摘要:
A lead frame unit, a semiconductor package having a lead frame unit, a stacked semiconductor package having a semiconductor package, and methods of manufacturing the same are provided. The lead frame unit in a stacked semiconductor package may include a die pad supporting a semiconductor chip, an inner lead electrically connected to the semiconductor chip, an outer lead extending from the inner lead, and a heat-resistant insulation member surrounding the connection portion. The outer lead may include a connection portion connected to the inner lead and a junction portion connected to the connection portion and a circuit board. An external signal may be applied to the junction portion. If the lead frame unit is used in the stacked semiconductor package, the outer lead and a dummy outer lead in the stacked semiconductor package may have substantially the same shape.
摘要:
A lead frame unit, a semiconductor package having a lead frame unit, a stacked semiconductor package having a semiconductor package, and methods of manufacturing the same are provided. The lead frame unit in a stacked semiconductor package may include a die pad supporting a semiconductor chip, an inner lead electrically connected to the semiconductor chip, an outer lead extending from the inner lead, and a heat-resistant insulation member surrounding the connection portion. The outer lead may include a connection portion connected to the inner lead and a junction portion connected to the connection portion and a circuit board. An external signal may be applied to the junction portion. If the lead frame unit is used in the stacked semiconductor package, the outer lead and a dummy outer lead in the stacked semiconductor package may have substantially the same shape.
摘要:
Exposed are a semiconductor device and method of fabricating the same. The device includes an insulation film that is disposed between an active pattern and a substrate, which provides various improvements. This structure enhances the efficiency of high integration and offers an advanced structure for semiconductor devices.
摘要:
In a method of manufacturing a semiconductor device including a planar type transistor and a fin type transistor, a substrate having a first region and a second region is partially to form an isolation trench defining an isolation region and an active region. An insulation layer liner is formed on sidewalls of the isolation trench in the first region and the second region. An isolation layer fills an inner portion of the isolation trench. The insulation layer liner is partially removed to expose an upper surface of the substrate in the gate region of the first region, and an upper surface and sidewalls of the substrate in the gate region of the second region. A gate oxide layer and a gate electrode are formed on the exposed substrate.
摘要:
A example embodiment may provide a memory device that may include an active pattern on a semiconductor substrate, a first charge trapping layer pattern on the active pattern, a first gate electrode on the first charge trapping layer pattern, a second charge trapping layer pattern on a sidewall of the active pattern in a first direction, a second gate electrode on the second charge trapping layer pattern in the first direction, and/or a source/drain region in the active pattern. The memory device may have improved integration by forming a plurality of charge trapping layer patterns on the same active pattern.
摘要:
A system for detecting a mis-connected state between communication lines for a multi-type air conditioner and a method thereof. The system comprises an indoor unit pipe temperature detection unit for detecting a temperature of an indoor unit pipe, and a microprocessor for controlling an opening of an electronic expansion valve based on a temperature detected by the indoor unit pipe temperature detection unit, comparing a temperature response characteristic of the indoor unit pipe with a preset temperature response characteristic of a normal indoor unit pipe based on an opening of the electronic expansion valve, and thereby judging whether the communication lines are mis-connected to one another or not. An indoor unit from which the mis-connection has been generated is fast detected, and error information is displayed. Accordingly, the mis-connected state between the communication lines is restored, thereby preventing a damage of the system due to the mis-connection.
摘要:
Disclosed is a display device including a thin film transistor. A method for forming the display device includes forming an organic semiconductor pattern in the presence of a magnetic field or an electric field. Due to the presence of a magnetic field or an electric field, the molecules of the organic semiconductor layer of the thin film transistor are substantially aligned in a predetermined direction.
摘要:
A system for detecting a mis-connected state between communication lines for a multi-type air conditioner and a method thereof. The system comprises an indoor unit pipe temperature detection unit for detecting a temperature of an indoor unit pipe, and a microprocessor for controlling an opening of an electronic expansion valve based on a temperature detected by the indoor unit pipe temperature detection unit, comparing a temperature response characteristic of the indoor unit pipe with a preset temperature response characteristic of a normal indoor unit pipe based on an opening of the electronic expansion valve, and thereby judging whether the communication lines are mis-connected to one another or not. An indoor unit from which the mis-connection has been generated is fast detected, and error information is displayed. Accordingly, the mis-connected state between the communication lines is restored, thereby preventing a damage of the system due to the mis-connection.
摘要:
A pump-type cosmetics container is not subject to the risk of a foreign substance entering into a nozzle, due to a moving path through which content is discharged during use that is selectively open by means of an opening/closing bracket, and to the risk of change in quality of the content inside the moving path, by means of a counteraction of a control protrusion pressing a locking protrusion thereby re-aspirating the content remaining inside the moving path, after pumping using a double spring.