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18 条记录 (耗时 0.017 秒)

    Method and an apparatus for polishing wafer chamfers
    8.
    发明授权
    Method and an apparatus for polishing wafer chamfers 失效
    抛光晶圆倒角的方法和装置

    公开(公告)号：US5316620A

    公开(公告)日：1994-05-31

    申请号：US7888

    申请日：1993-01-22

    申请人： Fumihiko Hasegawa ,  Tatsuo Ohtani ,  Hiroshi Kawano ,  Masayuki Yamada

    发明人： Fumihiko Hasegawa ,  Tatsuo Ohtani ,  Hiroshi Kawano ,  Masayuki Yamada

    IPC分类号： B24B9/00 ,  B24B9/06 ,  H01L21/304 ,  H01L21/306 ,  B44C1/22 ,  H01L21/463

    CPC分类号： H01L21/02021 ,  B24B9/065 ,  Y10S438/959

    摘要： A method for polishing peripheral chamfers of a semiconductor wafer comprising steps of: (a) turning a cylindrical cup-like rotatory buff having an internal polish groove formed in the inner wall surface thereof, the groove having a profile complementary to the profile of the chamfered wafer edge to be polished; (b) disposing the wafer inside the turning buff; (c) turning the wafer at a relatively low rate; and (d) pressing the wafer edge into the running internal polish groove with an appropriate pressure; furthermore there is proposed an apparatus for this novel method including the cylindrical cup-like rotatory buff as described above.

    摘要翻译： 一种用于抛光半导体晶片的周边倒角的方法，包括以下步骤：（a）转动在其内壁表面中形成有内部抛光槽的圆柱形杯状旋转抛光器，所述凹槽具有与倒角的轮廓互补的轮廓 晶圆边缘要抛光; （b）将晶片放置在转动抛光器内; （c）以相对较低的速率转动晶片; 和（d）以适当的压力将晶片边缘压入行进的内部抛光槽; 此外，提出了一种用于这种新方法的装置，其包括如上所述的圆柱形杯状旋转抛光器。

    Method and apparatus for wafer chamfer polishing
    9.
    发明授权
    Method and apparatus for wafer chamfer polishing 失效
    晶圆倒角抛光方法及装置

    公开(公告)号：US5547415A

    公开(公告)日：1996-08-20

    申请号：US72741

    申请日：1993-06-07

    申请人： Fumihiko Hasegawa ,  Tatsuo Ohtani ,  Yasuyoshi Kuroda

    发明人： Fumihiko Hasegawa ,  Tatsuo Ohtani ,  Yasuyoshi Kuroda

    IPC分类号： H01L21/304 ,  B24B9/00 ,  B24B9/06 ,  B24B37/00 ,  B24B41/00 ,  B24B41/06

    CPC分类号： B24B9/065 ,  B24B37/00 ,  B24B41/005

    摘要： A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.

    摘要翻译： 一种沿周边抛光倒角的方法和装置; 半导体晶片被设计成使得当晶片被传送机器人臂的旋转吸盘拾取时，晶片不会从吸盘释放直到整个抛光操作完成; 在一个实施例中，使用具有六个晶片吸盘的圆形转台，其适于逐步转动，每个步骤包括60°的转角，以转移晶片。

    Apparatus for polishing notch portion of wafer
    10.
    发明授权
    Apparatus for polishing notch portion of wafer 失效
    用于抛光晶片的切口部分的装置

    公开(公告)号：US5458529A

    公开(公告)日：1995-10-17

    申请号：US249933

    申请日：1994-05-26

    申请人： Fumihiko Hasegawa ,  Tatsuo Ohtani ,  Koichiro Ichikawa ,  Yoshio Nakamura

    发明人： Fumihiko Hasegawa ,  Tatsuo Ohtani ,  Koichiro Ichikawa ,  Yoshio Nakamura

    IPC分类号： B24B29/00 ,  B24B9/00 ,  B24B9/06 ,  B24B29/02 ,  H01L21/304 ,  B24B7/00

    CPC分类号： B24B9/065

    摘要： A polishing apparatus which can effectively polish a bottom wall of a wafer in the notch portion is disclosed. The polishing apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a movable linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member such as a pulse motor for turning the rotary buff around a predetermined axis so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.

    摘要翻译： 公开了一种可以有效地抛光切口部分中的晶片底壁的抛光装置。 抛光装置包括：用于在其上支撑晶片的工作台; 旋转抛光器，其厚度使得其周边可以进入晶片的切口部分，并且围绕与支撑在工作台上的晶片的表面的平面平行的轴线旋转; 第一旋转构件，例如用于旋转旋转抛光器的马达; 用于支撑旋转抛光器的可移动连杆; 调节构件，例如用于调节从旋转抛光器施加到切口部分中的晶片的底壁的压力的气缸装置; 以及第二旋转构件，例如脉冲电机，用于围绕预定轴线旋转旋转抛光器，使得来自旋转抛光器的施加压力在大致垂直于切割部分的表面的方向上作用在切口部分中的晶片的底壁上 底壁。