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公开(公告)号：US20200168971A1
公开(公告)日：2020-05-28
申请号：US16776033
申请日：2020-01-29
申请人： Hitachi Metals, Ltd.
摘要： A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 μm and 10 μm inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.
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公开(公告)号：US20150152567A1
公开(公告)日：2015-06-04
申请号：US14497709
申请日：2014-09-26
申请人： Hitachi Metals, Ltd.
发明人： Hideyuki SAGAWA , Keisuke FUJITO , Takumi SATO , Hiromitsu KURODA
CPC分类号： C25D7/0614 , C25D5/50 , Y10T428/1266
摘要： A copper foil includes a copper-based metal sheet including mainly a copper, and a surface-treated layer that is provided on the copper-based metal sheet and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper. A total thickness of the copper-based metal sheet and the surface-treated layer is less than 0.55 mm.
摘要翻译： 铜箔包括主要包括铜的铜基金属片和设置在铜基金属片上的表面处理层，并且包括非晶层，其包含氧和具有比铜更高的氧亲和力的金属。 铜基金属片和表面处理层的总厚度小于0.55mm。
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公开(公告)号：US20140205491A1
公开(公告)日：2014-07-24
申请号：US14140615
申请日：2013-12-26
申请人： HITACHI METALS, LTD.
发明人： Keisuke FUJITO , Seigi AOYAMA , Toru SUMI , Hideyuki SAGAWA , Yuju ENDO
摘要： A copper alloy material includes an additional element M including Ti, and a balance having copper and an inevitable impurity. An atomic ratio of the additional element M to oxygen is in a range of 0.33≦M/O≦1.5.
摘要翻译： 铜合金材料包括包含Ti的附加元素M，以及具有铜和不可避免的杂质的余量。 附加元素M与氧的原子比在0.33≤n1E的范围内; M / O和nlE; 1.5。
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公开(公告)号：US20200234855A1
公开(公告)日：2020-07-23
申请号：US16740061
申请日：2020-01-10
申请人： Hitachi Metals, Ltd.
摘要： A cable is composed of a linear shape conductor, a first electrical insulating member coating a periphery of the conductor, a shield made of a plating layer coating a surface of the first electrical insulating member, a second electrical insulating member coating a surface of the shield, and an exposed shield portion provided in at least one end portion of the cable with the second electrical insulating member being removed therefrom and the shield being exposed therein during termination. An adhesion strength between the shield and the second electrical insulating member in the exposed shield portion is lower than an adhesion strength between the shield and the second electrical insulating member in an other part of the surface of the shield.
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公开(公告)号：US20190191601A1
公开(公告)日：2019-06-20
申请号：US16222980
申请日：2018-12-17
申请人： Hitachi Metals, Ltd.
CPC分类号： H05K9/0098 , H01B3/445 , H01B11/002 , H01B13/0036 , H01B13/22 , H01B13/222 , H01B13/26 , H05K9/0088
摘要： A signal transmission cable includes a signal line, an insulation layer covering the signal line, and a shield layer covering the insulation layer. A first oxygen amount A1 on an outer peripheral surface of the insulation layer is 1.2 times or greater than a second oxygen amount A2 inside the insulation layer, or a contact angle on the outer peripheral surface the insulation layer is 130° or less, or an adhesion-wetting surface energy on the outer peripheral surface the insulation layer is 27 mJ/m2 or greater, or a first amount of a hydroxy group on the outer peripheral surface of the insulation layer is greater than a second amount of a hydroxy group inside the insulation layer.
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公开(公告)号：US20150243401A1
公开(公告)日：2015-08-27
申请号：US14597699
申请日：2015-01-15
申请人： Hitachi Metals, Ltd.
发明人： Keisuke FUJITO , Hideyuki SAGAWA , Toru SUMI
IPC分类号： H01B1/02
CPC分类号： H01B1/026 , Y10T428/294 , Y10T428/2942
摘要： A conductor includes a copper alloy including crystal grains. The crystal grains include a first crystal grain group having a grain size larger than a predetermined standard grain size and a second crystal grain group having a grain size smaller than the predetermined standard grain size. The crystal grains have a local maximum value of grain size distribution in each of the first crystal grain group and the second crystal grain group.
摘要翻译： 导体包括含有晶粒的铜合金。 晶粒包括晶粒尺寸大于预定标准晶粒尺寸的第一晶粒组和晶粒尺寸小于预定标准晶粒尺寸的第二晶粒组。 晶粒在第一晶粒组和第二晶粒组各自具有粒度分布的局部最大值。
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公开(公告)号：US20210043338A1
公开(公告)日：2021-02-11
申请号：US17078624
申请日：2020-10-23
申请人： Hitachi Metals, Ltd.
摘要： A high frequency signal transmission cable includes a conductor, an insulator provided over a periphery of the conductor, a plating layer provided over a periphery of the insulator, and a sheath provided over a periphery of the plating layer. A crack suppressing layer includes a non-cross-linked polyethylene is provided between the insulator and the plating layer, in such a manner as to remain in contact with the insulator while being provided with the plating layer over an entire periphery of a roughened outer surface of the crack suppressing layer. The crack suppressing layer is unadhered to the insulator. The plating layer is adhered to the crack suppressing layer. The crack suppressing layer suppresses an occurrence of a cracking in the plating layer by bending together with the plating layer while being integral and moving with the plating layer in a longitudinal direction of the cable.
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8.发明申请公开(公告)号：US20190013560A1
公开(公告)日：2019-01-10
申请号：US16025307
申请日：2018-07-02
申请人： Hitachi Metals, Ltd.
IPC分类号： H01P3/06 , H01P11/00 , H01B13/06 , H01B13/00 , H01B13/016
摘要： A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 μm and 10 μm inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.
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公开(公告)号：US20150262725A1
公开(公告)日：2015-09-17
申请号：US14626336
申请日：2015-02-19
申请人： Hitachi Metals, Ltd.
发明人： Hideyuki SAGAWA , Keisuke FUJITO
CPC分类号： C22C9/00 , B32B1/08 , B32B15/01 , B32B15/043 , B32B15/20 , B32B2255/06 , B32B2255/205 , B32B2307/202 , B32B2457/00 , C22C14/00 , Y10T428/12438 , Y10T428/12806 , Y10T428/12812
摘要： A composite conductor is composed of a core including a titanium or a titanium alloy, a cladding layer including a copper and being provided to clad an outer periphery of the core, and an intermetallic compound layer being formed by diffusions of the titanium or titanium alloy included in the core and the copper included in the cladding layer, and being provided between the core and the cladding layer.
摘要翻译： 复合导体由包括钛或钛合金的芯体，包含铜的包覆层构成并且被设置成包覆芯的外周，并且包括由包含钛或钛合金的扩散形成的金属间化合物层 在包层中包含的芯和铜中，并且设置在芯和包覆层之间。
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公开(公告)号：US20150156870A1
公开(公告)日：2015-06-04
申请号：US14514819
申请日：2014-10-15
申请人： Hitachi Metals, Ltd.
CPC分类号： H05K3/282 , H05K3/06 , H05K3/244 , H05K2201/0341 , H05K2201/0355 , H05K2203/0315 , H05K2203/087 , Y10T29/49162
摘要： A printed circuit board includes a substrate, and a wiring provided on the substrate. The wiring includes a copper-based metal wire provided on the substrate and a surface-treated layer provided on the copper-based metal wire. The copper-based metal wire includes mainly a copper. The surface-treated layer includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than the copper.
摘要翻译： 印刷电路板包括基板和设置在基板上的布线。 布线包括设置在基板上的铜基金属线和设置在铜基金属线上的表面处理层。 铜基金属线主要包括铜。 表面处理层包括包含氧和具有比铜更高的氧亲和力的金属的非晶层。
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