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    Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method
    3.
    发明授权
    Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method 有权
    球捕获装置，焊球配置装置，球捕获方法和焊球配置方法

    公开(公告)号：US07717317B2

    公开(公告)日：2010-05-18

    申请号：US11864600

    申请日：2007-09-28

    申请人： Masanao Fujii ,  Toru Okada ,  Yutaka Noda ,  Ryoji Matsuyama ,  Hidehiko Kobayashi ,  Hisao Tanaka

    发明人： Masanao Fujii ,  Toru Okada ,  Yutaka Noda ,  Ryoji Matsuyama ,  Hidehiko Kobayashi ,  Hisao Tanaka

    IPC分类号： B23K31/02 ,  B23K37/00

    CPC分类号： H01L21/4853 ,  B23K3/0623 ,  H01L2224/11334 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/081 ,  H05K2203/082

    摘要： The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding member 111 including a holding wall 111a air-tightly closing a space S that holds a plurality of balls B having the same size and in which a hole 1111 larger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup means 112 for blowing the balls B held in the holding member 111 upward; and capturing means 12 for capturing a ball B blown up by the blowup means 112 and reached the hole.

    摘要翻译： 本发明涉及一种从具有相同尺寸的多个球捕获一个球的球捕获装置和方法，以及一种焊球设置装置和将含有焊料的焊球放置在电路板上的预定位置的方法，从而可靠地 从具有相同尺寸的多个球捕获一个球。 该装置包括：保持构件111，其包括保持壁111a，气密地封闭保持具有相同尺寸的多个球B的空间S，并且其中具有比一个球的尺寸大的孔1111，并且小于 在保持壁的上部形成有两个球; 用于将保持在保持构件111中的球B向上吹的吹出装置112; 以及捕获装置12，用于捕获由喷射装置112吹起的球B并到达该孔。

    Method of assembling micro-actuator
    4.
    发明授权
    Method of assembling micro-actuator 失效
    组合微致动器的方法

    公开(公告)号：US06467141B2

    公开(公告)日：2002-10-22

    申请号：US09820553

    申请日：2001-03-29

    申请人： Toru Okada ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Yutaka Noda ,  Masayuki Kitajima ,  Seiichi Shimoura ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka ,  Masanao Fujii

    发明人： Toru Okada ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Yutaka Noda ,  Masayuki Kitajima ,  Seiichi Shimoura ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka ,  Masanao Fujii

    IPC分类号： H04R1710

    CPC分类号： G11B5/5552 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49025 ,  Y10T29/49055

    摘要： A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.

    摘要翻译： 提供了一种组装微致动器的方法，其中具有多个致动器基座的基架被放置在台架上，第一粘合剂被施加到每个致动器基座，以及具有多个基极的基极框架 被放置在第一粘合剂上。 第一粘合剂通过加热和压制半固化。 将第二粘合剂施加到每个基底电极上，并且将多个压电元件放置在第二粘合剂上。 第二粘合剂通过加热和压制半固化。 将第三粘合剂施加到压电元件，并且具有多个可移动电极的可动电极框架放置在第三粘合剂上。 第三粘合剂通过加热和压制半固化。 接下来，将第四粘合剂施加到每个可移动电极，并且具有多个铰链板的铰链板框架放置在第四粘合剂上。 第四粘合剂通过加热和加压半固化。 最后，将如此获得的粘合层压材料放置在加热炉中，并在预定温度下加热预定的时间，从而使各种粘合剂完全固化。

    OPTICAL MODULE
    6.
    发明申请
    OPTICAL MODULE 有权
    光学模块

    公开(公告)号：US20080101746A1

    公开(公告)日：2008-05-01

    申请号：US11553743

    申请日：2006-10-27

    申请人： Toru Okada ,  Masanao Fujii ,  Yutaka Noda

    发明人： Toru Okada ,  Masanao Fujii ,  Yutaka Noda

    IPC分类号： G02B6/12

    CPC分类号： G03B17/00 ,  H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10121 ,  H05K2201/10727 ,  H05K2203/0182 ,  Y02P70/613

    摘要： An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.

    摘要翻译： 光学模块具有具有设置有端子焊盘和着陆焊盘的基板表面的基板，以及具有端子的光学元件封装，并且安装在基板表面上，其间形成有间隙。 当光学元件封装安装在基板表面上时，光学元件封装和基板表面之间的间隙由着陆焊盘确定。 端子焊盘和着陆焊盘在光学元件封装安装在基板表面上的状态下露出，并且端子焊盘通过焊料电连接到相应的端子。

    Optical module producing method and apparatus
    7.
    发明授权
    Optical module producing method and apparatus 有权
    光模块的制造方法和装置

    公开(公告)号：US07691662B2

    公开(公告)日：2010-04-06

    申请号：US11703699

    申请日：2007-02-08

    申请人： Toru Okada ,  Masanao Fujii ,  Yutaka Noda

    发明人： Toru Okada ,  Masanao Fujii ,  Yutaka Noda

    IPC分类号： H01L21/00

    CPC分类号： H05K3/303 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/148 ,  H01L31/0203 ,  H05K3/3494 ,  H05K2201/09781 ,  H05K2201/10121 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/082 ,  H05K2203/111 ,  Y02P70/613

    摘要： An optical module is produced by coating, with respect to a substrate having a substrate surface provided with terminal pads and landing pads a solder material on the terminal pads, mounting an optical element package having terminals and a flat top surface on the substrate using the landing pads so that the top surface becomes approximately parallel to the substrate surface and a gap is formed between a bottom surface of the optical element package and the substrate surface, preheating the terminal pads simultaneously as the mounting, and electrically connecting the terminal pads to corresponding terminals of the optical element package by melting the solder material and thereafter hardening the solder material.

    摘要翻译： 通过涂覆相对于具有设置有端子焊盘和着陆焊盘的衬底的衬底的衬底，通过涂覆在端子焊盘上的焊料材料，使用着陆层将具有端子的光学元件封装和平坦顶表面安装在衬底上来制造光学模块 衬垫，使得顶表面变得大致平行于衬底表面，并且在光学元件封装的底表面和衬底表面之间形成间隙，同时预热端子焊盘作为安装，并且将端子焊盘电连接到相应的端子 通过熔化焊料材料，然后硬化焊料材料。

    Optical module producing method and apparatus
    8.
    发明申请
    Optical module producing method and apparatus 有权
    光模块的制造方法和装置

    公开(公告)号：US20080102544A1

    公开(公告)日：2008-05-01

    申请号：US11703699

    申请日：2007-02-08

    申请人： Toru Okada ,  Masanao Fujii ,  Yutaka Noda

    发明人： Toru Okada ,  Masanao Fujii ,  Yutaka Noda

    IPC分类号： H01L21/00

    CPC分类号： H05K3/303 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/148 ,  H01L31/0203 ,  H05K3/3494 ,  H05K2201/09781 ,  H05K2201/10121 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/082 ,  H05K2203/111 ,  Y02P70/613

    摘要： An optical module is produced by coating, with respect to a substrate having a substrate surface provided with terminal pads and landing pads a solder material on the terminal pads, mounting an optical element package having terminals and a flat top surface on the substrate using the landing pads so that the top surface becomes approximately parallel to the substrate surface and a gap is formed between a bottom surface of the optical element package and the substrate surface, preheating the terminal pads simultaneously as the mounting, and electrically connecting the terminal pads to corresponding terminals of the optical element package by melting the solder material and thereafter hardening the solder material.

    摘要翻译： 通过涂覆相对于具有设置有端子焊盘和着陆焊盘的衬底的衬底的衬底，通过涂覆在端子焊盘上的焊料材料，使用着陆层将具有端子的光学元件封装和平坦顶表面安装在衬底上来制造光学模块 衬垫，使得顶表面变得大致平行于衬底表面，并且在光学元件封装的底表面和衬底表面之间形成间隙，同时预热端子焊盘作为安装，并将端子焊盘电连接到相应的端子 通过熔化焊料材料，然后硬化焊料材料。

    Optical module
    9.
    发明授权
    Optical module 有权
    光模块

    公开(公告)号：US07824111B2

    公开(公告)日：2010-11-02

    申请号：US11553743

    申请日：2006-10-27

    申请人： Toru Okada ,  Masanao Fujii ,  Yutaka Noda

    发明人： Toru Okada ,  Masanao Fujii ,  Yutaka Noda

    IPC分类号： G02B6/42 ,  H04B10/14 ,  H01S5/022

    CPC分类号： G03B17/00 ,  H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10121 ,  H05K2201/10727 ,  H05K2203/0182 ,  Y02P70/613

    摘要： An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.

    摘要翻译： 光学模块具有具有设置有端子焊盘和着陆焊盘的基板表面的基板，以及具有端子的光学元件封装，并且安装在基板表面上，其间形成有间隙。 当光学元件封装安装在基板表面上时，光学元件封装和基板表面之间的间隙由着陆焊盘确定。 端子焊盘和着陆焊盘在光学元件封装安装在基板表面上的状态下露出，并且端子焊盘通过焊料电连接到相应的端子。

    PROCESSING APPARATUS
    10.
    发明申请
    PROCESSING APPARATUS 审中-公开
    加工设备

    公开(公告)号：US20080296266A1

    公开(公告)日：2008-12-04

    申请号：US12125602

    申请日：2008-05-22

    申请人： Toru Okada ,  Yutaka Noda ,  Seiichi Shimoura

    发明人： Toru Okada ,  Yutaka Noda ,  Seiichi Shimoura

    IPC分类号： B23K3/04 ,  B23K1/00

    CPC分类号： B23K3/027

    摘要： A processing head is supported for pivotal movement around a pivot point in a processing apparatus. An urging member applies an urging force to the processing head at the pivot point. The processing apparatus allows establishment of point contact between the urging member and the processing head. When the surface of an object inclines from a predetermined attitude, the processing head is allowed to follow the inclination of the surface. The processing head is allowed to establish a predetermined attitude relative to the surface of the object. The processing head thus reliably enables a predetermined action to the object as desired.

    摘要翻译： 处理头被支撑以围绕处理装置中的枢转点枢转运动。 推动构件在枢转点处向加工头施加推动力。 处理装置允许在推动构件和处理头之间建立点接触。 当物体的表面从预定姿态倾斜时，允许处理头跟随表面的倾斜。 允许处理头相对于物体的表面建立预定的姿态。 因此，处理头能够根据需要可靠地实现对物体的预定动作。