摘要:
A semiconductor device comprising a barrier insulating layer and a related method of fabrication is disclosed. The semiconductor device semiconductor substrate includes a plurality of active regions, wherein active regions are defined by a device isolation layer and are disposed along a first direction; a plurality of bit line electrodes connected to the active regions, wherein each of the bit line electrodes extends along a second direction; and a plurality of first barrier insulating layers. Each of the first barrier insulating layers extends along a third direction, at least one of the first barrier insulating layers is disposed on a corresponding first portion of the device isolation layer disposed between two of the active regions, the two of the active regions are adjacent along the first direction, and the first direction and the second direction differ from one another.
摘要:
A semiconductor device may include a semiconductor layer having a convex portion and a concave portion surrounding the convex portion. The semiconductor device may further include a protrusion type isolation layer filling the concave portion and extending upward so that an uppermost surface of the isolation layer is a at level higher that an uppermost surface of the convex portion.
摘要:
A semiconductor device may include a semiconductor layer having a convex portion and a concave portion surrounding the convex portion. The semiconductor device may further include a protrusion type isolation layer filling the concave portion and extending upward so that an uppermost surface of the isolation layer is a at level higher that an uppermost surface of the convex portion.
摘要:
A method of fabricating a semiconductor device which prevents a pitting phenomenon from occurring on a gate insulating layer is provided. The method of fabricating of a semiconductor device according to the present invention comprises: depositing a first gate material including at least a gate insulating layer and a first metal layer in a first region on a semiconductor substrate; depositing a second gate material layer including at least a gate insulating layer and a polysilicon layer in a second region on the semiconductor substrate; forming a hard mask pattern on the first gate material layer and on the second gate material layer; and forming a first gate pattern and a second gate pattern by etching the first gate material layer and the second gate material layer, using the hard mask pattern as a mask, wherein the step of forming the first gate pattern and the second gate pattern comprises dry etching the first metal layer and the polysilicon layer simultaneously using a first etching gas composition including both CF4 and CH4, such that when the first metal layer is completely etched, a polysilicon layer of at least a predetermined minimum protective thickness remains covering the underlying gate insulating layer. The etch rate of the first metal layer to the etch rate of polysilicon can be relatively increased by the method of this invention, and, as a result, a gate pattern with high density can be effectively formed.
摘要:
A shower head for adjusting distribution of a reactant gas in a process region of a semiconductor manufacturing reaction chamber, wherein a top plate has a gas port for introducing the reactant gas into the reaction chamber; a face plate, having through holes, disposed opposite the process region; a first baffle plate, having through holes, disposed between the top plate and the face plate and capable of moving up or down, wherein the first baffle plate has a top surface that defines a first gap for forming a first lateral flow passage; a second baffle plate, having through holes, disposed between the first baffle plate and the face plate and capable of moving up or down, wherein the second baffle plate has a top surface that defines a second gap for forming a second lateral flow passage; and a gap controller for determining widths of the first and second gaps.
摘要:
A semiconductor device and a method of forming patterns on a semiconductor device are disclosed. The semiconductor device may include high-density patterns with a minimum size that may be less the resolution limit of a photolithography process, and may have a substrate including a memory cell region and an adjacent connection region, a plurality of first conductive lines extending from the memory cell region to the connection region in a first direction, a plurality of second conductive lines connected from respective first conductive lines to a plurality of pads having a width equal to twice the width of each of the first conductive lines. The method may include two levels of spacer formation to provide sub resolution line widths and spaces as well as selected multiples of the minimum line widths and spaces.
摘要:
A semiconductor device may include a semiconductor layer having a convex portion and a concave portion surrounding the convex portion. The semiconductor device may further include a protrusion type isolation layer filling the concave portion and extending upward so that an uppermost surface of the isolation layer is a at level higher that an uppermost surface of the convex portion.
摘要:
A module-type fuel cell system including a power module includes a generator installed inside and a power housing having a plurality of connection holes formed sideward, wherein the generator generates electricity through an oxidation-reduction reaction of an oxidizing agent with a hydrogen-containing fuel; a fuel supply module including a fuel supply unit installed inside and a power housing having a plurality of connection holes formed sideward, wherein the fuel supply unit supplies a hydrogen-containing fuel to the generator; an oxidizing agent supply module including an oxidizing agent supply unit installed inside and an oxidizing agent supply housing having connection holes formed sideward, wherein the oxidizing agent supply unit supplies an oxidizing agent to the generator; and a recovery module including a storage space formed therein and a recovery housing having a plurality of connection holes formed sideward, wherein the storage space recovers an unreacted fuel generated in the generator, wherein the power module is closely attached and assembled in one side of the recovery module in a surface-to-surface contact manner, and the fuel supply module and the oxidizing agent supply module are closely attached and assembled in the other side of the recovery module in a surface-to-surface contact manner.
摘要:
Provided are a semiconductor device and a method of forming a semiconductor device in which a plurality of patterns are simultaneously formed to have different widths and the pattern densities of some regions are increased using a double patterning. The semiconductor device includes a plurality of conductive lines each including a first line portion and a second line portion, where the first line portion extends on a substrate in a first direction, the second line portion extends from one end of the first line portion in a second direction different from the first direction; a plurality of contact pads each of which is connected with a respective conductive line of the plurality of conductive lines and a respective second line portion of a respective conductive line of the plurality of conductive lines; and a plurality of dummy conductive lines each including a first dummy portion extending from a respective contact pad of the plurality of contact pads, in parallel with the corresponding second line portion in the second direction.
摘要:
A module-type fuel cell system including a power module includes a generator installed inside and a power housing having a plurality of connection holes formed sideward, wherein the generator generates electricity through an oxidation-reduction reaction of an oxidizing agent with a hydrogen-containing fuel; a fuel supply module including a fuel supply unit installed inside and a power housing having a plurality of connection holes formed sideward, wherein the fuel supply unit supplies a hydrogen-containing fuel to the generator; an oxidizing agent supply module including an oxidizing agent supply unit installed inside and an oxidizing agent supply housing having connection holes formed sideward, wherein the oxidizing agent supply unit supplies an oxidizing agent to the generator; and a recovery module including a storage space formed therein and a recovery housing having a plurality of connection holes formed sideward, wherein the storage space recovers an unreacted fuel generated in the generator, wherein the power module is closely attached and assembled in one side of the recovery module in a surface-to-surface contact manner, and the fuel supply module and the oxidizing agent supply module are closely attached and assembled in the other side of the recovery module in a surface-to-surface contact manner.