摘要:
An internal clock signal generating circuit includes a selector, a delay line, a 2-frequency divider, a phase comparator and a shift register. The selector alternately selects an external clock signal and an internal clock signal output from the delay line and outputs the selected signal to the delay line. The delay line receiving the signal delays the external clock signal, and delays the internal clock signal output from itself. The 2-frequency divider divides frequency of the internal clock signal by 2. Phase comparator compares phases of the external clock signal and the output signal from the 2-frequency divider. Delay time of the delay line is adjusted by the phase comparator and the shift register so that the phase difference is made 0.
摘要:
In an internal clock signal generation circuit, a phase comparator for detecting phase difference between an external clock signal and an internal clock signal includes a transistor and a capacitor with respect to a signal line through which a clock signal corresponding to the external clock signal is transmitted, and a transistor and a capacitor with respect to a signal line through which a clock signal corresponding to the internal clock signal is transmitted. The rising timing of the signal having a more lagging phase of the signals of the two signal lines becomes more gentle. As a result, the phase difference is increased, and the phase comparator can compare the phase at high precision.
摘要:
An input buffer of a semiconductor device is provided. A first voltage shift circuit converts an input signal formed of a low amplitude logic signal overlapping 1.65V or 2.9V to a first signal formed of a complimentary signal formed of the low amplitude logic signal overlapping 2.9V or 1.65V. A second voltage shift circuit converts a reference potential of 1.65V or 2.9V to a second signal of 2.9V or 1.65V. A differential amplifier compares the reference potential with the input signal when the reference potential is 1.65V, and compares the first signal and the second signal when the reference potential is 2.9V. The input buffer thus operates normally whichever of 1.65V and 2.9V is the reference potential.
摘要:
One strobe signal (QS) is outputted from a group of two adjacent memory chips (MC(i-1), MCi) in each module. In each group, the second memory chip (MCi) receives a data mask signal (DQM(i-1)) inputted to the adjacent first memory chip (MC(i-1)) as a data mask control signal (DQMCi), and stops outputting the strobe signal (QS) when both the data mask signal (DQMi) for the second memory chip (MCi) and the data mask control signal (DQMCi) are activated. Each memory chip (MCi) receives the data mask signal (DQMi) and stops outputting data. In a synchronous DRAM using a strobe signal as a trigger, this configuration allows reduction in the number of strobe signals.
摘要:
In a synchronous semiconductor memory device, memory arrays (MA) forming activation units each are divided into a plurality of small memory arrays (MK). There are provided local I/O line pairs (LIO) each for two small memory arrays. The global I/O line pairs (GIO) crossing word lines are arranged in word line shunt regions (WS). The connection switches (BS) are arranged in the crossing between the local I/O line pairs and global I/O line pairs. Each small memory array in the activated memory array is connected to the corresponding global I/O line pair through the local I/O line pair. Thereby, a plurality of bits can be simultaneously read without increasing an area occupied by interconnections. The control of connection switch is made using a sense amplifier activation signal. Global I/O lines are precharged/equalized after data are transferred to read data registers provided for data output terminal for sequential data output or into selected memory cells. External clock signal is frequency-divided to produce phase-shifted internal clock signals which are used for producing internal voltage through charge operation.
摘要:
In a synchronous semiconductor memory device, memory arrays (MA) forming activation units each are divided into a plurality of small memory arrays (MK). There are provided local I/O line pairs (LIO) each for two small memory arrays. The global I/O line pairs (GIO) crossing word lines are arranged in word line shunt regions (WS). The connection switches (BS) are arranged in the crossing between the local I/O line pairs and global I/O line pairs. Each small memory array in the activated memory array is connected to the corresponding global I/O line pair through the local I/O line pair. Thereby, a plurality of bits can be simultaneously read without increasing an area occupied by interconnections. The control of connection switch is made using a sense amplifier activation signal. Global I/O lines are precharged/equalized after data are transferred to read data registers provided for data output terminal for sequential data output or into selected memory cells. External clock signal is frequency-divided to produce phase-shifted internal clock signals which are used for producing internal voltage through charge operation.
摘要:
A semiconductor memory device receives an external control signal repeatedly generated independently of an access to the memory device. The memory device includes an internal voltage generator for generating a desired internal voltage in response to the control signal. The internal voltage generator includes a charge pump circuit responsive to the control signal. The internal voltage may provide a negative voltage such as a substrate bias voltage, or may be a positive voltage boosted over an operating power supply voltage and used as a boosted word line drive signal. This scheme eliminates an oscillator for generating a repeated clock signal to the charge pump circuit, leading to reduced current consumption and reduced chip area for the semiconductor memory device.
摘要:
A synchronous semiconductor memory device capable of improving substantial transfer rate is provided. In response to a write command immediately following an act command, a control signal generating circuit applies an inactive enable signal to a read preamplifier & write buffer. In response to a write command and a precharge command, the control signal generating circuit generates an active enable signal, and the read preamplifier & write buffer writes the data stored in an FIFO to a memory cell. As late write is not performed upon reception of a write command immediately following an act command, erroneous writing of data to a not intended address can be prevented.
摘要:
The phase comparator receives an output of a buffer receiving the first input signal and an output of a buffer receiving the second input signal, and outputs signals SLOW, FAST as a result of phase comparison. The phase comparator includes a waveform processing circuit for enlarging the phase difference between two input signals, and a comparison circuit for performing phase comparison based on the phase difference enlarged by the waveform processing circuit and outputting signals SLOW, FAST. Because of the function of the waveform processing circuit, the performance of the phase comparator can be improved significantly, without having to largely improve the performance of the comparison circuit.
摘要:
When an operating frequency is increased and a CAS latency is set longer, a data write end time is delayed by a specific time in response to the change of the CAS latency. The specific time is greater than a period corresponding to the CAS latency. The specific time may be the minimum time necessary for writing second-bit data. The write margin can also be enlarged by delaying the write timing (activation and inactivation) in the interior of a memory itself by one clock cycle of an external clock signal. Thus, a write period for second-bit data is ensured in an SDRAM, even if the operation frequency is increased.