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    METHODS AND APPARATUS FOR ACTIVE SUBSTRATE PRECESSION DURING CHEMICAL MECHANICAL POLISHING
    2.
    发明申请
    METHODS AND APPARATUS FOR ACTIVE SUBSTRATE PRECESSION DURING CHEMICAL MECHANICAL POLISHING 审中-公开
    化学机械抛光期间主动基板预处理的方法与装置

    公开(公告)号：US20130288577A1

    公开(公告)日：2013-10-31

    申请号：US13459075

    申请日：2012-04-27

    申请人： Hung Chen ,  Lakshmanan Karuppiah

    发明人： Hung Chen ,  Lakshmanan Karuppiah

    IPC分类号： B24B47/10 ,  B24B1/00 ,  B24B37/32

    CPC分类号： B24B37/32 ,  B24B47/10

    摘要： In some aspects, a chemical mechanical polishing (CMP) apparatus is provided that includes a polishing head having (a) a rotatable spindle; (b) a membrane coupled to the rotatable spindle and adapted to press a substrate against a polishing pad during polishing of the substrate; and (c) a retaining ring rotatable coupled to the spindle and adapted to surround a substrate being pressed against a polishing pad during polishing and to limit lateral movement of the substrate relative to the polishing head. The CMP apparatus also includes a drive mechanism coupled to the retaining ring and adapted to drive the retaining ring at a different rate of rotation than the spindle during polishing. Numerous other aspects are provided.

    摘要翻译： 在一些方面，提供了一种化学机械抛光（CMP）装置，其包括具有（a）可旋转主轴的抛光头; （b）膜，其耦合到所述可旋转心轴并适于在衬底的抛光期间将衬底压靠在抛光垫上; 和（c）保持环，其可旋转地联接到所述心轴并且适于围绕在抛光期间被压靠在抛光垫上的衬底并且限制所述衬底相对于所述抛光头的横向运动。 CMP设备还包括联接到保持环的驱动机构，并且适于在抛光期间以与主轴不同的旋转速度驱动保持环。 提供了许多其他方面。

    SYSTEMS AND METHODS FOR SUBSTRATE POLISHING END POINT DETECTION USING IMPROVED FRICTION MEASUREMENT
    3.
    发明申请
    SYSTEMS AND METHODS FOR SUBSTRATE POLISHING END POINT DETECTION USING IMPROVED FRICTION MEASUREMENT 有权
    使用改进的摩擦测量的基板抛光端点检测的系统和方法

    公开(公告)号：US20130122782A1

    公开(公告)日：2013-05-16

    申请号：US13459071

    申请日：2012-04-27

    申请人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

    发明人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

    IPC分类号： B24B49/16

    CPC分类号： B24B37/013 ,  B24B49/16

    摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

    摘要翻译： 提供了用于抛光衬底的方法，装置和系统。 本发明包括上压板; 耦合到上压板的扭矩/应变测量仪器; 以及耦合到扭矩/应变测量仪器并适于驱动上压板旋转通过扭矩/应变测量仪器的下压板。 在其他实施例中，本发明包括一个上部托架; 耦合到上部托架的侧向力测量仪器; 以及耦合到所述侧向力测量仪器并适于支撑抛光头的下托架。 公开了许多附加方面。

    Feedback Control Using Detection Of Clearance And Adjustment For Uniform Topography
    6.
    发明申请
    Feedback Control Using Detection Of Clearance And Adjustment For Uniform Topography 有权
    反馈控制使用检测的均匀地形的清除和调整

    公开(公告)号：US20130224890A1

    公开(公告)日：2013-08-29

    申请号：US13774843

    申请日：2013-02-22

    申请人： Kun Xu ,  Ingemar Carlsson ,  Tzu-Yu Liu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

    发明人： Kun Xu ,  Ingemar Carlsson ,  Tzu-Yu Liu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

    IPC分类号： H01L21/66

    CPC分类号： H01L22/26 ,  B24B37/005 ,  B24B37/04 ,  B24B49/12 ,  H01L22/12

    摘要： A method of controlling polishing includes storing a desired ratio representing a ratio for a clearance time of a first zone of a substrate to a clearance time of a second zone of the substrate. During polishing of a first substrate, an overlying layer is monitored, a sequence of measurements is generated, and the measurements are sorted a first group associated with the first zone of the substrate and a second group associated with the second zone on the substrate. A first time and a second time at which the overlying layer is cleared is determined based on the measurements from the first group and the second group, respectively. At least one adjusted polishing pressure is calculated for the first zone based on a first pressure applied in the first zone during polishing the first substrate, the first time, the second time, and the desired ratio.

    摘要翻译： 控制抛光的方法包括将表示基材的第一区域的间隙时间的比率与基材的第二区域的间隙时间的所需比率进行存储。 在第一衬底的抛光期间，监测上覆层，产生一系列测量，并且对与衬底的第一区域相关联的第一组和与衬底上的第二区域相关联的第二组对第一组进行测量。 基于来自第一组和第二组的测量，分别确定覆盖层被清除的第一次和第二次。 基于在抛光第一基板期间第一区域中施加的第一压力，第一时间，第二时间和期望比率，针对第一区域计算至少一个调整的抛光压力。

    CLEANING MODULE AND PROCESS FOR PARTICLE REDUCTION
    7.
    发明申请
    CLEANING MODULE AND PROCESS FOR PARTICLE REDUCTION 审中-公开
    清洁模块和减少颗粒过程

    公开(公告)号：US20130185884A1

    公开(公告)日：2013-07-25

    申请号：US13749116

    申请日：2013-01-24

    申请人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    发明人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    IPC分类号： B08B1/00

    CPC分类号： B08B1/006 ,  B08B1/04 ,  H01L21/67046 ,  H01L21/67051

    摘要： A method and apparatus for cleaning a substrate are provided. In one embodiment, a particle cleaning module is provided that includes a substrate holder and a pad holder disposed in a housing, and an actuator operable to move the pad holder relative to the substrate holder. The substrate holder is configured to retain and rotate a substrate in a substantially vertical orientation. The pad holder has a pad retaining surface that faces the substrate holder in a parallel and spaced apart relation. The pad holder is rotatable on an axis parallel to an axis on which the substrate holder rotates. The actuator is operable to move the pad holder relative to the substrate holder as to change a distance defined between the first axis and the second axis.

    摘要翻译： 提供了一种用于清洁基板的方法和装置。 在一个实施例中，提供了一种颗粒清洁模块，其包括衬底保持器和设置在壳体中的衬垫保持器，以及可操作以相对于衬底保持器移动衬垫保持器的致动器。 衬底保持器被构造成以基本垂直的方向保持和旋转衬底。 焊盘保持器具有以平行和间隔的关系面对衬底保持器的焊盘保持表面。 衬垫支架可以在平行于衬底支架旋转的轴线的轴线上旋转。 致动器可操作以相对于基板保持器移动焊盘保持器，以改变限定在第一轴线和第二轴线之间的距离。

    BRUSH BOX MODULE FOR CHEMICAL MECHANICAL POLISHING CLEANER
    8.
    发明申请
    BRUSH BOX MODULE FOR CHEMICAL MECHANICAL POLISHING CLEANER 审中-公开
    用于化学机械抛光清洁剂的刷盒

    公开(公告)号：US20130111678A1

    公开(公告)日：2013-05-09

    申请号：US13291945

    申请日：2011-11-08

    申请人： Hui Chen ,  Allen L. D'Ambra ,  Lakshmanan Karuppiah ,  Thomas H. Osterheld

    发明人： Hui Chen ,  Allen L. D'Ambra ,  Lakshmanan Karuppiah ,  Thomas H. Osterheld

    IPC分类号： H01L21/02 ,  A46B13/00

    CPC分类号： H01L21/67046

    摘要： Embodiments of the invention generally relate to a method and apparatus for cleaning a substrate. Particularly, embodiments of the invention relate to an apparatus and method for cleaning a substrate using a scrub brush. One embodiment provides a brush box assembly for cleaning a substrate. The assembly comprises a chamber body having a cleaning chamber disposed therein, a rotatable chuck disposed in the cleaning chamber, and an edge cleaner module positioned adjacent the chuck.

    摘要翻译： 本发明的实施例一般涉及一种用于清洁衬底的方法和装置。 特别地，本发明的实施例涉及一种使用擦洗刷清洁衬底的装置和方法。 一个实施例提供了一种用于清洁基底的刷盒组件。 该组件包括一个室主体，其具有设置在其中的清洁室，设置在清洁室中的可旋转卡盘以及邻近卡盘定位的边缘清洁器模块。

    Roller assembly for a brush cleaning device in a cleaning module
    9.
    发明授权
    Roller assembly for a brush cleaning device in a cleaning module 有权
    用于清洁模块中的刷清洁装置的辊组件

    公开(公告)号：US08250695B2

    公开(公告)日：2012-08-28

    申请号：US12573500

    申请日：2009-10-05

    申请人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

    发明人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

    IPC分类号： A47L25/00

    CPC分类号： B08B1/04

    摘要： Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.

    摘要翻译： 本文所述的实施例涉及可用于刷清洁模块中的用于辊组件的装置和方法。 在一个实施例中，描述了辊组件。 辊组件包括具有至少两个基本上平行的相对侧壁的环形凹槽，所述至少两个基本上平行的相对侧壁适于沿着衬底的周边接触衬底的主表面，每个相对的侧壁包括具有预压缩尺寸小于 衬底的周边的厚度。

    Determining Physical Property of Substrate
    10.
    发明申请
    Determining Physical Property of Substrate 审中-公开
    确定基材的物理性质

    公开(公告)号：US20110294400A1

    公开(公告)日：2011-12-01

    申请号：US13193011

    申请日：2011-07-28

    申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    IPC分类号： B24B51/00

    CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

    摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

    摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。