公开(公告)号：US20140183730A1

公开(公告)日：2014-07-03

申请号：US14199078

申请日：2014-03-06

申请人： Nae HISANO ,  Shigeo OHASHI ,  Yasuo OSONE ,  Yasuhiro NAKA ,  Hiroyuki TENMEI ,  Kunihiko NISHI ,  Hiroaki IKEDA ,  Masakazu ISHINO ,  Hideharu MIYAKE ,  Shiro UCHIYAMA

发明人： Nae HISANO ,  Shigeo OHASHI ,  Yasuo OSONE ,  Yasuhiro NAKA ,  Hiroyuki TENMEI ,  Kunihiko NISHI ,  Hiroaki IKEDA ,  Masakazu ISHINO ,  Hideharu MIYAKE ,  Shiro UCHIYAMA

IPC分类号： H01L23/00 ,  H01L23/34

CPC分类号： H01L24/14 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/473 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06565 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

摘要： A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.

摘要翻译： 半导体器件包括安装基板，设置在所述安装基板上方的半导体元件，设置在所述安装基板上方的封装基板，其间具有所述半导体元件，并通过主连接凸块与所述半导体元件电连接;冷却所述半导体 液体制冷剂的热接收部分设置在所述半导体元件和所述安装基板之间，以及设置在所述封装基板和所述安装基板之间的多个次级连接凸块。

公开(公告)号：US20100171213A1

公开(公告)日：2010-07-08

申请号：US12683085

申请日：2010-01-06

申请人： Nae HISANO ,  Shigeo OHASHI ,  Yasuo OSONE ,  Yasuhiro NAKA ,  Hiroyuki TENMEI ,  Kunihiko NISHI ,  Hiroaki IKEDA ,  Masakazu ISHINO ,  Hideharu MIYAKE ,  Shiro UCHIYAMA

发明人： Nae HISANO ,  Shigeo OHASHI ,  Yasuo OSONE ,  Yasuhiro NAKA ,  Hiroyuki TENMEI ,  Kunihiko NISHI ,  Hiroaki IKEDA ,  Masakazu ISHINO ,  Hideharu MIYAKE ,  Shiro UCHIYAMA

IPC分类号： H01L23/473 ,  H01L23/488 ,  F28F7/00

CPC分类号： H01L24/14 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/473 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06565 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

摘要： A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.

摘要翻译： 半导体器件包括安装基板，设置在所述安装基板上方的半导体元件，设置在所述安装基板上方的封装基板，其间具有所述半导体元件，并通过主连接凸块与所述半导体元件电连接;冷却所述半导体 液体制冷剂的热接收部分设置在所述半导体元件和所述安装基板之间，以及设置在所述封装基板和所述安装基板之间的多个次级连接凸块。

公开(公告)号：US20090072414A1

公开(公告)日：2009-03-19

申请号：US12187622

申请日：2008-08-07

申请人： Hiroyuki TENMEI ,  Kunihiko NISHI ,  Yasuhiro NAKA ,  Nae HISANO ,  Hiroaki IKEDA ,  Masakazu ISHINO

发明人： Hiroyuki TENMEI ,  Kunihiko NISHI ,  Yasuhiro NAKA ,  Nae HISANO ,  Hiroaki IKEDA ,  Masakazu ISHINO

IPC分类号： H01L23/52 ,  H01L21/30

CPC分类号： H01L24/73 ,  H01L21/76898 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/50 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/11912 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/75753 ,  H01L2224/8113 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83907 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/27

摘要： A bonding method (three-dimensional mounting) of semiconductor substrates is provided to sequentially bond a principal surface of a silicon wafer on which coupling bumps are formed, and a principal surface of the other silicon wafer on which pads are formed, by an adhesive applied to at least one of the principal surfaces. However, there is a problem of poor electrical coupling due to displacement of the bumps and the pads when bonded together. The present invention solves such a problem by conducting temporary positioning of the silicon wafers, adjusting the positions of the coupling bumps and pads while confirming the positions by a method such as x-ray capable of passing through the silicon wafers, and bonding the bumps and the pads together while hardening an interlayer adhesive provided between the principal surfaces of the silicon wafers by thermocompression.

摘要翻译： 提供半导体衬底的接合方法（三维安装），以通过施加的粘合剂顺序地接合形成有耦合凸块的硅晶片的主表面和形成有焊盘的另一个硅晶片的主表面 到至少一个主表面。 然而，由于当焊接在一起时由于凸起和焊盘的位移而存在差的电耦合的问题。 本发明通过进行硅晶片的临时定位来解决这样的问题，通过诸如能够通过硅晶片的x射线的方法确认位置来确定位置，并且将凸块和 一边通过热压而使设置在硅晶片的主表面之间的层间粘合剂硬化。