Abstract:
A flat wiring member includes a plurality of rectangular enamel coated wires arranged in the form of a flat plate, a wiring stem portion that the rectangular enamel coated wires are arranged in parallel to each other and adjacent ones of the rectangular enamel coated wires are bonded to each other at a surface of an enamel coat layer thereof, and a wiring branch portion with the rectangular enamel coated wires bent so as to branch off from the wiring stem portion.
Abstract:
A medical braided tube assembly includes a braided tube including a hollow cylindrical inner resin layer, a braided wire including braided strands and being provided over a periphery of the inner resin layer, and an outer resin layer provided to cover peripheries of the inner resin layer and the braided wire, and a connector provided at an end portion of the braided tube. The connector includes a tube housing section for accommodating the end portion of the connector. The braided tube and the connector accommodated in the tube housing section are adhesively fixed by an adhesive. The adhesive is provided to seal an entire periphery of the braided wire at an end face of the braided tube.
Abstract:
A processing method includes processing a metal wire rod using an emulsion lubricant that includes an oil and a nonionic surfactant at an oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio). The method may include purifying the emulsion lubricant after being used for processing the metal wire rod while maintaining the oil-to-nonionic surfactant ratio of 1:0.3 to 0.9 (in mass ratio) and then reusing the purified emulsion lubricant to process the metal wire rod.
Abstract:
A printed circuit board includes a substrate, and a wiring provided on the substrate. The wiring includes a copper-based metal wire provided on the substrate and a surface-treated layer provided on the copper-based metal wire. The copper-based metal wire includes mainly a copper. The surface-treated layer includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than the copper.
Abstract:
A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper.
Abstract:
A wiring material includes conductors, each of which has a cross section having a thickness and a width not less than the thickness, a trunk portion in which the conductors are spaced parallel in a direction of the width thereof, a branch portion in which each conductor is bent and branched from the trunk portion in the direction of the width or in a direction that intersects the direction of the width, and a covering member for covering the trunk portion and the branch portion to expose both ends of the conductors.
Abstract:
A manufacturing method for an electrode terminal connection body includes applying a press processing to a plate member formed of the same kind of metal as a metal of a positive electrode terminal so as to form a mounting hole, slicing a covered metal rod more thickly than the plate member so as to form a covered metal member, the covered metal rod being configured to include an interposing layer formed of a metal that has an ionization tendency between the metal of the positive electrode terminal and the metal of a negative electrode terminal in the outer periphery of a metal rod formed of the same kind of metal as a metal of the negative electrode terminal and to have a diameter smaller than the mounting hole, and inserting the covered metal member into the inside of the mounting hole and simultaneously crushing the covered metal member.