolactam, is contained in the bath as a leveler.
摘要翻译： 为了用于通孔和盲通孔共存的电路板，其中通孔的覆盖功率和盲孔的堵塞性能足够的电解铜电镀浴和电镀方法， 使用电解铜电镀浴。 电解镀铜浴主要由水溶性铜盐，硫酸和氯离子组成。 通过加热二乙烯三胺，己二酸和ε-己内酰胺的缩聚产物的表氯醇改性产物加工得到的聚酰胺多胺作为整平剂包含在浴中。
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公开(公告)号：US07892411B2
公开(公告)日：2011-02-22
申请号：US12187918
申请日：2008-08-07
摘要： Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive while using a soluble anode or insoluble anode as an anode and the workpieces as cathodes, including the steps of, setting a bath current density at not higher than 5 A/L, immersing metal copper in a region of the copper sulfate plating bath, the region being apart from a region between the anode and the cathode and also from regions adjacent the anode and cathode, respectively, such that a neighborhood of the thus-immersed metal copper can be used as an oxidative decomposition region, setting an immersed area of the metal copper at not smaller than 0.001 dm2/L based on the plating bath, and applying air bubbling to the oxidative decomposition region at not lower than 0.01 L/dm2·min based on the immersed area.
摘要翻译： 本发明公开了一种电解铜电镀工艺，该方法是在使用可溶性阳极或不溶性阳极作为阳极并将工件作为阴极的情况下，在填充于镀槽中的含硫酸铜电镀液中的铜上电镀铜并含有有机添加剂， 设定浴电流密度不高于5A / L，将金属铜浸入硫酸铜电镀槽区域，该区域与阳极和阴极之间的区域以及与阳极和阴极相邻的区域分开 ，使得这样浸入的金属铜的附近可以用作氧化分解区域，基于电镀槽将金属铜的浸渍面积设定为不小于0.001dm 2 / L，并将空气鼓泡 氧化分解区域根据浸渍面积不低于0.01 L / dm2·min。
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公开(公告)号：US20060240303A1
公开(公告)日：2006-10-26
申请号：US10545210
申请日：2004-02-13
CPC分类号： H01M8/0221 , H01B1/24 , H01M8/0213 , H01M8/0226
摘要： An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.
摘要翻译： 通过树脂模塑法将含有导电剂的导电树脂组合物和具有特定范围内酸值的自由基聚合性热固性树脂体系模制成导电板。 导电剂可以是碳粉末。 可自由基聚合的热固性树脂体系可以包含可自由基聚合的树脂和可自由基聚合的稀释剂。 可自由基聚合性树脂的双键当量优选为约200〜1000。硬化物的玻璃化转变温度优选为120℃以上。导电剂相对于可自由基聚合的比例（重量比） 热固性树脂体系[前者/后者]约为55/45至95/5。
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公开(公告)号：US20060078465A1
公开(公告)日：2006-04-13
申请号：US11287285
申请日：2005-11-28
申请人： Tadashi Chiba , Koji Monden , Kazuki Yoshikawa , Shinji Tachibana
发明人： Tadashi Chiba , Koji Monden , Kazuki Yoshikawa , Shinji Tachibana
IPC分类号： G05D21/02
CPC分类号： C23C18/1683 , G01N21/31 , Y10T436/12
摘要： An automatic analysis and control system for electroless composite plating solution for automatically analyzing an electroless composite plating solution and performing such a control as to obtain an appropriate bath composition and/or use conditions, wherein, as a technique for measuring the concentration of a metallic component in the plating solution by absorptiometry, the system includes a mechanism for measuring transmissivity or absorbance at least two or more different wavelengths after the plating solution is automatically introduced into an analytical cell, and a mechanism for calculating the objective concentration from the measured values and displaying the calculation results.
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公开(公告)号：US5298559A
公开(公告)日：1994-03-29
申请号：US985214
申请日：1992-12-03
申请人： Tatsuo Fujii , Shinji Tachibana , Junji Oshima , Goro Shimaoka , Kazuhiko Ishii , Makoto Mizutani
发明人： Tatsuo Fujii , Shinji Tachibana , Junji Oshima , Goro Shimaoka , Kazuhiko Ishii , Makoto Mizutani
IPC分类号： C08F285/00 , C08L67/02 , C08L69/00 , C08L51/04
CPC分类号： C08F285/00 , C08L67/02 , C08L69/00 , Y10S525/902
摘要： A multi-layered polymer having (a) a core layer of an aromatic vinyl polymer, (b) an intermediate layer of a butadienic rubbery polymer and (c) an outer layer of an aromatic vinyl glassy polymer, the amount of the components (a), (b) and (c) being 12 to 42 weight %, 48 to 78 weight % and 10 to 40 weight %, respectively, provides a thermoplastic resin composition excellent not only in impact strength, especially in impact strength at low temperatures, but also in, in the case of containing a coloring agent, color-stability including less mottlings, and giving a molded article improved in preventing occurrence of delamination around the gate region.
摘要翻译： 一种多层聚合物，其具有（a）芳族乙烯基聚合物的芯层，（b）丁二烯橡胶状聚合物的中间层和（c）芳族乙烯基玻璃状聚合物的外层，组分（a ），（b）和（c）分别为12〜42重量％，48〜78重量％和10〜40重量％，提供了不仅冲击强度特别是低温冲击强度优异的热塑性树脂组合物， 而且在含有着色剂的情况下，包括较少斑驳的颜色稳定性，并且提供了改善防止在栅极区域周围发生分层的成型制品。
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6.发明授权Automatic analysis and control system for electroless composite plating solution 有权化学复合电镀液自动分析与控制系统公开(公告)号：US07507587B2
公开(公告)日：2009-03-24
申请号：US11287285
申请日：2005-11-28
申请人： Tadashi Chiba , Koji Monden , Kazuki Yoshikawa , Shinji Tachibana
发明人： Tadashi Chiba , Koji Monden , Kazuki Yoshikawa , Shinji Tachibana
CPC分类号： C23C18/1683 , G01N21/31 , Y10T436/12
摘要： An automatic analysis and control system for electroless composite plating solution for automatically analyzing an electroless composite plating solution and performing such a control as to obtain an appropriate bath composition and/or use conditions, wherein, as a technique for measuring the concentration of a metallic component in the plating solution by absorptiometry, the system includes a mechanism for measuring transmissivity or absorbance at least two or more different wavelengths after the plating solution is automatically introduced into an analytical cell, and a mechanism for calculating the objective concentration from the measured values and displaying the calculation results.
摘要翻译： 一种用于自动分析无电解复合电镀溶液并进行控制以获得适当的浴组合物和/或使用条件的无电解复合电镀溶液的自动分析和控制系统，其中，作为用于测量金属组分浓度的技术 在通过吸光光度法测定的电镀溶液中，该系统包括用于在将电镀溶液自动引入分析单元之后测量至少两个或更多个不同波长的透射率或吸光度的机构，以及用于根据测量值计算目标浓度并显示 计算结果。
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7.发明授权公开(公告)号：US09028668B2
公开(公告)日：2015-05-12
申请号：US12840564
申请日：2010-07-21
申请人： Toshihisa Isono , Naoyuki Omura , Koji Shimizu , Shinji Tachibana
发明人： Toshihisa Isono , Naoyuki Omura , Koji Shimizu , Shinji Tachibana
摘要： For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ε-caprolactam, is contained in the bath as a leveler.
摘要翻译： 为了用于通孔和盲通孔共存的电路板，其中通孔的覆盖功率和盲孔的堵塞性能足够的电解铜电镀浴和电镀方法， 使用电解铜电镀浴。 电解镀铜浴主要由水溶性铜盐，硫酸和氯离子组成。 通过加热二乙烯三胺，己二酸和ε-己内酰胺的缩聚产物的表氯醇改性产物加工得到的聚酰胺多胺作为整平剂包含在浴中。
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公开(公告)号：US20140120245A1
公开(公告)日：2014-05-01
申请号：US14122981
申请日：2012-05-22
IPC分类号： H05K3/42
CPC分类号： H05K3/422 , B05D1/02 , B05D5/12 , C23C4/12 , C23C18/161 , C23C18/1628 , C23C18/1669 , C23C18/1675 , C23C18/1683 , C23C18/38 , C25D3/38 , C25D5/026 , C25D17/00 , C25D21/10 , C25D21/12 , H05K3/107 , H05K3/1258 , H05K3/423 , H05K2201/09563 , H05K2203/075 , H05K2203/081 , H05K2203/1518 , H05K2203/1554 , H05K2203/1563
摘要： The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.
摘要翻译： 本发明消除了在通过改变喷镀电镀液的角度或者通过改变印刷电路板的姿势的金属来填充印刷电路板的通孔所产生的缺陷。 溶液，并将沉淀的金属填充到通孔中，同时将电镀溶液或气泡喷涂到印刷板上。
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公开(公告)号：US20110089044A1
公开(公告)日：2011-04-21
申请号：US12903555
申请日：2010-10-13
IPC分类号： C25D3/38
摘要： Disclosed herein is a copper electrolytic plating bath including copper sulfate used in an amount of 50 to 250 g/liter calculated as copper sulfate pentahydrate, 20 to 200 g/liter of sulfuric acid, and 20 to 150 mg/liter of a chloride ion, and a sulfur atom-containing organic compound and a nitrogen atom-containing organic compound serving as organic additives. The nitrogen atom-containing organic compound includes a nitrogen atom-containing polymer compound obtained by a two-stage reaction including reacting one mole of morpholine with two moles of epichlorohydrin in an acidic aqueous solution to obtain a reaction product and further reacting one to two moles, relative to one mole of the morpholine, of imidazole with the reaction product.
摘要翻译： 本发明公开了一种铜电解电镀浴，包括硫酸铜的使用量为50-250g / l，硫酸铜五水合物，20-200g / l硫酸和20-150mg /升氯离子， 和含硫原子的有机化合物和作为有机添加剂的含氮原子的有机化合物。 含氮原子的有机化合物包括通过两步反应获得的含氮原子的聚合物化合物，包括在酸性水溶液中使1摩尔吗啉与2摩尔表氯醇反应，得到反应产物，并进一步使1至2摩尔 相对于1摩尔的吗啉，与反应产物相比。
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公开(公告)号：US20110056840A1
公开(公告)日：2011-03-10
申请号：US12876723
申请日：2010-09-07
申请人： Toshihisa Isono , Shinji Tachibana , Naoyuki Omura , Shunsaku Hoshi , Kanako Matsuda , Koji Shimizu
发明人： Toshihisa Isono , Shinji Tachibana , Naoyuki Omura , Shunsaku Hoshi , Kanako Matsuda , Koji Shimizu
摘要： An electrolytic plating equipment includes: a plating tank for holding plating solution; and a separate tank apart from the plating tank, for holding the plating solution circulating between the plating tank and the separate tank. The separate tank contains a first space and a second space located downstream from the first space. The plating solution in the first space in an amount exceeding a specific height flows from the first space into the second space, and the plating solution falls through air in the second space.
摘要翻译： 电解电镀设备包括：用于保持电镀液的电镀槽; 以及与电镀槽分开的用于保持镀液在电镀槽和分离槽之间循环的单独的罐。 分离的容器包含位于第一空间下游的第一空间和第二空间。 第一空间中的镀液以超过特定高度的量从第一空间流入第二空间，电镀液在第二空间中流经空气。
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