公开(公告)号：US20100171213A1

公开(公告)日：2010-07-08

申请号：US12683085

申请日：2010-01-06

申请人： Nae HISANO ,  Shigeo OHASHI ,  Yasuo OSONE ,  Yasuhiro NAKA ,  Hiroyuki TENMEI ,  Kunihiko NISHI ,  Hiroaki IKEDA ,  Masakazu ISHINO ,  Hideharu MIYAKE ,  Shiro UCHIYAMA

发明人： Nae HISANO ,  Shigeo OHASHI ,  Yasuo OSONE ,  Yasuhiro NAKA ,  Hiroyuki TENMEI ,  Kunihiko NISHI ,  Hiroaki IKEDA ,  Masakazu ISHINO ,  Hideharu MIYAKE ,  Shiro UCHIYAMA

IPC分类号： H01L23/473 ,  H01L23/488 ,  F28F7/00

CPC分类号： H01L24/14 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/473 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06565 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

摘要： A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.

摘要翻译： 半导体器件包括安装基板，设置在所述安装基板上方的半导体元件，设置在所述安装基板上方的封装基板，其间具有所述半导体元件，并通过主连接凸块与所述半导体元件电连接;冷却所述半导体 液体制冷剂的热接收部分设置在所述半导体元件和所述安装基板之间，以及设置在所述封装基板和所述安装基板之间的多个次级连接凸块。

公开(公告)号：US20090072414A1

公开(公告)日：2009-03-19

申请号：US12187622

申请日：2008-08-07

申请人： Hiroyuki TENMEI ,  Kunihiko NISHI ,  Yasuhiro NAKA ,  Nae HISANO ,  Hiroaki IKEDA ,  Masakazu ISHINO

发明人： Hiroyuki TENMEI ,  Kunihiko NISHI ,  Yasuhiro NAKA ,  Nae HISANO ,  Hiroaki IKEDA ,  Masakazu ISHINO

IPC分类号： H01L23/52 ,  H01L21/30

CPC分类号： H01L24/73 ,  H01L21/76898 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/50 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/11912 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/75753 ,  H01L2224/8113 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83907 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/27

摘要： A bonding method (three-dimensional mounting) of semiconductor substrates is provided to sequentially bond a principal surface of a silicon wafer on which coupling bumps are formed, and a principal surface of the other silicon wafer on which pads are formed, by an adhesive applied to at least one of the principal surfaces. However, there is a problem of poor electrical coupling due to displacement of the bumps and the pads when bonded together. The present invention solves such a problem by conducting temporary positioning of the silicon wafers, adjusting the positions of the coupling bumps and pads while confirming the positions by a method such as x-ray capable of passing through the silicon wafers, and bonding the bumps and the pads together while hardening an interlayer adhesive provided between the principal surfaces of the silicon wafers by thermocompression.

摘要翻译： 提供半导体衬底的接合方法（三维安装），以通过施加的粘合剂顺序地接合形成有耦合凸块的硅晶片的主表面和形成有焊盘的另一个硅晶片的主表面 到至少一个主表面。 然而，由于当焊接在一起时由于凸起和焊盘的位移而存在差的电耦合的问题。 本发明通过进行硅晶片的临时定位来解决这样的问题，通过诸如能够通过硅晶片的x射线的方法确认位置来确定位置，并且将凸块和 一边通过热压而使设置在硅晶片的主表面之间的层间粘合剂硬化。

公开(公告)号：US20140183730A1

公开(公告)日：2014-07-03

申请号：US14199078

申请日：2014-03-06

申请人： Nae HISANO ,  Shigeo OHASHI ,  Yasuo OSONE ,  Yasuhiro NAKA ,  Hiroyuki TENMEI ,  Kunihiko NISHI ,  Hiroaki IKEDA ,  Masakazu ISHINO ,  Hideharu MIYAKE ,  Shiro UCHIYAMA

发明人： Nae HISANO ,  Shigeo OHASHI ,  Yasuo OSONE ,  Yasuhiro NAKA ,  Hiroyuki TENMEI ,  Kunihiko NISHI ,  Hiroaki IKEDA ,  Masakazu ISHINO ,  Hideharu MIYAKE ,  Shiro UCHIYAMA

IPC分类号： H01L23/00 ,  H01L23/34

CPC分类号： H01L24/14 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/473 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06565 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

摘要： A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.

摘要翻译： 半导体器件包括安装基板，设置在所述安装基板上方的半导体元件，设置在所述安装基板上方的封装基板，其间具有所述半导体元件，并通过主连接凸块与所述半导体元件电连接;冷却所述半导体 液体制冷剂的热接收部分设置在所述半导体元件和所述安装基板之间，以及设置在所述封装基板和所述安装基板之间的多个次级连接凸块。

公开(公告)号：US20080136024A1

公开(公告)日：2008-06-12

申请号：US11947393

申请日：2007-11-29

申请人： Yasuhiro NAKA ,  Hiroyuki Tenmei ,  Kunihiko NISHI ,  Hiroaki IKEDA ,  Masakazu ISHINO

发明人： Yasuhiro NAKA ,  Hiroyuki Tenmei ,  Kunihiko NISHI ,  Hiroaki IKEDA ,  Masakazu ISHINO

IPC分类号： H01L23/48

CPC分类号： H01L21/563 ,  H01L23/3171 ,  H01L23/481 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In a semiconductor device provided by preventing connection failure caused by misalignment of a semiconductor element having fine and narrow-pitched bumps, a guide for preventing the misalignment is formed by an insulating resin layer around a connection electrode. The insulating resin layer has a thickness defined in relation to an angle θ formed by a side wall of the opening and alignment accuracy δ for the bump. Specifically, the thickness of the insulating resin layer may be δ tan θ or more.

摘要翻译： 在通过防止由具有细小和窄凸起的半导体元件的未对准引起的连接故障而提供的半导体器件中，通过连接电极周围的绝缘树脂层形成用于防止未对准的引导件。 绝缘树脂层具有相对于由开口的侧壁形成的角度θ和用于凸起的对准精度δ而定义的厚度。 具体地说，绝缘树脂层的厚度可以是δtanθ以上。

公开(公告)号：US20090243769A1

公开(公告)日：2009-10-01

申请号：US12409658

申请日：2009-03-24

申请人： Kouetsu TAKAYA ,  Koji OHKUBO ,  Yasuhiro NAKA ,  Toshikatsu OHGAMI ,  Kenji SUZUKI

发明人： Kouetsu TAKAYA ,  Koji OHKUBO ,  Yasuhiro NAKA ,  Toshikatsu OHGAMI ,  Kenji SUZUKI

IPC分类号： H01H50/00 ,  H01H49/00

CPC分类号： H01H50/045 ,  H01H11/06 ,  H01H49/00 ,  H01H50/042 ,  H01H50/546 ,  H01H50/58 ,  H01H2229/066 ,  Y10T29/49826

摘要： A movable contact holder includes a movable contact holder base and a movable contact holder cover. One side of the movable contact holder base is opened to have a plurality of recesses each being formed for holding a contact pair, each contact pair include a bridge contact assembly and a contact spring inserted therein while being isolated from the other pairs. The other side of the movable contact holder base is formed as a bottom wall, and preferably includes openings through which an assembly jig can be inserted from outside the moveable contact holder. Alternatively, jig openings can be formed in lateral side walls of the recesses to allow the assembly jig to be inserted. The movable contact holder cover covers the movable contact holder base and is coupled thereto.

摘要翻译： 可动触点支架包括可动触点保持器基座和可动触点支架盖。 可动触头保持器基座的一侧开放，以形成多个凹部，每个凹部被形成用于保持触点对，每个触头对包括桥接触组件和插入其中的接触弹簧，同时与另一对隔离。 可移动触点保持器底座的另一侧形成为底壁，并且优选地包括开口，组装夹具可以通过该开口从可移动触点支架的外部插入。 或者，夹具开口可以形成在凹部的侧壁中，以允许装配夹具被插入。 可动触点保持器盖覆盖可动触点支架基座并与其连接。

公开(公告)号：US20090100874A1

公开(公告)日：2009-04-23

申请号：US12336573

申请日：2008-12-17

申请人： Toshiaki TATEISHI ,  Yasuhiro NAKA ,  Tetsuya KUMADA

发明人： Toshiaki TATEISHI ,  Yasuhiro NAKA ,  Tetsuya KUMADA

IPC分类号： C03B29/04

CPC分类号： C03B23/037 ,  C03B23/047

摘要： A glass strip manufacturing method includes heat-drawing a preform glass plate by softening the preform glass plate with heat and drawing the preform glass plate down to a desired thickness. The preform glass plate has a level of transmittance that allows radiant heat absorbed therein while passing therethrough to diffuse before locally accumulating therein. The minimum transmittance of the preform glass plate in a thickness of 3 millimeters at a wavelength of 800 to 2200 nanometers is 86 to 95%.

摘要翻译： 玻璃带制造方法包括通过用热量软化预制玻璃板来将预成型玻璃板拉制成预期的玻璃板，并将预制玻璃板拉伸至所需厚度。 预成型玻璃板具有允许其中吸收的辐射热，同时通过其中的透射率，以在局部积聚之前扩散。 在800至2200纳米的波长处，厚度为3毫米的预制玻璃板的最小透射率为86至95％。

公开(公告)号：US20130106543A1

公开(公告)日：2013-05-02

申请号：US13664580

申请日：2012-10-31

申请人： Masaru ISOZAKI ,  Osamu KASHIMURA ,  Hiroyuki TACHIKAWA ,  Kouetsu TAKAYA ,  Yasuhiro NAKA ,  Yuji SHIBA

发明人： Masaru ISOZAKI ,  Osamu KASHIMURA ,  Hiroyuki TACHIKAWA ,  Kouetsu TAKAYA ,  Yasuhiro NAKA ,  Yuji SHIBA

IPC分类号： H01H9/44

CPC分类号： H01H9/443 ,  H01H50/14 ,  H01H50/22 ,  H01H50/546 ,  H01H51/065 ,  H01H51/2209 ,  H01H2050/025

摘要： An electromagnetic contactor has a contact device including a contact housing for housing a pair of fixed contact pieces and a movable contact piece disposed to contact with and separate away from the pair of fixed contact pieces, a pair of arc-extinguishing inner permanent magnets disposed on inner peripheral surfaces of the contact housing, and a pair of arc-extinguishing outer permanent magnets disposed on outer peripheral surfaces of the contact housing at a section facing the arc-extinguishing inner permanent magnets. Magnetic pole surfaces of the arc-extinguishing inner permanent magnets are arranged in a close vicinity of the movable contact piece and are magnetized to have the same polarity facing each other. The arc-extinguishing outer permanent magnets are magnetized in the same direction as the arc-extinguishing inner permanent magnets disposed nearby and coercive force of the arc-extinguishing outer permanent magnets is greater than of that the arc-extinguishing inner permanent magnets.

摘要翻译： 一种电磁接触器具有接触装置，该接触装置包括用于容纳一对固定接触片的接触壳体和与一对固定接触件接触和分离的可动接触片，一对灭弧内部永磁体， 所述接触壳体的内周面和一对灭弧外部永磁体，其在与所述灭弧内部永磁体相对的一侧设置在所述接触壳体的外周面上。 灭弧的内部永磁体的磁极表面布置在可动接触片的紧密附近，并被磁化以具有彼此面对的相同极性。 灭弧外部永久磁铁沿与设置在附近的灭弧内置永久磁铁相同的方向被磁化，灭弧外部永磁体的矫顽力大于灭弧内部永久磁铁的矫顽力。

公开(公告)号：US20120175345A1

公开(公告)日：2012-07-12

申请号：US13344223

申请日：2012-01-05

申请人： Hiroyuki TACHIKAWA ,  Masaru ISOZAKI ,  Osamu KASHIMURA ,  Kouetsu TAKAYA ,  Yasuhiro NAKA ,  Yuji SHIBA

发明人： Hiroyuki TACHIKAWA ,  Masaru ISOZAKI ,  Osamu KASHIMURA ,  Kouetsu TAKAYA ,  Yasuhiro NAKA ,  Yuji SHIBA

IPC分类号： H01H33/18

CPC分类号： H01H9/443 ,  H01H50/546

摘要： An electromagnetic contactor includes a first stationary contact having a stationary contact portion and a stationary terminal portion for connecting to a power supply; a second stationary contact having a stationary contact portion and a stationary terminal section for connecting to a load; a stationary-contact supporting case supporting the stationary terminal portions of the first and second stationary contacts to protrude the contact support casing, and maintaining a predetermined distance in between; a moving-contact portion contactable to and separable from the stationary contact portion of the first and second stationary contact and arranged in the stationary-contact supporting case; and a pair of arc-extinguishing magnets arranged in parallel to sandwich the moving-contact portion in the longitudinal direction and having same magnetic polarity at opposing magnetic pole surfaces. A driving mechanism drives the moving-contact portion contactable to and separable from the stationary contact portions of the first and second stationary contacts.

摘要翻译： 电磁接触器包括具有固定接触部分和用于连接到电源的固定端子部分的第一固定触头; 具有固定接触部分和用于连接到负载的固定端子部分的第二固定触头; 固定接触支撑壳体，其支撑所述第一固定触头和所述第二固定触头的固定端子部分以使所述触点支撑壳体突出，并且在其间保持预定的距离; 可移动接触部分，其可接触并分离于第一和第二固定接触件的固定接触部分并且布置在固定接触支撑壳体中; 以及一对平行排列的灭弧磁体，以在纵向方向上夹持活动接触部分，并且在相对的磁极表面具有相同的磁极性。 驱动机构驱动与第一和第二静止触点的固定接触部分可接触并可分离的移动接触部分。

公开(公告)号：US20100308442A1

公开(公告)日：2010-12-09

申请号：US12795950

申请日：2010-06-08

申请人： Yasuhiro NAKA ,  Naotaka TANAKA ,  Toshihide UEMATSU ,  Chuichi MIYAZAKI ,  Kazunari SUZUKI ,  Yasuyuki NAKAJIMA ,  Yoshiyuki ABE ,  Kenji KOHZU ,  Kosuke KITAICHI ,  Shinya OGANE

发明人： Yasuhiro NAKA ,  Naotaka TANAKA ,  Toshihide UEMATSU ,  Chuichi MIYAZAKI ,  Kazunari SUZUKI ,  Yasuyuki NAKAJIMA ,  Yoshiyuki ABE ,  Kenji KOHZU ,  Kosuke KITAICHI ,  Shinya OGANE

IPC分类号： H01L23/498 ,  H01L23/544 ,  H01L21/60

CPC分类号： H01L24/11 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/06102 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01064 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/1306 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00014

摘要： In a state where an adhesive tape is attached onto a main surface of a semiconductor wafer, a trench is formed in a rear surface of the semiconductor wafer. For forming the trench in the rear surface of the semiconductor wafer, after coating a resist film on the rear surface of the semiconductor wafer, the resist film is patterned by using the photolithography technology. The patterning of the resist film is performed so as not to leave the resist film in the region where the trench is to be formed. Then, the trench is formed in a predetermined region of the semiconductor wafer by the dry etching technology using the patterned resist film as a mask. Specifically, the trench is formed in the region near the dicing line.

摘要翻译： 在粘合带附着到半导体晶片的主表面上的状态下，在半导体晶片的后表面上形成沟槽。 为了在半导体晶片的后表面中形成沟槽，在半导体晶片的后表面上涂覆抗蚀剂膜之后，通过使用光刻技术对抗蚀剂膜进行构图。 进行抗蚀剂膜的图案化，以便不在要形成沟槽的区域中留下抗蚀剂膜。 然后，通过使用图案化的抗蚀剂膜作为掩模的干蚀刻技术，在半导体晶片的预定区域中形成沟槽。 具体地说，在切割线附近的区域形成沟槽。

公开(公告)号：US20090174061A1

公开(公告)日：2009-07-09

申请号：US12401491

申请日：2009-03-10

申请人： Yasuhiro NAKA ,  Tomio Iwasaki ,  Hidekazu Okuda ,  Yuji Fujii

发明人： Yasuhiro NAKA ,  Tomio Iwasaki ,  Hidekazu Okuda ,  Yuji Fujii

IPC分类号： H01L23/48 ,  H01L23/485

CPC分类号： H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/11 ,  H01L2224/1147 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： To prevent peeling-off of a film in a solder connection pad of a semiconductor device, which peeling-off may occur due to thermal load and so on in the manufacture process, a pad structure is adopted in which a Cr film good in adhesiveness to either of a Ti film or Ti compound film and a Ni film (or a Cu film) is interposed between the Ti film or Ti compound film formed on a silicon or silicon oxide film, and the Ni film (or the Cu film) to be connected to solder. Further, to prevent peeling-off at the interface between the Ti film or Ti compound film and the silicon oxide film, the Cr film is formed in a larger area than the Ti film or Ti compound film.

摘要翻译： 为了防止在制造过程中由于热负荷等而在半导体器件的焊料接合焊盘中的膜剥离，由此导致剥离，可以采用衬垫结构，其中Cr膜具有良好的粘合性 在形成于硅或氧化硅膜上的Ti膜或Ti化合物膜之间插入Ti膜或Ti化合物膜和Ni膜（或Cu膜），Ni膜（或Cu膜）为 连接到焊料。 此外，为了防止在Ti膜或Ti化合物膜与氧化硅膜之间的界面处的剥离，Cr膜形成在比Ti膜或Ti化合物膜更大的面积上。